JP2004048025A5 - - Google Patents

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Publication number
JP2004048025A5
JP2004048025A5 JP2003207585A JP2003207585A JP2004048025A5 JP 2004048025 A5 JP2004048025 A5 JP 2004048025A5 JP 2003207585 A JP2003207585 A JP 2003207585A JP 2003207585 A JP2003207585 A JP 2003207585A JP 2004048025 A5 JP2004048025 A5 JP 2004048025A5
Authority
JP
Japan
Prior art keywords
region
dummy
integrated circuit
circuit device
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003207585A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004048025A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003207585A priority Critical patent/JP2004048025A/ja
Priority claimed from JP2003207585A external-priority patent/JP2004048025A/ja
Publication of JP2004048025A publication Critical patent/JP2004048025A/ja
Publication of JP2004048025A5 publication Critical patent/JP2004048025A5/ja
Withdrawn legal-status Critical Current

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JP2003207585A 1997-03-31 2003-08-14 半導体集積回路装置 Withdrawn JP2004048025A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003207585A JP2004048025A (ja) 1997-03-31 2003-08-14 半導体集積回路装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8101397 1997-03-31
JP2003207585A JP2004048025A (ja) 1997-03-31 2003-08-14 半導体集積回路装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP03338898A Division JP3638778B2 (ja) 1997-03-31 1998-02-16 半導体集積回路装置およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005337967A Division JP2006128709A (ja) 1997-03-31 2005-11-24 半導体集積回路装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2004048025A JP2004048025A (ja) 2004-02-12
JP2004048025A5 true JP2004048025A5 (enExample) 2006-01-19

Family

ID=31718534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003207585A Withdrawn JP2004048025A (ja) 1997-03-31 2003-08-14 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JP2004048025A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005303089A (ja) * 2004-04-13 2005-10-27 Nec Electronics Corp 半導体装置
JP2009099738A (ja) * 2007-10-16 2009-05-07 Toshiba Corp 半導体装置、半導体装置の製造方法及び半導体記憶装置の製造方法
CN101866884B (zh) * 2009-04-14 2012-04-18 中芯国际集成电路制造(北京)有限公司 非易失性存储器控制栅极字线的加工方法
JP5705610B2 (ja) * 2010-08-05 2015-04-22 ルネサスエレクトロニクス株式会社 半導体装置
CN103296202B (zh) * 2012-03-02 2015-04-29 中芯国际集成电路制造(上海)有限公司 相变存储器及其制作方法
JP5918421B2 (ja) * 2015-06-04 2016-05-18 ルネサスエレクトロニクス株式会社 半導体装置
JP5918422B2 (ja) * 2015-06-04 2016-05-18 ルネサスエレクトロニクス株式会社 半導体装置
CN115020379B (zh) * 2022-05-30 2025-01-24 上海华力集成电路制造有限公司 Hkmg寄生电容测试结构的版图

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