JP2004504455A5 - - Google Patents
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- Publication number
- JP2004504455A5 JP2004504455A5 JP2002514210A JP2002514210A JP2004504455A5 JP 2004504455 A5 JP2004504455 A5 JP 2004504455A5 JP 2002514210 A JP2002514210 A JP 2002514210A JP 2002514210 A JP2002514210 A JP 2002514210A JP 2004504455 A5 JP2004504455 A5 JP 2004504455A5
- Authority
- JP
- Japan
- Prior art keywords
- aryl
- arylene ether
- polymer
- branched
- triple bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 125000003118 aryl group Chemical group 0.000 description 50
- -1 arylene ether Chemical compound 0.000 description 25
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 22
- 229920000642 polymer Polymers 0.000 description 19
- 238000000034 method Methods 0.000 description 15
- 239000000178 monomer Substances 0.000 description 12
- 229920001187 thermosetting polymer Polymers 0.000 description 12
- 0 Cc(cc1)ccc1Oc(cc1)ccc1-c(c(-c(cc1)ccc1Oc1ccc(*)cc1)c1C2C=CC(Oc3ccc(*c4ccc(*c5ccccc5)cc4)cc3)=CC2)c(-c(cc2)ccc2Oc2ccc(*c3ccc(*c4ccccc4)cc3)cc2)c(-c(cc2)ccc2Oc2ccc(*c3ccc([*+]c4ccccc4)cc3)cc2)c1-c(cc1)ccc1Oc1ccc(*C*c2ccc(*Ic3ccccc3)cc2)cc1 Chemical compound Cc(cc1)ccc1Oc(cc1)ccc1-c(c(-c(cc1)ccc1Oc1ccc(*)cc1)c1C2C=CC(Oc3ccc(*c4ccc(*c5ccccc5)cc4)cc3)=CC2)c(-c(cc2)ccc2Oc2ccc(*c3ccc(*c4ccccc4)cc3)cc2)c(-c(cc2)ccc2Oc2ccc(*c3ccc([*+]c4ccccc4)cc3)cc2)c1-c(cc1)ccc1Oc1ccc(*C*c2ccc(*Ic3ccccc3)cc2)cc1 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 239000003989 dielectric material Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- ZICQBHNGXDOVJF-UHFFFAOYSA-N diamantane Chemical compound C1C2C3CC(C4)CC2C2C4C3CC1C2 ZICQBHNGXDOVJF-UHFFFAOYSA-N 0.000 description 4
- 238000010348 incorporation Methods 0.000 description 4
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 3
- 229910003472 fullerene Inorganic materials 0.000 description 3
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- AUGHUKDKQHBACF-UHFFFAOYSA-N Cc1ccc([CH2+])cc1 Chemical compound Cc1ccc([CH2+])cc1 AUGHUKDKQHBACF-UHFFFAOYSA-N 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Cc1ccccc1 Chemical compound Cc1ccccc1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/618,945 US6469123B1 (en) | 2000-07-19 | 2000-07-19 | Compositions and methods for thermosetting molecules in organic compositions |
| US09/897,936 US20020022708A1 (en) | 2000-07-19 | 2001-07-05 | Compositions and methods for thermosetting molecules in organic compositions |
| PCT/US2001/022204 WO2002008308A1 (en) | 2000-07-19 | 2001-07-13 | Compositions and methods for thermosetting molecules in organic compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004504455A JP2004504455A (ja) | 2004-02-12 |
| JP2004504455A5 true JP2004504455A5 (OSRAM) | 2008-08-21 |
Family
ID=27088367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002514210A Withdrawn JP2004504455A (ja) | 2000-07-19 | 2001-07-13 | 有機組成物における熱硬化性分子の組成物および方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US20020022708A1 (OSRAM) |
| EP (1) | EP1309639A4 (OSRAM) |
| JP (1) | JP2004504455A (OSRAM) |
| KR (1) | KR100620207B1 (OSRAM) |
| CN (1) | CN1458945A (OSRAM) |
| AU (1) | AU2001280549A1 (OSRAM) |
| MY (1) | MY134260A (OSRAM) |
| TW (1) | TWI241310B (OSRAM) |
| WO (1) | WO2002008308A1 (OSRAM) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6987147B2 (en) * | 2001-10-01 | 2006-01-17 | Honeywell International Inc. | Low dielectric constant materials with improved thermo-mechanical strength and processability |
| US20030143332A1 (en) * | 2002-01-31 | 2003-07-31 | Sumitomo Chemical Company, Limited | Coating solution for forming insulating film |
| JP4878779B2 (ja) | 2004-06-10 | 2012-02-15 | 富士フイルム株式会社 | 膜形成用組成物、絶縁膜及び電子デバイス |
