JP2004104115A - パワーモジュール及びその製造方法 - Google Patents

パワーモジュール及びその製造方法 Download PDF

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Publication number
JP2004104115A
JP2004104115A JP2003296793A JP2003296793A JP2004104115A JP 2004104115 A JP2004104115 A JP 2004104115A JP 2003296793 A JP2003296793 A JP 2003296793A JP 2003296793 A JP2003296793 A JP 2003296793A JP 2004104115 A JP2004104115 A JP 2004104115A
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JP
Japan
Prior art keywords
power module
heat sink
heat
high thermal
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003296793A
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English (en)
Japanese (ja)
Other versions
JP2004104115A5 (enrdf_load_stackoverflow
Inventor
Mitsuhiro Matsuo
松尾　光洋
Hiroyuki Handa
半田　浩之
Koji Yoshida
吉田　幸司
Satoshi Ikeda
池田　敏
Yoshihiro Takeshima
竹島　由浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2003296793A priority Critical patent/JP2004104115A/ja
Publication of JP2004104115A publication Critical patent/JP2004104115A/ja
Publication of JP2004104115A5 publication Critical patent/JP2004104115A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003296793A 2002-08-21 2003-08-20 パワーモジュール及びその製造方法 Withdrawn JP2004104115A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003296793A JP2004104115A (ja) 2002-08-21 2003-08-20 パワーモジュール及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002241235 2002-08-21
JP2003296793A JP2004104115A (ja) 2002-08-21 2003-08-20 パワーモジュール及びその製造方法

Publications (2)

Publication Number Publication Date
JP2004104115A true JP2004104115A (ja) 2004-04-02
JP2004104115A5 JP2004104115A5 (enrdf_load_stackoverflow) 2006-04-06

Family

ID=32301109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003296793A Withdrawn JP2004104115A (ja) 2002-08-21 2003-08-20 パワーモジュール及びその製造方法

Country Status (1)

Country Link
JP (1) JP2004104115A (enrdf_load_stackoverflow)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156720A (ja) * 2004-11-30 2006-06-15 Matsushita Electric Ind Co Ltd 電子部品の装着方法
JP2006156721A (ja) * 2004-11-30 2006-06-15 Matsushita Electric Ind Co Ltd 部品ユニット
JP2008135784A (ja) * 2008-02-18 2008-06-12 Matsushita Electric Ind Co Ltd 部品ユニット
JP2009214260A (ja) * 2008-03-12 2009-09-24 Makita Corp 電動工具
US20110147917A1 (en) * 2009-12-22 2011-06-23 Fairchild Semiconductor Corporation Integrated circuit package with embedded components
JP2012033768A (ja) * 2010-07-30 2012-02-16 Sumitomo Bakelite Co Ltd 接着体
JP2013229746A (ja) * 2012-04-25 2013-11-07 Ntt Docomo Inc 課金システム、課金装置及び課金方法
WO2014188624A1 (ja) * 2013-05-22 2014-11-27 株式会社カネカ 放熱構造体
CN105848438A (zh) * 2016-06-05 2016-08-10 梅坤 一种高效的电动车控制器
KR20180079202A (ko) * 2016-12-30 2018-07-10 후아웨이 테크놀러지 컴퍼니 리미티드 칩 패키지 구조체 및 그 제조 방법
WO2018180235A1 (ja) * 2017-03-29 2018-10-04 日本電産株式会社 半導体パッケージ装置、およびその製造方法
JP2019507046A (ja) * 2016-11-08 2019-03-14 天津深之藍海洋設備科技有限公司Ｔｉａｎｊｉｎ Ｄｅｅｐｆａｒ Ｏｃｅａｎ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． Ｒｏｖ推進器の尾部カバー、ｒｏｖ推進器及びｒｏｖ
JP2019083245A (ja) * 2017-10-30 2019-05-30 ダイキン工業株式会社 電装品箱、電気回路の製造方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156720A (ja) * 2004-11-30 2006-06-15 Matsushita Electric Ind Co Ltd 電子部品の装着方法
JP2006156721A (ja) * 2004-11-30 2006-06-15 Matsushita Electric Ind Co Ltd 部品ユニット
JP2008135784A (ja) * 2008-02-18 2008-06-12 Matsushita Electric Ind Co Ltd 部品ユニット
JP2009214260A (ja) * 2008-03-12 2009-09-24 Makita Corp 電動工具
US20110147917A1 (en) * 2009-12-22 2011-06-23 Fairchild Semiconductor Corporation Integrated circuit package with embedded components
US8304888B2 (en) * 2009-12-22 2012-11-06 Fairchild Semiconductor Corporation Integrated circuit package with embedded components
JP2012033768A (ja) * 2010-07-30 2012-02-16 Sumitomo Bakelite Co Ltd 接着体
JP2013229746A (ja) * 2012-04-25 2013-11-07 Ntt Docomo Inc 課金システム、課金装置及び課金方法
WO2014188624A1 (ja) * 2013-05-22 2014-11-27 株式会社カネカ 放熱構造体
US9826623B2 (en) 2013-05-22 2017-11-21 Kaneka Corporation Heat dissipating structure
CN105848438A (zh) * 2016-06-05 2016-08-10 梅坤 一种高效的电动车控制器
JP2019507046A (ja) * 2016-11-08 2019-03-14 天津深之藍海洋設備科技有限公司Ｔｉａｎｊｉｎ Ｄｅｅｐｆａｒ Ｏｃｅａｎ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． Ｒｏｖ推進器の尾部カバー、ｒｏｖ推進器及びｒｏｖ
US10780966B2 (en) 2016-11-08 2020-09-22 Tianjin Deepfar Ocean Technology Co., LTD ROV propeller tailhood, ROV propeller and ROV
KR20180079202A (ko) * 2016-12-30 2018-07-10 후아웨이 테크놀러지 컴퍼니 리미티드 칩 패키지 구조체 및 그 제조 방법
KR102082252B1 (ko) * 2016-12-30 2020-05-27 후아웨이 테크놀러지 컴퍼니 리미티드 칩 패키지 구조체 및 그 제조 방법
US10903135B2 (en) 2016-12-30 2021-01-26 Huawei Technologies Co., Ltd. Chip package structure and manufacturing method thereof
WO2018180235A1 (ja) * 2017-03-29 2018-10-04 日本電産株式会社 半導体パッケージ装置、およびその製造方法
JP2019083245A (ja) * 2017-10-30 2019-05-30 ダイキン工業株式会社 電装品箱、電気回路の製造方法

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