KR100756707B1 - 이방 도전성 커넥터 및 도전성 페이스트 조성물, 프로우브 부재 및 웨이퍼 검사 장치 - Google Patents

이방 도전성 커넥터 및 도전성 페이스트 조성물, 프로우브 부재 및 웨이퍼 검사 장치 Download PDF

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Publication number
KR100756707B1
KR100756707B1 KR1020057001118A KR20057001118A KR100756707B1 KR 100756707 B1 KR100756707 B1 KR 100756707B1 KR 1020057001118 A KR1020057001118 A KR 1020057001118A KR 20057001118 A KR20057001118 A KR 20057001118A KR 100756707 B1 KR100756707 B1 KR 100756707B1
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KR
South Korea
Prior art keywords
conductive
wafer
connection
anisotropic conductive
connector
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Expired - Lifetime
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KR1020057001118A
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English (en)
Korean (ko)
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KR20050033614A (ko
Inventor
료오지 세따까
Original Assignee
제이에스알 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)
KR1020057001118A 2002-08-09 2003-08-07 이방 도전성 커넥터 및 도전성 페이스트 조성물, 프로우브 부재 및 웨이퍼 검사 장치 Expired - Lifetime KR100756707B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002232202 2002-08-09
JPJP-P-2002-00232202 2002-08-09
PCT/JP2003/010055 WO2004015760A1 (ja) 2002-08-09 2003-08-07 異方導電性コネクターおよび導電性ペースト組成物、プローブ部材並びにウエハ検査装置およびウエハ検査方法

Publications (2)

Publication Number Publication Date
KR20050033614A KR20050033614A (ko) 2005-04-12
KR100756707B1 true KR100756707B1 (ko) 2007-09-07

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Country Status (7)

Country Link
US (1) US7049836B2 (enExample)
EP (1) EP1553621A4 (enExample)
JP (2) JP3685192B2 (enExample)
KR (1) KR100756707B1 (enExample)
CN (1) CN100369227C (enExample)
AU (1) AU2003254853A1 (enExample)
WO (1) WO2004015760A1 (enExample)

Cited By (1)

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KR100998356B1 (ko) 2008-06-04 2010-12-03 주식회사 아이에스시테크놀러지 열전달시트 및 그 열전달시트의 제조방법

