JP2004513221A - 銅シード層の異常を克服し表面形状サイズ及びアスペクト比を調整する方法と装置 - Google Patents

銅シード層の異常を克服し表面形状サイズ及びアスペクト比を調整する方法と装置 Download PDF

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Publication number
JP2004513221A
JP2004513221A JP2001586638A JP2001586638A JP2004513221A JP 2004513221 A JP2004513221 A JP 2004513221A JP 2001586638 A JP2001586638 A JP 2001586638A JP 2001586638 A JP2001586638 A JP 2001586638A JP 2004513221 A JP2004513221 A JP 2004513221A
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JP
Japan
Prior art keywords
substrate
conductive material
layer
seconds
aspect ratio
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Withdrawn
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JP2001586638A
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English (en)
Japanese (ja)
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JP2004513221A5 (https=
Inventor
ヘイ，　ピーター
ワック，　ヤン−サン，　レオ
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2004513221A publication Critical patent/JP2004513221A/ja
Publication of JP2004513221A5 publication Critical patent/JP2004513221A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/041—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being discontinuous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/042—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers
    • H10W20/043—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers for electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/042—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers
    • H10W20/0425—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers comprising multiple stacked seed or nucleation layers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2001586638A 2000-05-23 2001-05-10 銅シード層の異常を克服し表面形状サイズ及びアスペクト比を調整する方法と装置 Withdrawn JP2004513221A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20650000P 2000-05-23 2000-05-23
PCT/US2001/015200 WO2001090446A2 (en) 2000-05-23 2001-05-10 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio

Publications (2)

Publication Number Publication Date
JP2004513221A true JP2004513221A (ja) 2004-04-30
JP2004513221A5 JP2004513221A5 (https=) 2005-06-02

Family

ID=22766672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001586638A Withdrawn JP2004513221A (ja) 2000-05-23 2001-05-10 銅シード層の異常を克服し表面形状サイズ及びアスペクト比を調整する方法と装置

Country Status (5)

Country Link
US (1) US6808612B2 (https=)
EP (1) EP1337693A2 (https=)
JP (1) JP2004513221A (https=)
TW (1) TW492078B (https=)
WO (1) WO2001090446A2 (https=)

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US20160102416A1 (en) * 2013-01-29 2016-04-14 Novellus Systems, Inc. Low copper/high halide electroplating solutions for fill and defect control
US10214826B2 (en) * 2013-01-29 2019-02-26 Novellus Systems, Inc. Low copper electroplating solutions for fill and defect control
KR101290670B1 (ko) * 2013-06-03 2013-07-29 구본술 도금 신뢰성 향상 기능을 갖는 내장형 안테나 제조방법
US9496145B2 (en) 2014-03-19 2016-11-15 Applied Materials, Inc. Electrochemical plating methods
US10154598B2 (en) 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
US9758896B2 (en) 2015-02-12 2017-09-12 Applied Materials, Inc. Forming cobalt interconnections on a substrate
US20160309596A1 (en) * 2015-04-15 2016-10-20 Applied Materials, Inc. Methods for forming cobalt interconnects
US12012667B2 (en) 2018-04-09 2024-06-18 Lam Research Corporation Copper electrofill on non-copper liner layers
US11203816B1 (en) * 2020-10-23 2021-12-21 Applied Materials, Inc. Electroplating seed layer buildup and repair

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Also Published As

Publication number Publication date
WO2001090446A2 (en) 2001-11-29
EP1337693A2 (en) 2003-08-27
TW492078B (en) 2002-06-21
US6808612B2 (en) 2004-10-26
WO2001090446A3 (en) 2003-06-12
US20020011415A1 (en) 2002-01-31

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