JP2004128484A - 半導体集積回路装置およびその製造方法 - Google Patents
半導体集積回路装置およびその製造方法 Download PDFInfo
- Publication number
- JP2004128484A JP2004128484A JP2003207584A JP2003207584A JP2004128484A JP 2004128484 A JP2004128484 A JP 2004128484A JP 2003207584 A JP2003207584 A JP 2003207584A JP 2003207584 A JP2003207584 A JP 2003207584A JP 2004128484 A JP2004128484 A JP 2004128484A
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- Prior art keywords
- wiring
- dummy
- insulating film
- integrated circuit
- circuit device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76819—Smoothing of the dielectric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003207584A JP2004128484A (ja) | 1997-03-31 | 2003-08-14 | 半導体集積回路装置およびその製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8101397 | 1997-03-31 | ||
| JP2003207584A JP2004128484A (ja) | 1997-03-31 | 2003-08-14 | 半導体集積回路装置およびその製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03338898A Division JP3638778B2 (ja) | 1997-03-31 | 1998-02-16 | 半導体集積回路装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004128484A true JP2004128484A (ja) | 2004-04-22 |
| JP2004128484A5 JP2004128484A5 (enExample) | 2005-09-29 |
Family
ID=32299890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003207584A Withdrawn JP2004128484A (ja) | 1997-03-31 | 2003-08-14 | 半導体集積回路装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004128484A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100552935C (zh) * | 2006-10-09 | 2009-10-21 | 日月光半导体制造股份有限公司 | 基板条与基板结构以及其制造方法 |
| JP2010093235A (ja) * | 2008-09-11 | 2010-04-22 | Nec Electronics Corp | 半導体装置および半導体装置の製造方法 |
| WO2014042234A1 (ja) * | 2012-09-11 | 2014-03-20 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置 |
| JP2016031939A (ja) * | 2014-07-25 | 2016-03-07 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
-
2003
- 2003-08-14 JP JP2003207584A patent/JP2004128484A/ja not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100552935C (zh) * | 2006-10-09 | 2009-10-21 | 日月光半导体制造股份有限公司 | 基板条与基板结构以及其制造方法 |
| JP2010093235A (ja) * | 2008-09-11 | 2010-04-22 | Nec Electronics Corp | 半導体装置および半導体装置の製造方法 |
| WO2014042234A1 (ja) * | 2012-09-11 | 2014-03-20 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置 |
| JP2016031939A (ja) * | 2014-07-25 | 2016-03-07 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050422 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060117 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20060316 |