JP2004128484A - 半導体集積回路装置およびその製造方法 - Google Patents

半導体集積回路装置およびその製造方法 Download PDF

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Publication number
JP2004128484A
JP2004128484A JP2003207584A JP2003207584A JP2004128484A JP 2004128484 A JP2004128484 A JP 2004128484A JP 2003207584 A JP2003207584 A JP 2003207584A JP 2003207584 A JP2003207584 A JP 2003207584A JP 2004128484 A JP2004128484 A JP 2004128484A
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Japan
Prior art keywords
wiring
dummy
insulating film
integrated circuit
circuit device
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JP2003207584A
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English (en)
Japanese (ja)
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JP2004128484A5 (https=
Inventor
Yasushi Kawabuchi
河渕　靖
Koichi Nagasawa
長沢　幸一
Masahiro Shigeniwa
茂庭　昌弘
Yohei Yamada
山田　洋平
Toshifumi Takeda
竹田　敏文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
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Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2003207584A priority Critical patent/JP2004128484A/ja
Publication of JP2004128484A publication Critical patent/JP2004128484A/ja
Publication of JP2004128484A5 publication Critical patent/JP2004128484A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/092—Manufacture or treatment of dielectric parts thereof by smoothing the dielectric parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
JP2003207584A 1997-03-31 2003-08-14 半導体集積回路装置およびその製造方法 Withdrawn JP2004128484A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003207584A JP2004128484A (ja) 1997-03-31 2003-08-14 半導体集積回路装置およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8101397 1997-03-31
JP2003207584A JP2004128484A (ja) 1997-03-31 2003-08-14 半導体集積回路装置およびその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP03338898A Division JP3638778B2 (ja) 1997-03-31 1998-02-16 半導体集積回路装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2004128484A true JP2004128484A (ja) 2004-04-22
JP2004128484A5 JP2004128484A5 (https=) 2005-09-29

Family

ID=32299890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003207584A Withdrawn JP2004128484A (ja) 1997-03-31 2003-08-14 半導体集積回路装置およびその製造方法

Country Status (1)

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JP (1) JP2004128484A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100552935C (zh) * 2006-10-09 2009-10-21 日月光半导体制造股份有限公司 基板条与基板结构以及其制造方法
JP2010093235A (ja) * 2008-09-11 2010-04-22 Nec Electronics Corp 半導体装置および半導体装置の製造方法
WO2014042234A1 (ja) * 2012-09-11 2014-03-20 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
JP2016031939A (ja) * 2014-07-25 2016-03-07 富士通セミコンダクター株式会社 半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100552935C (zh) * 2006-10-09 2009-10-21 日月光半导体制造股份有限公司 基板条与基板结构以及其制造方法
JP2010093235A (ja) * 2008-09-11 2010-04-22 Nec Electronics Corp 半導体装置および半導体装置の製造方法
WO2014042234A1 (ja) * 2012-09-11 2014-03-20 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
JP2016031939A (ja) * 2014-07-25 2016-03-07 富士通セミコンダクター株式会社 半導体装置の製造方法

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