ATE267858T1 - Hybridklebstoffe auf der basis von polyimiden - Google Patents

Hybridklebstoffe auf der basis von polyimiden

Info

Publication number
ATE267858T1
ATE267858T1 AT00980313T AT00980313T ATE267858T1 AT E267858 T1 ATE267858 T1 AT E267858T1 AT 00980313 T AT00980313 T AT 00980313T AT 00980313 T AT00980313 T AT 00980313T AT E267858 T1 ATE267858 T1 AT E267858T1
Authority
AT
Austria
Prior art keywords
polyimides
adhesives based
hybrid adhesives
polyimide
hybrid
Prior art date
Application number
AT00980313T
Other languages
German (de)
English (en)
Inventor
Gregory J Anderson
Scott B Charles
Michael A Kropp
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE267858T1 publication Critical patent/ATE267858T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
AT00980313T 2000-07-06 2000-11-10 Hybridklebstoffe auf der basis von polyimiden ATE267858T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/611,450 US6294259B1 (en) 2000-07-06 2000-07-06 Polyimide hybrid adhesives
PCT/US2000/030829 WO2002004572A1 (en) 2000-07-06 2000-11-10 Polyimide hybrid adhesives

Publications (1)

Publication Number Publication Date
ATE267858T1 true ATE267858T1 (de) 2004-06-15

Family

ID=24449066

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00980313T ATE267858T1 (de) 2000-07-06 2000-11-10 Hybridklebstoffe auf der basis von polyimiden

Country Status (9)

Country Link
US (1) US6294259B1 (https=)
EP (1) EP1303571B1 (https=)
JP (1) JP2004502859A (https=)
KR (1) KR100676331B1 (https=)
AT (1) ATE267858T1 (https=)
AU (1) AU2001217593A1 (https=)
DE (1) DE60011150T2 (https=)
TW (1) TWI288773B (https=)
WO (1) WO2002004572A1 (https=)

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CN1938357A (zh) * 2004-04-19 2007-03-28 株式会社钟化 热固性树脂组合物、以及使用该组合物形成的叠层体、电路基板
US7816487B2 (en) * 2004-09-30 2010-10-19 Intel Corporation Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
US20060116476A1 (en) * 2004-12-01 2006-06-01 3M Innovative Properties Company Hybrid thermosetting composition
US20060116492A1 (en) * 2004-12-01 2006-06-01 3M Innovative Properties Company Branched polymer
JP5014587B2 (ja) * 2005-04-28 2012-08-29 株式会社カネカ 活性エステル化合物およびその利用
KR20080030581A (ko) * 2005-05-31 2008-04-04 스미토모 베이클리트 컴퍼니 리미티드 프리어플리케이션용 봉지 수지 조성물, 이를 이용한반도체장치 및 그 제조방법
MY160024A (en) * 2009-07-10 2017-02-15 Toray Industries Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
CN115197421A (zh) * 2017-01-27 2022-10-18 积水化学工业株式会社 固化性树脂组合物、粘接剂、酰亚胺低聚物、酰亚胺低聚物组合物以及固化剂
WO2018139559A1 (ja) * 2017-01-27 2018-08-02 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、フレキシブル銅張積層板、及び、回路基板
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JP7144182B2 (ja) * 2017-05-31 2022-09-29 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP7207863B2 (ja) * 2017-05-31 2023-01-18 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
TWI770178B (zh) * 2017-05-31 2022-07-11 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化物、接著劑、接著膜、覆蓋膜及印刷配線板
WO2018221217A1 (ja) * 2017-05-31 2018-12-06 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板
JP7211715B2 (ja) * 2017-05-31 2023-01-24 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板
CN111263782A (zh) * 2017-10-27 2020-06-09 积水化学工业株式会社 固化性树脂组合物、固化物、粘接剂和粘接膜
KR102752119B1 (ko) * 2018-03-20 2025-01-09 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 접착제, 접착 필름, 커버레이 필름 및 플렉시블 구리 피복 적층판
CN111655752B (zh) 2018-03-28 2024-04-16 积水化学工业株式会社 固化性树脂组合物、粘接剂、粘接膜、电路基板、层间绝缘材料、以及印刷布线板
CN108865047A (zh) * 2018-06-12 2018-11-23 山东科思姆特种材料技术开发有限公司 耐高温抗辐射胶黏剂及其制备方法
TW202233794A (zh) * 2020-12-23 2022-09-01 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化物、接著劑、及接著膜
CN114276654B (zh) * 2021-11-24 2023-10-17 久耀电子科技（江苏）有限公司 一种树脂组合物、半固化片以及高cti覆铜板
CN115536816B (zh) * 2022-10-28 2024-02-20 中国科学院兰州化学物理研究所 一种热固性环氧树脂形状记忆聚合物及其制备方法

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Also Published As

Publication number Publication date
DE60011150T2 (de) 2005-06-16
DE60011150D1 (de) 2004-07-01
AU2001217593A1 (en) 2002-01-21
JP2004502859A (ja) 2004-01-29
KR100676331B1 (ko) 2007-02-05
WO2002004572A1 (en) 2002-01-17
US6294259B1 (en) 2001-09-25
EP1303571B1 (en) 2004-05-26
EP1303571A1 (en) 2003-04-23
KR20040030387A (ko) 2004-04-09
TWI288773B (en) 2007-10-21

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