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JP3573120B2 (ja) * 2001-08-31 2004-10-06 Ｊｓｒ株式会社 異方導電性コネクターおよびその製造方法並びにその応用製品
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
TWI239684B (en) * 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
US7446545B2 (en) * 2003-05-08 2008-11-04 Unitechno Inc. Anisotropically conductive sheet
TWI239685B (en) * 2003-05-13 2005-09-11 Jsr Corp Flaky probe, its manufacturing method and its application
US20060177971A1 (en) * 2004-01-13 2006-08-10 Jsr Corporation Anisotropically conductive connector, production process thereof and application product thereof
KR101167750B1 (ko) * 2004-10-29 2012-07-23 제이에스알 가부시끼가이샤 웨이퍼 검사용 탐침 부재, 웨이퍼 검사용 프로브 카드 및웨이퍼 검사 장치
TW200633314A (en) * 2004-11-12 2006-09-16 Jsr Corp Probe member for wafer inspection, probe card for wafer inspection and wafer inspection apparatus
TWI388846B (zh) * 2005-07-14 2013-03-11 Jsr Corp An electrical impedance measuring device and a measuring method for connecting an electrical resistance measuring connector and a circuit board
US7504331B2 (en) * 2005-07-27 2009-03-17 Palo Alto Research Center Incorporated Method of fabricating self-assembled electrical interconnections
US7662708B2 (en) * 2005-07-27 2010-02-16 Palo Alto Research Center Incorporated Self-assembled interconnection particles
US7525194B2 (en) * 2005-07-27 2009-04-28 Palo Alto Research Center Incorporated System including self-assembled interconnections
US7405582B2 (en) * 2006-06-01 2008-07-29 Advantest Corporation Measurement board for electronic device test apparatus
EP1972930B1 (de) * 2007-03-19 2019-11-13 Concast Ag Verfahren zur Erkennung von Oberflächenmerkmalen metallurgischer Erzeugnisse, insbesondere Strangguss- und Walzerzeugnisse, sowie eine Einrichtung zur Durchführung des Verfahrens
US8410808B2 (en) * 2007-03-30 2013-04-02 Jsr Corporation Anisotropic conductive connector, probe member and wafer inspection system
KR100886712B1 (ko) * 2007-07-27 2009-03-04 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
JP2009193710A (ja) * 2008-02-12 2009-08-27 Jsr Corp 異方導電性コネクターおよびこの異方導電性コネクターを用いた回路装置の検査装置
KR101145886B1 (ko) * 2009-01-16 2012-05-15 주식회사 아이에스시 전기적 접속체 및 그 전기적 접속체를 포함한 테스트 소켓
JP5152099B2 (ja) 2009-05-18 2013-02-27 富士通株式会社 基板構造
JP2013007766A (ja) * 2011-06-22 2013-01-10 Japan Display Central Co Ltd 液晶表示装置
KR101529850B1 (ko) * 2012-07-31 2015-06-17 데이진 가부시키가이샤 랜덤 매트 및 섬유 강화 복합재료 성형체
KR101529849B1 (ko) * 2012-08-01 2015-06-17 데이진 가부시키가이샤 랜덤 매트 및 섬유 강화 복합재료 성형체
US9142475B2 (en) * 2013-08-13 2015-09-22 Intel Corporation Magnetic contacts
CN105659375B (zh) 2014-09-26 2021-08-24 英特尔公司 柔性封装架构
CN106568993B (zh) * 2015-10-09 2019-07-30 苍南县三维电子塑胶有限公司 可编程的显示面板检测用探针结构及检测系统
JP2018073577A (ja) * 2016-10-27 2018-05-10 株式会社エンプラス 異方導電性シート及びその製造方法
KR102180143B1 (ko) * 2017-12-29 2020-11-17 국도화학 주식회사 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및／또는 이를 포함하는 반도체 장치
WO2020075810A1 (ja) * 2018-10-11 2020-04-16 積水ポリマテック株式会社 電気接続シート、及び端子付きガラス板構造
KR102075669B1 (ko) * 2018-10-26 2020-02-10 오재숙 신호 전송 커넥터 및 그 제조방법
KR102732165B1 (ko) * 2019-03-15 2024-11-22 주식회사 아이에스시 전기접속용 커넥터
TWI750578B (zh) * 2020-02-04 2021-12-21 吳在淑 信號傳輸連接器及其製造方法
CN114413745B (zh) * 2022-01-04 2023-05-23 华北电力科学研究院有限责任公司 一种检测发电机定子绝缘受潮深度的装置及方法
KR102732569B1 (ko) * 2022-07-13 2024-11-20 주식회사 아이에스시 도전성 입자, 도전성 입자의 제조방법 및 검사용 커넥터
KR102771411B1 (ko) * 2023-06-09 2025-02-24 주식회사 티에프이 반도체 소자 테스트용 소켓

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KR100998356B1 (ko) 2008-06-04 2010-12-03 주식회사 아이에스시테크놀러지 열전달시트 및 그 열전달시트의 제조방법

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Publication number Publication date
US7049836B2 (en) 2006-05-23
JP2004095547A (ja) 2004-03-25
CN100369227C (zh) 2008-02-13
CN1675757A (zh) 2005-09-28
AU2003254853A1 (en) 2004-02-25
US20050264307A1 (en) 2005-12-01
JP2005166678A (ja) 2005-06-23
WO2004015760A1 (ja) 2004-02-19
KR20050033614A (ko) 2005-04-12
EP1553621A4 (en) 2005-08-10
JP3685192B2 (ja) 2005-08-17
EP1553621A1 (en) 2005-07-13

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