JP2004031562A5 - - Google Patents

Download PDF

Info

Publication number
JP2004031562A5
JP2004031562A5 JP2002184317A JP2002184317A JP2004031562A5 JP 2004031562 A5 JP2004031562 A5 JP 2004031562A5 JP 2002184317 A JP2002184317 A JP 2002184317A JP 2002184317 A JP2002184317 A JP 2002184317A JP 2004031562 A5 JP2004031562 A5 JP 2004031562A5
Authority
JP
Japan
Prior art keywords
wiring
main surface
semiconductor chip
electrically connected
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002184317A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004031562A (ja
JP4030363B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002184317A priority Critical patent/JP4030363B2/ja
Priority claimed from JP2002184317A external-priority patent/JP4030363B2/ja
Publication of JP2004031562A publication Critical patent/JP2004031562A/ja
Publication of JP2004031562A5 publication Critical patent/JP2004031562A5/ja
Application granted granted Critical
Publication of JP4030363B2 publication Critical patent/JP4030363B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002184317A 2002-06-25 2002-06-25 半導体装置 Expired - Fee Related JP4030363B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002184317A JP4030363B2 (ja) 2002-06-25 2002-06-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002184317A JP4030363B2 (ja) 2002-06-25 2002-06-25 半導体装置

Publications (3)

Publication Number Publication Date
JP2004031562A JP2004031562A (ja) 2004-01-29
JP2004031562A5 true JP2004031562A5 (enExample) 2005-10-13
JP4030363B2 JP4030363B2 (ja) 2008-01-09

Family

ID=31180265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002184317A Expired - Fee Related JP4030363B2 (ja) 2002-06-25 2002-06-25 半導体装置

Country Status (1)

Country Link
JP (1) JP4030363B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3918842B2 (ja) 2004-09-03 2007-05-23 ヤマハ株式会社 半導体素子及びそれを備えたワイヤボンディング・チップサイズ・パッケージ
JP5557439B2 (ja) * 2008-10-24 2014-07-23 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法
JP7020629B2 (ja) * 2020-12-04 2022-02-16 ラピスセミコンダクタ株式会社 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3250941B2 (ja) * 1995-05-12 2002-01-28 京セラ株式会社 配線基板
JP3658162B2 (ja) * 1997-11-28 2005-06-08 株式会社ルネサステクノロジ 半導体装置
JP2000236040A (ja) * 1999-02-15 2000-08-29 Hitachi Ltd 半導体装置

Similar Documents

Publication Publication Date Title
US7473584B1 (en) Method for fabricating a fan-in leadframe semiconductor package
JP2004063767A5 (enExample)
JP2006093189A5 (enExample)
JP2007149977A5 (enExample)
JP2003031730A5 (enExample)
JP2006060128A (ja) 半導体装置
WO2003005445A1 (en) Semiconductor device and semiconductor module
JP7503058B2 (ja) 電子装置および電子装置の実装構造
JP2003332513A5 (enExample)
JP2004103843A5 (enExample)
JP2001156251A (ja) 半導体装置
CN112885808B (zh) 封装基板以及封装结构
US20080157324A1 (en) Stacked die package with die interconnects
JP2004031562A5 (enExample)
JP3942495B2 (ja) 半導体装置
JP3150560B2 (ja) 半導体装置
JP2000349306A (ja) 集光レンズ付き半導体装置
JP2004047715A (ja) 半導体接続中継部材及び半導体装置
JP3297959B2 (ja) 半導体装置
JP2001035994A5 (enExample)
JP3251688B2 (ja) 半導体素子搭載用リードフレーム
JP2004031432A5 (enExample)
JP2587722Y2 (ja) 半導体装置
JP2007134618A5 (enExample)
JP2005150294A5 (enExample)