JP2004502859A5 - - Google Patents
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- Publication number
- JP2004502859A5 JP2004502859A5 JP2002509429A JP2002509429A JP2004502859A5 JP 2004502859 A5 JP2004502859 A5 JP 2004502859A5 JP 2002509429 A JP2002509429 A JP 2002509429A JP 2002509429 A JP2002509429 A JP 2002509429A JP 2004502859 A5 JP2004502859 A5 JP 2004502859A5
- Authority
- JP
- Japan
- Prior art keywords
- carbon atoms
- terminal group
- epoxy resin
- adhesive composition
- oligomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/611,450 US6294259B1 (en) | 2000-07-06 | 2000-07-06 | Polyimide hybrid adhesives |
| PCT/US2000/030829 WO2002004572A1 (en) | 2000-07-06 | 2000-11-10 | Polyimide hybrid adhesives |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004502859A JP2004502859A (ja) | 2004-01-29 |
| JP2004502859A5 true JP2004502859A5 (https=) | 2007-12-13 |
Family
ID=24449066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002509429A Withdrawn JP2004502859A (ja) | 2000-07-06 | 2000-11-10 | ポリイミドハイブリッド接着剤 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6294259B1 (https=) |
| EP (1) | EP1303571B1 (https=) |
| JP (1) | JP2004502859A (https=) |
| KR (1) | KR100676331B1 (https=) |
| AT (1) | ATE267858T1 (https=) |
| AU (1) | AU2001217593A1 (https=) |
| DE (1) | DE60011150T2 (https=) |
| TW (1) | TWI288773B (https=) |
| WO (1) | WO2002004572A1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100555078C (zh) * | 2003-06-02 | 2009-10-28 | 东丽株式会社 | 感光树脂组合物及用其制备的电子元件和显示装置 |
| CN1938357A (zh) * | 2004-04-19 | 2007-03-28 | 株式会社钟化 | 热固性树脂组合物、以及使用该组合物形成的叠层体、电路基板 |
| US7816487B2 (en) * | 2004-09-30 | 2010-10-19 | Intel Corporation | Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same |
| US20060116476A1 (en) * | 2004-12-01 | 2006-06-01 | 3M Innovative Properties Company | Hybrid thermosetting composition |
| US20060116492A1 (en) * | 2004-12-01 | 2006-06-01 | 3M Innovative Properties Company | Branched polymer |
| JP5014587B2 (ja) * | 2005-04-28 | 2012-08-29 | 株式会社カネカ | 活性エステル化合物およびその利用 |
| KR20080030581A (ko) * | 2005-05-31 | 2008-04-04 | 스미토모 베이클리트 컴퍼니 리미티드 | 프리어플리케이션용 봉지 수지 조성물, 이를 이용한반도체장치 및 그 제조방법 |
| MY160024A (en) * | 2009-07-10 | 2017-02-15 | Toray Industries | Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| CN115197421A (zh) * | 2017-01-27 | 2022-10-18 | 积水化学工业株式会社 | 固化性树脂组合物、粘接剂、酰亚胺低聚物、酰亚胺低聚物组合物以及固化剂 |
| WO2018139559A1 (ja) * | 2017-01-27 | 2018-08-02 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、フレキシブル銅張積層板、及び、回路基板 |
| KR102671097B1 (ko) | 2017-05-31 | 2024-05-30 | 세키스이가가쿠 고교가부시키가이샤 | 경화성 수지 조성물, 경화물, 접착제, 접착 필름, 커버레이 필름, 및, 프린트 배선판 |
| JP7144182B2 (ja) * | 2017-05-31 | 2022-09-29 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム |
| JP7207863B2 (ja) * | 2017-05-31 | 2023-01-18 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム |
| TWI770178B (zh) * | 2017-05-31 | 2022-07-11 | 日商積水化學工業股份有限公司 | 硬化性樹脂組成物、硬化物、接著劑、接著膜、覆蓋膜及印刷配線板 |
| WO2018221217A1 (ja) * | 2017-05-31 | 2018-12-06 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板 |
| JP7211715B2 (ja) * | 2017-05-31 | 2023-01-24 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板 |
| CN111263782A (zh) * | 2017-10-27 | 2020-06-09 | 积水化学工业株式会社 | 固化性树脂组合物、固化物、粘接剂和粘接膜 |
| KR102752119B1 (ko) * | 2018-03-20 | 2025-01-09 | 세키스이가가쿠 고교가부시키가이샤 | 경화성 수지 조성물, 접착제, 접착 필름, 커버레이 필름 및 플렉시블 구리 피복 적층판 |
