JP2004095547A5 - - Google Patents

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Publication number
JP2004095547A5
JP2004095547A5 JP2003289033A JP2003289033A JP2004095547A5 JP 2004095547 A5 JP2004095547 A5 JP 2004095547A5 JP 2003289033 A JP2003289033 A JP 2003289033A JP 2003289033 A JP2003289033 A JP 2003289033A JP 2004095547 A5 JP2004095547 A5 JP 2004095547A5
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JP
Japan
Prior art keywords
wafer
anisotropic conductive
conductive
inspection
particle diameter
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Application number
JP2003289033A
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English (en)
Japanese (ja)
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JP2004095547A (ja
JP3685192B2 (ja
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Priority to JP2003289033A priority Critical patent/JP3685192B2/ja
Priority claimed from JP2003289033A external-priority patent/JP3685192B2/ja
Publication of JP2004095547A publication Critical patent/JP2004095547A/ja
Publication of JP2004095547A5 publication Critical patent/JP2004095547A5/ja
Application granted granted Critical
Publication of JP3685192B2 publication Critical patent/JP3685192B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003289033A 2002-08-09 2003-08-07 異方導電性コネクターおよび導電性ペースト組成物、プローブ部材並びにウエハ検査装置およびウエハ検査方法 Expired - Fee Related JP3685192B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003289033A JP3685192B2 (ja) 2002-08-09 2003-08-07 異方導電性コネクターおよび導電性ペースト組成物、プローブ部材並びにウエハ検査装置およびウエハ検査方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002232202 2002-08-09
JP2003289033A JP3685192B2 (ja) 2002-08-09 2003-08-07 異方導電性コネクターおよび導電性ペースト組成物、プローブ部材並びにウエハ検査装置およびウエハ検査方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004362952A Division JP2005166678A (ja) 2002-08-09 2004-12-15 異方導電性コネクターおよび導電性ペースト組成物

Publications (3)

Publication Number Publication Date
JP2004095547A JP2004095547A (ja) 2004-03-25
JP2004095547A5 true JP2004095547A5 (enExample) 2005-06-30
JP3685192B2 JP3685192B2 (ja) 2005-08-17

Family

ID=31711819

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2003289033A Expired - Fee Related JP3685192B2 (ja) 2002-08-09 2003-08-07 異方導電性コネクターおよび導電性ペースト組成物、プローブ部材並びにウエハ検査装置およびウエハ検査方法
JP2004362952A Pending JP2005166678A (ja) 2002-08-09 2004-12-15 異方導電性コネクターおよび導電性ペースト組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2004362952A Pending JP2005166678A (ja) 2002-08-09 2004-12-15 異方導電性コネクターおよび導電性ペースト組成物

Country Status (7)

Country Link
US (1) US7049836B2 (enExample)
EP (1) EP1553621A4 (enExample)
JP (2) JP3685192B2 (enExample)
KR (1) KR100756707B1 (enExample)
CN (1) CN100369227C (enExample)
AU (1) AU2003254853A1 (enExample)
WO (1) WO2004015760A1 (enExample)

