JP2005150281A5 - - Google Patents

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Publication number
JP2005150281A5
JP2005150281A5 JP2003383609A JP2003383609A JP2005150281A5 JP 2005150281 A5 JP2005150281 A5 JP 2005150281A5 JP 2003383609 A JP2003383609 A JP 2003383609A JP 2003383609 A JP2003383609 A JP 2003383609A JP 2005150281 A5 JP2005150281 A5 JP 2005150281A5
Authority
JP
Japan
Prior art keywords
flexible film
film
reinforcing plate
dividing
pattern made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003383609A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005150281A (ja
JP4433771B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003383609A priority Critical patent/JP4433771B2/ja
Priority claimed from JP2003383609A external-priority patent/JP4433771B2/ja
Publication of JP2005150281A publication Critical patent/JP2005150281A/ja
Publication of JP2005150281A5 publication Critical patent/JP2005150281A5/ja
Application granted granted Critical
Publication of JP4433771B2 publication Critical patent/JP4433771B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003383609A 2003-11-13 2003-11-13 回路基板用部材および回路基板の製造方法 Expired - Fee Related JP4433771B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003383609A JP4433771B2 (ja) 2003-11-13 2003-11-13 回路基板用部材および回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003383609A JP4433771B2 (ja) 2003-11-13 2003-11-13 回路基板用部材および回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2005150281A JP2005150281A (ja) 2005-06-09
JP2005150281A5 true JP2005150281A5 (enExample) 2006-12-28
JP4433771B2 JP4433771B2 (ja) 2010-03-17

Family

ID=34692280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003383609A Expired - Fee Related JP4433771B2 (ja) 2003-11-13 2003-11-13 回路基板用部材および回路基板の製造方法

Country Status (1)

Country Link
JP (1) JP4433771B2 (enExample)

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