JP2004134779A5 - - Google Patents

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Publication number
JP2004134779A5
JP2004134779A5 JP2003322699A JP2003322699A JP2004134779A5 JP 2004134779 A5 JP2004134779 A5 JP 2004134779A5 JP 2003322699 A JP2003322699 A JP 2003322699A JP 2003322699 A JP2003322699 A JP 2003322699A JP 2004134779 A5 JP2004134779 A5 JP 2004134779A5
Authority
JP
Japan
Prior art keywords
reinforcing plate
electronic component
flexible film
circuit pattern
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003322699A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004134779A (ja
JP4158659B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003322699A priority Critical patent/JP4158659B2/ja
Priority claimed from JP2003322699A external-priority patent/JP4158659B2/ja
Publication of JP2004134779A publication Critical patent/JP2004134779A/ja
Publication of JP2004134779A5 publication Critical patent/JP2004134779A5/ja
Application granted granted Critical
Publication of JP4158659B2 publication Critical patent/JP4158659B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003322699A 2002-09-20 2003-09-16 電子部品実装回路基板の製造方法 Expired - Fee Related JP4158659B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003322699A JP4158659B2 (ja) 2002-09-20 2003-09-16 電子部品実装回路基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002274494 2002-09-20
JP2003322699A JP4158659B2 (ja) 2002-09-20 2003-09-16 電子部品実装回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2004134779A JP2004134779A (ja) 2004-04-30
JP2004134779A5 true JP2004134779A5 (enExample) 2006-11-02
JP4158659B2 JP4158659B2 (ja) 2008-10-01

Family

ID=32301743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003322699A Expired - Fee Related JP4158659B2 (ja) 2002-09-20 2003-09-16 電子部品実装回路基板の製造方法

Country Status (1)

Country Link
JP (1) JP4158659B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5223481B2 (ja) * 2008-06-16 2013-06-26 住友金属鉱山株式会社 金属被覆ポリイミド基板とその製造方法
JP2009302427A (ja) * 2008-06-17 2009-12-24 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法

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