JP2004031451A5 - - Google Patents

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Publication number
JP2004031451A5
JP2004031451A5 JP2002182099A JP2002182099A JP2004031451A5 JP 2004031451 A5 JP2004031451 A5 JP 2004031451A5 JP 2002182099 A JP2002182099 A JP 2002182099A JP 2002182099 A JP2002182099 A JP 2002182099A JP 2004031451 A5 JP2004031451 A5 JP 2004031451A5
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JP
Japan
Prior art keywords
lead terminal
semiconductor chip
wire
capillary
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002182099A
Other languages
English (en)
Japanese (ja)
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JP2004031451A (ja
JP3923379B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002182099A priority Critical patent/JP3923379B2/ja
Priority claimed from JP2002182099A external-priority patent/JP3923379B2/ja
Publication of JP2004031451A publication Critical patent/JP2004031451A/ja
Publication of JP2004031451A5 publication Critical patent/JP2004031451A5/ja
Application granted granted Critical
Publication of JP3923379B2 publication Critical patent/JP3923379B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002182099A 2002-06-21 2002-06-21 半導体装置 Expired - Fee Related JP3923379B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002182099A JP3923379B2 (ja) 2002-06-21 2002-06-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002182099A JP3923379B2 (ja) 2002-06-21 2002-06-21 半導体装置

Publications (3)

Publication Number Publication Date
JP2004031451A JP2004031451A (ja) 2004-01-29
JP2004031451A5 true JP2004031451A5 (enExample) 2005-10-20
JP3923379B2 JP3923379B2 (ja) 2007-05-30

Family

ID=31178752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002182099A Expired - Fee Related JP3923379B2 (ja) 2002-06-21 2002-06-21 半導体装置

Country Status (1)

Country Link
JP (1) JP3923379B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4298665B2 (ja) 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法
JP2011023768A (ja) * 2010-11-05 2011-02-03 Fuji Electric Systems Co Ltd 半導体装置の製造方法
JP6092084B2 (ja) * 2013-11-29 2017-03-08 アオイ電子株式会社 半導体装置および半導体装置の製造方法

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