JP2004047722A - Ｉｃチップの製造方法 - Google Patents

Ｉｃチップの製造方法 Download PDF

Info

Publication number
JP2004047722A
JP2004047722A JP2002202990A JP2002202990A JP2004047722A JP 2004047722 A JP2004047722 A JP 2004047722A JP 2002202990 A JP2002202990 A JP 2002202990A JP 2002202990 A JP2002202990 A JP 2002202990A JP 2004047722 A JP2004047722 A JP 2004047722A
Authority
JP
Japan
Prior art keywords
wafer
double
adhesive tape
pressure
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002202990A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004047722A5 (cg-RX-API-DMAC7.html
Inventor
Munehiro Hatakei
畠井　宗宏
Masateru Fukuoka
福岡　正輝
Satoshi Hayashi
林　聡史
Shigeru Danjo
檀上　滋
Yasuhiko Oyama
大山　康彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2002202990A priority Critical patent/JP2004047722A/ja
Publication of JP2004047722A publication Critical patent/JP2004047722A/ja
Publication of JP2004047722A5 publication Critical patent/JP2004047722A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2002202990A 2002-07-11 2002-07-11 Ｉｃチップの製造方法 Withdrawn JP2004047722A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002202990A JP2004047722A (ja) 2002-07-11 2002-07-11 Ｉｃチップの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002202990A JP2004047722A (ja) 2002-07-11 2002-07-11 Ｉｃチップの製造方法

Publications (2)

Publication Number Publication Date
JP2004047722A true JP2004047722A (ja) 2004-02-12
JP2004047722A5 JP2004047722A5 (cg-RX-API-DMAC7.html) 2005-02-17

Family

ID=31709016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002202990A Withdrawn JP2004047722A (ja) 2002-07-11 2002-07-11 Ｉｃチップの製造方法

Country Status (1)

Country Link
JP (1) JP2004047722A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014082380A (ja) * 2012-10-17 2014-05-08 Disco Abrasive Syst Ltd 表面保護テープの剥離方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014082380A (ja) * 2012-10-17 2014-05-08 Disco Abrasive Syst Ltd 表面保護テープの剥離方法

Similar Documents

Publication Publication Date Title
CN1322554C (zh) Ic片的生产方法
JP2005197630A (ja) Ｉｃチップの製造方法
JP2003231872A (ja) 両面粘着テープ及びそれを用いたｉｃチップの製造方法
JP4404526B2 (ja) 接着性物質、片面粘着テープ及び両面粘着テープ
JP2004228539A (ja) Ｉｃチップの製造方法
JP2004186280A (ja) ウエハ貼着用粘着シート及び半導体装置の製造方法
JP3787526B2 (ja) Ｉｃチップの製造方法
JP2004182799A (ja) 両面粘着テープ
JP4540642B2 (ja) 半導体の製造方法
JP2006013000A (ja) Ｉｃチップの製造方法
JP3965055B2 (ja) Ｉｃチップの製造方法
JP2004153227A (ja) Ｉｃチップの製造方法
JP4638172B2 (ja) Ｉｃチップの製造方法及びｉｃチップの製造装置
WO2005055299A1 (ja) 半導体チップの製造方法
JP2003231871A (ja) 両面粘着テープ及びそれを用いたｉｃチップの製造方法
JP2004047722A (ja) Ｉｃチップの製造方法
JP2005294535A (ja) ダイアタッチフィルム付きｉｃチップの製造方法
JP2005123403A (ja) Ｉｃチップの製造方法及びｉｃチップの製造装置
JP2004186261A (ja) Ｉｃチップの製造方法
JP4804719B2 (ja) 半導体チップの製造方法
JP2003173989A (ja) Ｉｃチップの製造方法
JP2004006522A (ja) Ｉｃチップの製造方法
JP2004001131A (ja) Ｉｃチップ製造用粘着シート及びｉｃチップの製造方法
JP2004186281A (ja) Ｉｃチップの製造方法
JP2005057046A (ja) Ｉｃチップの製造方法及びｉｃチップの製造装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040309

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050615

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20051228