JP2004228602A5 - - Google Patents

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Publication number
JP2004228602A5
JP2004228602A5 JP2004127699A JP2004127699A JP2004228602A5 JP 2004228602 A5 JP2004228602 A5 JP 2004228602A5 JP 2004127699 A JP2004127699 A JP 2004127699A JP 2004127699 A JP2004127699 A JP 2004127699A JP 2004228602 A5 JP2004228602 A5 JP 2004228602A5
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JP
Japan
Prior art keywords
process gas
reaction chamber
substrate
supply pipe
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004127699A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004228602A (ja
JP4695343B2 (ja
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Publication date
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Priority to JP2004127699A priority Critical patent/JP4695343B2/ja
Priority claimed from JP2004127699A external-priority patent/JP4695343B2/ja
Publication of JP2004228602A publication Critical patent/JP2004228602A/ja
Publication of JP2004228602A5 publication Critical patent/JP2004228602A5/ja
Application granted granted Critical
Publication of JP4695343B2 publication Critical patent/JP4695343B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004127699A 2002-04-11 2004-04-23 縦型半導体製造装置 Expired - Lifetime JP4695343B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004127699A JP4695343B2 (ja) 2002-04-11 2004-04-23 縦型半導体製造装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002109130 2002-04-11
JP2002109130 2002-04-11
JP2004127699A JP4695343B2 (ja) 2002-04-11 2004-04-23 縦型半導体製造装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003107067A Division JP3947126B2 (ja) 2002-04-11 2003-04-10 半導体製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010206362A Division JP5283673B2 (ja) 2002-04-11 2010-09-15 半導体装置の製造方法、成膜方法および基板処理装置

Publications (3)

Publication Number Publication Date
JP2004228602A JP2004228602A (ja) 2004-08-12
JP2004228602A5 true JP2004228602A5 (cg-RX-API-DMAC7.html) 2006-05-25
JP4695343B2 JP4695343B2 (ja) 2011-06-08

Family

ID=32910730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004127699A Expired - Lifetime JP4695343B2 (ja) 2002-04-11 2004-04-23 縦型半導体製造装置

Country Status (1)

Country Link
JP (1) JP4695343B2 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100841866B1 (ko) * 2005-02-17 2008-06-27 가부시키가이샤 히다치 고쿠사이 덴키 반도체 디바이스의 제조 방법 및 기판 처리 장치
JPWO2009054232A1 (ja) * 2007-10-22 2011-03-03 株式会社ナノマテリアル研究所 半導体製造装置、半導体製造方法及び電子機器
JP5886531B2 (ja) 2011-02-24 2016-03-16 東京エレクトロン株式会社 成膜方法および成膜装置
JP5920242B2 (ja) 2012-06-02 2016-05-18 東京エレクトロン株式会社 成膜方法及び成膜装置
JP2015073020A (ja) * 2013-10-03 2015-04-16 三井造船株式会社 原子層堆積装置および原子層堆積方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6511539B1 (en) * 1999-09-08 2003-01-28 Asm America, Inc. Apparatus and method for growth of a thin film
JP3687651B2 (ja) * 2000-06-08 2005-08-24 ジニテック インク． 薄膜形成方法

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