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JP3573120B2 (ja) * 2001-08-31 2004-10-06 Ｊｓｒ株式会社 異方導電性コネクターおよびその製造方法並びにその応用製品
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
TWI239684B (en) * 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
US7446545B2 (en) * 2003-05-08 2008-11-04 Unitechno Inc. Anisotropically conductive sheet
TWI239685B (en) * 2003-05-13 2005-09-11 Jsr Corp Flaky probe, its manufacturing method and its application
US20060177971A1 (en) * 2004-01-13 2006-08-10 Jsr Corporation Anisotropically conductive connector, production process thereof and application product thereof
US7656176B2 (en) * 2004-10-29 2010-02-02 Jsr Corporation Probe member for wafer inspection, probe card for wafer inspection and wafer inspection equipment
EP1811310A4 (en) * 2004-11-12 2012-02-29 Jsr Corp SONDER TO WAFER INSPECTION, OTHER CARDS TO WAFER INSPECTION AND WAFER INSPECTION DEVICE
TWI388846B (zh) * 2005-07-14 2013-03-11 Jsr Corp An electrical impedance measuring device and a measuring method for connecting an electrical resistance measuring connector and a circuit board
US7662708B2 (en) * 2005-07-27 2010-02-16 Palo Alto Research Center Incorporated Self-assembled interconnection particles
US7504331B2 (en) * 2005-07-27 2009-03-17 Palo Alto Research Center Incorporated Method of fabricating self-assembled electrical interconnections
US7525194B2 (en) * 2005-07-27 2009-04-28 Palo Alto Research Center Incorporated System including self-assembled interconnections
US7405582B2 (en) 2006-06-01 2008-07-29 Advantest Corporation Measurement board for electronic device test apparatus
EP1972930B1 (de) * 2007-03-19 2019-11-13 Concast Ag Verfahren zur Erkennung von Oberflächenmerkmalen metallurgischer Erzeugnisse, insbesondere Strangguss- und Walzerzeugnisse, sowie eine Einrichtung zur Durchführung des Verfahrens
JP4952787B2 (ja) * 2007-03-30 2012-06-13 Ｊｓｒ株式会社 異方導電性コネクター、プローブ部材およびウエハ検査装置
KR100886712B1 (ko) * 2007-07-27 2009-03-04 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
JP2009193710A (ja) * 2008-02-12 2009-08-27 Jsr Corp 異方導電性コネクターおよびこの異方導電性コネクターを用いた回路装置の検査装置
KR100998356B1 (ko) 2008-06-04 2010-12-03 주식회사 아이에스시테크놀러지 열전달시트 및 그 열전달시트의 제조방법
KR101145886B1 (ko) * 2009-01-16 2012-05-15 주식회사 아이에스시 전기적 접속체 및 그 전기적 접속체를 포함한 테스트 소켓
JP5152099B2 (ja) 2009-05-18 2013-02-27 富士通株式会社 基板構造
JP2013007766A (ja) * 2011-06-22 2013-01-10 Japan Display Central Co Ltd 液晶表示装置
WO2014021316A1 (ja) 2012-07-31 2014-02-06 帝人株式会社 ランダムマットおよび繊維強化複合材料成形体
CA2866176C (en) * 2012-08-01 2015-04-21 Naoaki SONODA Random mat and fiber-reinforced composite material shaped product
US9142475B2 (en) * 2013-08-13 2015-09-22 Intel Corporation Magnetic contacts
KR102157942B1 (ko) 2014-09-26 2020-09-21 인텔 코포레이션 플렉시블 패키징 아키텍처
CN106568993B (zh) * 2015-10-09 2019-07-30 苍南县三维电子塑胶有限公司 可编程的显示面板检测用探针结构及检测系统
JP2018073577A (ja) * 2016-10-27 2018-05-10 株式会社エンプラス 異方導電性シート及びその製造方法
KR102180143B1 (ko) * 2017-12-29 2020-11-17 국도화학 주식회사 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및／또는 이를 포함하는 반도체 장치
WO2020075810A1 (ja) * 2018-10-11 2020-04-16 積水ポリマテック株式会社 電気接続シート、及び端子付きガラス板構造
KR102075669B1 (ko) * 2018-10-26 2020-02-10 오재숙 신호 전송 커넥터 및 그 제조방법
KR102732165B1 (ko) * 2019-03-15 2024-11-22 주식회사 아이에스시 전기접속용 커넥터
TWI750578B (zh) * 2020-02-04 2021-12-21 吳在淑 信號傳輸連接器及其製造方法
CN114413745B (zh) * 2022-01-04 2023-05-23 华北电力科学研究院有限责任公司 一种检测发电机定子绝缘受潮深度的装置及方法
KR102732569B1 (ko) * 2022-07-13 2024-11-20 주식회사 아이에스시 도전성 입자, 도전성 입자의 제조방법 및 검사용 커넥터
KR102771411B1 (ko) * 2023-06-09 2025-02-24 주식회사 티에프이 반도체 소자 테스트용 소켓

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Publication number Priority date Publication date Assignee Title
US6103359A (en) * 1996-05-22 2000-08-15 Jsr Corporation Process and apparatus for manufacturing an anisotropic conductor sheet and a magnetic mold piece for the same
JPH1140224A (ja) * 1997-07-11 1999-02-12 Jsr Corp 異方導電性シート
JP4467024B2 (ja) * 2000-06-26 2010-05-26 新日本製鐵株式会社 高潤滑防錆油組成物
US6663799B2 (en) * 2000-09-28 2003-12-16 Jsr Corporation Conductive metal particles, conductive composite metal particles and applied products using the same
JP3770126B2 (ja) * 2000-09-29 2006-04-26 Ｊｓｒ株式会社 異方導電性シートおよび回路装置の電気的検査装置
KR20030078870A (ko) * 2000-12-08 2003-10-08 제이에스알 가부시끼가이샤 이방 도전성 시트 및 웨이퍼 검사 장치
JP3543765B2 (ja) 2000-12-28 2004-07-21 Ｊｓｒ株式会社 ウエハ検査用プローブ装置

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