| JP4516857B2 (ja) * | 2005-02-28 | 2010-08-04 | 富士フイルム株式会社 | カゴ構造を有する重合体、それを含む膜形成用組成物、絶縁膜および電子デバイス |
| JP2007119706A (ja) * | 2005-09-28 | 2007-05-17 | Fujifilm Corp | 重合体および膜形成用組成物 |
| JP4792282B2 (ja) * | 2005-12-09 | 2011-10-12 | 富士フイルム株式会社 | 重合体および膜形成用組成物 |
| JP2007161780A (ja) * | 2005-12-09 | 2007-06-28 | Fujifilm Corp | 膜形成用組成物、該組成物を用いた絶縁膜及び電子デバイス |
| US7558186B2 (en) * | 2007-01-02 | 2009-07-07 | International Business Machines Corporation | High density data storage medium, method and device |
| US20080159114A1 (en) * | 2007-01-02 | 2008-07-03 | Dipietro Richard Anthony | High density data storage medium, method and device |
| JP2008192879A (ja) | 2007-02-06 | 2008-08-21 | Fujifilm Corp | 半導体集積回路の絶縁膜 |
| JP2008231174A (ja) * | 2007-03-19 | 2008-10-02 | Fujifilm Corp | 膜形成用組成物、絶縁膜及び電子デバイス |
| GB2451865A (en) * | 2007-08-15 | 2009-02-18 | Univ Liverpool | Microporous polymers from alkynyl monomers |
| JP5012372B2 (ja) * | 2007-09-27 | 2012-08-29 | 住友ベークライト株式会社 | 有機絶縁膜及び半導体装置 |
| US7799843B2 (en) | 2008-02-29 | 2010-09-21 | Fujifilm Corporation | Film |
| JP5404772B2 (ja) * | 2008-04-28 | 2014-02-05 | ビーエーエスエフ ソシエタス・ヨーロピア | ツイン重合によって得られるＬｏｗ−ｋ誘電体 |
| JP5401118B2 (ja) | 2008-12-10 | 2014-01-29 | 富士フイルム株式会社 | 組成物 |
| JP6666138B2 (ja) | 2015-12-24 | 2020-03-13 | エア・ウォーター株式会社 | 多価アルキン化合物、その製法および用途 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918158A (en) * | 1986-07-21 | 1990-04-17 | Fluorochem Inc. | 1,3-diethynyladamantane and methods of polymerization thereof |
| US5017734A (en) * | 1989-12-11 | 1991-05-21 | Kurt Baum | Ethynyl adamantane derivatives and methods of polymerization thereof |
| JPH04314394A (ja) | 1991-04-12 | 1992-11-05 | Fujitsu Ltd | ガラスセラミック回路基板とその製造方法 |
| US5347063A (en) | 1993-03-09 | 1994-09-13 | Mobil Oil Corporation | Method for direct arylation of diamondoids |
| US5576355A (en) * | 1993-06-04 | 1996-11-19 | Mobil Oil Corp. | Diamondoid derivatives for pharmaceutical use |
| US5744399A (en) | 1995-11-13 | 1998-04-28 | Lsi Logic Corporation | Process for forming low dielectric constant layers using fullerenes |
| JP2002530505A (ja) * | 1998-11-24 | 2002-09-17 | ザ ダウ ケミカル カンパニー | 架橋性マトリックス前駆体および気孔発生体を含有する組成物、並びにそれから製造された多孔質マトリックス |
| US6413202B1 (en) * | 1999-01-21 | 2002-07-02 | Alliedsignal, Inc. | Solvent systems for polymeric dielectric materials |
| US6509415B1 (en) * | 2000-04-07 | 2003-01-21 | Honeywell International Inc. | Low dielectric constant organic dielectrics based on cage-like structures |
| US6444715B1 (en) * | 2000-06-06 | 2002-09-03 | Honeywell International Inc. | Low dielectric materials and methods of producing same |
| US6469123B1 (en) * | 2000-07-19 | 2002-10-22 | Honeywell International Inc. | Compositions and methods for thermosetting molecules in organic compositions |
| US6423811B1 (en) * | 2000-07-19 | 2002-07-23 | Honeywell International Inc. | Low dielectric constant materials with polymeric networks |
-
2001
- 2001-07-05 US US09/897,936 patent/US20020022708A1/en not_active Abandoned
- 2001-07-13 KR KR1020037000737A patent/KR100620207B1/ko not_active Expired - Fee Related
- 2001-07-13 CN CN01815765A patent/CN1458945A/zh active Pending
- 2001-07-13 AU AU2001280549A patent/AU2001280549A1/en not_active Abandoned
- 2001-07-13 WO PCT/US2001/022204 patent/WO2002008308A1/en not_active Ceased
- 2001-07-13 JP JP2002514210A patent/JP2004504455A/ja not_active Withdrawn
- 2001-07-13 EP EP01958944A patent/EP1309639A4/en not_active Withdrawn
- 2001-07-19 TW TW090117706A patent/TWI241310B/zh not_active IP Right Cessation
- 2001-12-13 MY MYPI20015668A patent/MY134260A/en unknown
-
2002
- 2002-10-08 US US10/267,380 patent/US6803441B2/en not_active Expired - Fee Related
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