JP2004128484A5 - - Google Patents

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Publication number
JP2004128484A5
JP2004128484A5 JP2003207584A JP2003207584A JP2004128484A5 JP 2004128484 A5 JP2004128484 A5 JP 2004128484A5 JP 2003207584 A JP2003207584 A JP 2003207584A JP 2003207584 A JP2003207584 A JP 2003207584A JP 2004128484 A5 JP2004128484 A5 JP 2004128484A5
Authority
JP
Japan
Prior art keywords
wiring
insulating film
integrated circuit
semiconductor integrated
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003207584A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004128484A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003207584A priority Critical patent/JP2004128484A/ja
Priority claimed from JP2003207584A external-priority patent/JP2004128484A/ja
Publication of JP2004128484A publication Critical patent/JP2004128484A/ja
Publication of JP2004128484A5 publication Critical patent/JP2004128484A5/ja
Withdrawn legal-status Critical Current

Links

JP2003207584A 1997-03-31 2003-08-14 半導体集積回路装置およびその製造方法 Withdrawn JP2004128484A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003207584A JP2004128484A (ja) 1997-03-31 2003-08-14 半導体集積回路装置およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8101397 1997-03-31
JP2003207584A JP2004128484A (ja) 1997-03-31 2003-08-14 半導体集積回路装置およびその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP03338898A Division JP3638778B2 (ja) 1997-03-31 1998-02-16 半導体集積回路装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2004128484A JP2004128484A (ja) 2004-04-22
JP2004128484A5 true JP2004128484A5 (enExample) 2005-09-29

Family

ID=32299890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003207584A Withdrawn JP2004128484A (ja) 1997-03-31 2003-08-14 半導体集積回路装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2004128484A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100552935C (zh) * 2006-10-09 2009-10-21 日月光半导体制造股份有限公司 基板条与基板结构以及其制造方法
JP5554951B2 (ja) * 2008-09-11 2014-07-23 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR20150053930A (ko) * 2012-09-11 2015-05-19 피에스4 뤽스코 에스.에이.알.엘. 반도체 장치
JP6331830B2 (ja) * 2014-07-25 2018-05-30 富士通セミコンダクター株式会社 半導体装置の製造方法

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