JP4158659B2 - 電子部品実装回路基板の製造方法 - Google Patents

電子部品実装回路基板の製造方法 Download PDF

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Publication number
JP4158659B2
JP4158659B2 JP2003322699A JP2003322699A JP4158659B2 JP 4158659 B2 JP4158659 B2 JP 4158659B2 JP 2003322699 A JP2003322699 A JP 2003322699A JP 2003322699 A JP2003322699 A JP 2003322699A JP 4158659 B2 JP4158659 B2 JP 4158659B2
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JP
Japan
Prior art keywords
reinforcing plate
film
layer
circuit board
electronic component
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Expired - Fee Related
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JP2003322699A
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English (en)
Japanese (ja)
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JP2004134779A (ja
JP2004134779A5 (enExample
Inventor
孝義 赤松
太 奥山
徹也 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
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Toray Industries Inc
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Priority to JP2003322699A priority Critical patent/JP4158659B2/ja
Publication of JP2004134779A publication Critical patent/JP2004134779A/ja
Publication of JP2004134779A5 publication Critical patent/JP2004134779A5/ja
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Publication of JP4158659B2 publication Critical patent/JP4158659B2/ja
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Wire Bonding (AREA)
JP2003322699A 2002-09-20 2003-09-16 電子部品実装回路基板の製造方法 Expired - Fee Related JP4158659B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003322699A JP4158659B2 (ja) 2002-09-20 2003-09-16 電子部品実装回路基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002274494 2002-09-20
JP2003322699A JP4158659B2 (ja) 2002-09-20 2003-09-16 電子部品実装回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2004134779A JP2004134779A (ja) 2004-04-30
JP2004134779A5 JP2004134779A5 (enExample) 2006-11-02
JP4158659B2 true JP4158659B2 (ja) 2008-10-01

Family

ID=32301743

Family Applications (1)

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JP2003322699A Expired - Fee Related JP4158659B2 (ja) 2002-09-20 2003-09-16 電子部品実装回路基板の製造方法

Country Status (1)

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JP (1) JP4158659B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5223481B2 (ja) * 2008-06-16 2013-06-26 住友金属鉱山株式会社 金属被覆ポリイミド基板とその製造方法
JP2009302427A (ja) * 2008-06-17 2009-12-24 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法

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Publication number Publication date
JP2004134779A (ja) 2004-04-30

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