| CN111655752B (zh) | 2018-03-28 | 2024-04-16 | 积水化学工业株式会社 | 固化性树脂组合物、粘接剂、粘接膜、电路基板、层间绝缘材料、以及印刷布线板 |
| CN108865047A (zh) * | 2018-06-12 | 2018-11-23 | 山东科思姆特种材料技术开发有限公司 | 耐高温抗辐射胶黏剂及其制备方法 |
| TW202233794A (zh) * | 2020-12-23 | 2022-09-01 | 日商積水化學工業股份有限公司 | 硬化性樹脂組成物、硬化物、接著劑、及接著膜 |
| CN114276654B (zh) * | 2021-11-24 | 2023-10-17 | 久耀电子科技（江苏）有限公司 | 一种树脂组合物、半固化片以及高cti覆铜板 |
| CN115536816B (zh) * | 2022-10-28 | 2024-02-20 | 中国科学院兰州化学物理研究所 | 一种热固性环氧树脂形状记忆聚合物及其制备方法 |
Family Cites Families (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4217389A (en) | 1969-05-08 | 1980-08-12 | General Electric Company | Curable mixture of water soluble polyester and polyimide precursor, process of coating and products |
| FR2094607A5 (https=) | 1970-06-26 | 1972-02-04 | Rhone Poulenc Sa | |
| US3989670A (en) | 1972-12-29 | 1976-11-02 | General Electric Company | Method for making polyetherimides |
| GB1422396A (en) | 1973-01-26 | 1976-01-28 | Ciba Geigy Ag | Film adhesives |
| US4073773A (en) | 1976-12-30 | 1978-02-14 | General Electric Company | Melt polymerization method for making polyetherimides |
| JPS5923330B2 (ja) | 1977-11-01 | 1984-06-01 | 三菱電機株式会社 | 耐熱性エポキシ樹脂組成物 |
| JPS5815948B2 (ja) | 1979-11-28 | 1983-03-28 | 日東電工株式会社 | 回路基板用絶縁材料 |
| FR2514772B1 (fr) | 1981-10-19 | 1985-09-06 | Inst Francais Du Petrole | Compositions reactives de polyimides thermostables presentant une solubilite elevee et leurs utilisations |
| US4416973A (en) | 1982-01-04 | 1983-11-22 | E. I. Du Pont De Nemours & Co. | Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound |
| JPS58223149A (ja) | 1982-06-22 | 1983-12-24 | Toray Ind Inc | 感光性ポリイミド用現像液 |
| US4410664A (en) | 1982-09-20 | 1983-10-18 | Plastics Engineering Company | Polyimide-epoxy thermoset resins |
| US4443591A (en) | 1983-01-21 | 1984-04-17 | General Electric Company | Method for making polyetherimide |
| US4443592A (en) | 1983-01-21 | 1984-04-17 | General Electric Company | Method for making polyetherimide |
| US4604230A (en) | 1984-10-15 | 1986-08-05 | Stauffer Chemical Company | Thermally stable adhesive |
| US4585852A (en) | 1984-11-20 | 1986-04-29 | General Electric Company | Two-step process for producing polyetherimides |
| JPS61270852A (ja) | 1985-05-24 | 1986-12-01 | Nitto Electric Ind Co Ltd | 半導体装置 |
| US4769476A (en) | 1985-09-27 | 1988-09-06 | General Electric Company | Bis(dialkyl aromatic ether anhydride) and polymers obtained therefrom |
| US4611048A (en) | 1985-10-04 | 1986-09-09 | General Electric Company | Hydroxy terminated polyetherimide oligomers |
| US4996268A (en) | 1986-07-01 | 1991-02-26 | National Starch And Chemical Investment Holding Corporation | Carbinol-containing polyimide oligomers terminated with epoxide-reactive groups |
| US4820779A (en) | 1986-07-01 | 1989-04-11 | National Starch And Chemical Corporation | Adduct of a carbinol-containing polyimide oligomer terminated with epoxide-reactive groups and a polyepoxide |
| US4757150A (en) | 1986-07-31 | 1988-07-12 | General Electric Company | Polyetherimide bisphenol compositions |
| JPS6375034A (ja) | 1986-09-18 | 1988-04-05 | Agency Of Ind Science & Technol | 付加硬化型可溶性イミドオリゴマ及びそれを用いた繊維強化複合材料用中間素材 |
| US4835249A (en) | 1986-12-31 | 1989-05-30 | General Electric Company | Process for preparing polyimides |
