JP2004071620A5 - - Google Patents
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- Publication number
- JP2004071620A5 JP2004071620A5 JP2002224751A JP2002224751A JP2004071620A5 JP 2004071620 A5 JP2004071620 A5 JP 2004071620A5 JP 2002224751 A JP2002224751 A JP 2002224751A JP 2002224751 A JP2002224751 A JP 2002224751A JP 2004071620 A5 JP2004071620 A5 JP 2004071620A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- etched
- processing method
- organic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 19
- 238000003672 processing method Methods 0.000 claims 7
- 239000011229 interlayer Substances 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002224751A JP4080272B2 (ja) | 2002-08-01 | 2002-08-01 | 基板処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002224751A JP4080272B2 (ja) | 2002-08-01 | 2002-08-01 | 基板処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004071620A JP2004071620A (ja) | 2004-03-04 |
| JP2004071620A5 true JP2004071620A5 (enExample) | 2005-10-27 |
| JP4080272B2 JP4080272B2 (ja) | 2008-04-23 |
Family
ID=32012627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002224751A Expired - Fee Related JP4080272B2 (ja) | 2002-08-01 | 2002-08-01 | 基板処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4080272B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5019741B2 (ja) * | 2005-11-30 | 2012-09-05 | 東京エレクトロン株式会社 | 半導体装置の製造方法および基板処理システム |
| KR100824623B1 (ko) | 2006-12-05 | 2008-04-25 | 동부일렉트로닉스 주식회사 | 반도체 소자 형성 방법 |
-
2002
- 2002-08-01 JP JP2002224751A patent/JP4080272B2/ja not_active Expired - Fee Related
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