JP2004274077A5 - - Google Patents

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Publication number
JP2004274077A5
JP2004274077A5 JP2004144257A JP2004144257A JP2004274077A5 JP 2004274077 A5 JP2004274077 A5 JP 2004274077A5 JP 2004144257 A JP2004144257 A JP 2004144257A JP 2004144257 A JP2004144257 A JP 2004144257A JP 2004274077 A5 JP2004274077 A5 JP 2004274077A5
Authority
JP
Japan
Prior art keywords
pair
integrated circuit
insulating film
semiconductor integrated
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004144257A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004274077A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004144257A priority Critical patent/JP2004274077A/ja
Priority claimed from JP2004144257A external-priority patent/JP2004274077A/ja
Publication of JP2004274077A publication Critical patent/JP2004274077A/ja
Publication of JP2004274077A5 publication Critical patent/JP2004274077A5/ja
Pending legal-status Critical Current

Links

JP2004144257A 2001-01-30 2004-05-14 半導体集積回路装置およびその製造方法 Pending JP2004274077A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004144257A JP2004274077A (ja) 2001-01-30 2004-05-14 半導体集積回路装置およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001022132 2001-01-30
JP2004144257A JP2004274077A (ja) 2001-01-30 2004-05-14 半導体集積回路装置およびその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002561287A Division JP4056392B2 (ja) 2001-01-30 2001-12-26 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JP2004274077A JP2004274077A (ja) 2004-09-30
JP2004274077A5 true JP2004274077A5 (enExample) 2005-06-30

Family

ID=33133411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004144257A Pending JP2004274077A (ja) 2001-01-30 2004-05-14 半導体集積回路装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2004274077A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008072044A (ja) * 2006-09-15 2008-03-27 Nec Electronics Corp 半導体装置及びその製造方法
JP2008311457A (ja) * 2007-06-15 2008-12-25 Renesas Technology Corp 半導体装置の製造方法

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