| US5028681A (en) | 1986-12-31 | 1991-07-02 | Peters Edward N | Novel poly(imide-siloxane) block copolymers and process for their preparation |
| EP0309190A3 (en) | 1987-09-22 | 1990-10-17 | National Starch And Chemical Investment Holding Corporation | Polyimide coating compositions |
| JP2708191B2 (ja) | 1988-09-20 | 1998-02-04 | 株式会社日立製作所 | 半導体装置 |
| DE59008553D1 (de) | 1989-01-20 | 1995-04-06 | Ciba Geigy Ag | Härtbare Epoxidharz-Stoffgemische enthaltend einen Thermoplast mit phenolischen Endgruppen. |
| EP0379467A3 (de) | 1989-01-20 | 1991-07-10 | Ciba-Geigy Ag | Hydroxylgruppen-endständige stickstoffhaltige Polymere |
| JP2678934B2 (ja) | 1989-01-20 | 1997-11-19 | 宇部興産株式会社 | 熱硬化性樹脂組成物およびその硬化物 |
| JP2643518B2 (ja) | 1989-02-10 | 1997-08-20 | 東レ株式会社 | プリプレグ |
| US5108825A (en) | 1989-12-21 | 1992-04-28 | General Electric Company | Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it |
| EP0441047B1 (en) | 1990-01-19 | 1996-06-05 | Minnesota Mining And Manufacturing Company | Thermosettable composition |
| US5135990A (en) | 1990-10-05 | 1992-08-04 | General Electric Company | Polyetherimide-liquid crystalline polymer blends |
| FR2674860B1 (fr) | 1991-04-04 | 1994-02-18 | Ciba Geigy | Solutions d'impregnation a base d'au moins un oligomere poly(imide-amide) thermoplastique reactif et d'un co-reactif, utilisables notamment pour la realisation d'articles intermediaires pre-impregnes. |
| US5252700A (en) | 1991-04-30 | 1993-10-12 | Mitsui Toatsu Chemicals, Inc. | Heat-resistant adhesive and method of adhesion by using adhesive |
| US5250228A (en) | 1991-11-06 | 1993-10-05 | Raychem Corporation | Conductive polymer composition |
| US5169911A (en) | 1992-02-18 | 1992-12-08 | General Electric Company | Heat curable blends of silicone polymide and epoxy resin |
| US5800575A (en) | 1992-04-06 | 1998-09-01 | Zycon Corporation | In situ method of forming a bypass capacitor element internally within a capacitive PCB |
| JPH0660230A (ja) | 1992-08-07 | 1994-03-04 | Omron Corp | 非接触パスゲートシステム |
| JP3288439B2 (ja) | 1992-08-19 | 2002-06-04 | 株式会社お茶の玉露園 | 粉茶の製造方法 |
| US5412065A (en) | 1993-04-09 | 1995-05-02 | Ciba-Geigy Corporation | Polyimide oligomers |
| US5606014A (en) | 1995-08-04 | 1997-02-25 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Imide oligomers and co-oligomers containing pendent phenylethynyl groups and polymers therefrom |
| GB9612523D0 (en) | 1996-06-14 | 1996-08-14 | Fiberite Inc | Improvements relating to resin compositions |
| US5883182A (en) | 1997-01-06 | 1999-03-16 | A Creative Research & Testing Co. | Coating compositions and coatings thereof |
-
2000
- 2000-07-06 US US09/611,450 patent/US6294259B1/en not_active Expired - Fee Related
- 2000-11-10 DE DE60011150T patent/DE60011150T2/de not_active Expired - Fee Related
- 2000-11-10 AT AT00980313T patent/ATE267858T1/de not_active IP Right Cessation
- 2000-11-10 AU AU2001217593A patent/AU2001217593A1/en not_active Abandoned
- 2000-11-10 EP EP00980313A patent/EP1303571B1/en not_active Expired - Lifetime
- 2000-11-10 KR KR1020037000107A patent/KR100676331B1/ko not_active Expired - Fee Related
- 2000-11-10 JP JP2002509429A patent/JP2004502859A/ja not_active Withdrawn
- 2000-11-10 WO PCT/US2000/030829 patent/WO2002004572A1/en not_active Ceased
-
2001
- 2001-06-26 TW TW090115459A patent/TWI288773B/zh not_active IP Right Cessation
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