CN202307872U - 方形扁平无引脚封装结构 - Google Patents

方形扁平无引脚封装结构 Download PDF

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CN202307872U
CN202307872U CN 201120351131 CN201120351131U CN202307872U CN 202307872 U CN202307872 U CN 202307872U CN 201120351131 CN201120351131 CN 201120351131 CN 201120351131 U CN201120351131 U CN 201120351131U CN 202307872 U CN202307872 U CN 202307872U
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lead
wire
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陈庠稀
陈思翰
郑勇
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SHENZHEN ZHONGXINGHUA ELECTRONICS CO LTD
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    • H—ELECTRICITY
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    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/48997—Reinforcing structures
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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Abstract

一种方形扁平无引脚封装结构包括芯片、引线、支架和植球。引线的一端与芯片连接。支架设有内引脚，引线的另一端与内引脚连接。植球位于引线与芯片的连接部及引线与支架的连接部，通过植球固定连接引线与连接部。在芯片和支架上设有植球，引线与芯片连接时，引线先与植球连接形成共金熔合，达到了很好的连接作用。植球与芯片或支架连接时，植球的横截面积要远远大于引线的横截面积，所以植球与芯片及支架结合的受力面积也大，能够有效的缓解外界对连接部的压力，植球与芯片及支架能够稳固连接。所以上述方形扁平无引脚封装结构各元件之间能够形成稳固连接。

Description

方形扁平无引脚封装结构
【技术领域】
本实用新型涉及一种封装结构，特别是涉及一种芯片封装结构。
【背景技术】
封装是电子器件制造过程中一个非常重要的步骤，通过封装过程，可以将各种芯片(chip die)直接电路引出，以便于与外界电路点连接。对于不同型号的芯片，通常会选择合适的封装形式。为了使用电子器件的小型化发展，芯片封装结构也要求小型化、薄型化发展。其中，方形扁平无引脚封装(QFN)是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。由于底部中央大面积暴露的焊盘被焊接到PCB的散热焊盘上，使得QFN具有较好的导电和散热性能。
目前大多数方形扁平无引脚封装技术中，芯片直接通过引线连接在支架上。由于支架的材质较硬，引线在与支架连接的过程中，不容易与支架形成共金熔合，在焊接使用过程中容易发生脱落，降低了生产效率。
【实用新型内容】
基于此，有必要提供一种能够使引线与芯片及支架之间形成稳固连接的方形扁平无引脚封装结构。
一种方形扁平无引脚封装结构包括芯片、引线、支架和植球。引线的一端与芯片连接。支架设有内引脚，引线的另一端与内引脚连接。植球位于引线与芯片的连接部及引线与支架的连接部，通过植球固定连接引线与连接部。
在封装过程中，如果用引线直接连接芯片或是支架上，由于引线的横截面积很小，焊接在芯片或是支架上的接触面积也会很小，所以容易在封装的时候引线脱落。但是，在芯片上设有植球，引线与芯片连接时，引线先与植球连接，植球较容易的与引线共金熔合，达到了很好的连接作用。植球与芯片连接时，植球的横截面积要远远大于引线的横截面积，所以植球与芯片结合的受力面积也大，能够有效的缓解外界对连接部的压力，植球与芯片能够稳固连接。同理，引线与支架连接时，引线先与植球连接，引线与植球共金熔合，再将植球连接在支架的内引脚上，植球与内引脚连接的受力面积远远大于引线直接焊接在内引脚上的受力面积。所以引线与支架的内引脚形成稳固连接。综上所述，通过植球连接，使引线与芯片和支架形成稳固连接。
进一步地，引线为曲线状的合金线。
使用合金线作为引线，节约了成本。
进一步地，植球为与引线的材料相同的球缺结构。
植球和引线的材料相同，引线与植球能够更容易的形成共金熔合，使得引线连接地更加稳固。
进一步地，支架表面镀有钯薄层结构。
钯具有良好的耐高温性与耐氧化性，具有良好的结合性和焊接性，并且钯硬度高，具有一点的耐磨性。支架具有镀钯膜可以提高支架与引线的连接强度。
进一步地，方形扁平无引脚封装结构还包括芯片底座，芯片固定在芯片底座上。
芯片底座位于芯片的下方，提高了芯片的散热性能。
进一步地，方形扁平无引脚封装结构还包括位于芯片与芯片底座之间的导电连接层，用于固定连接芯片。
导电连接层是一种固化干燥后具有一定导电性能的胶黏剂，并且可以选择适宜的固化温度进行粘接。可以避免了焊接高温可能导致的材料变形、电子器件的热损伤和内应力的形成。而且导电连接层工艺简单，易于操作，可提高生产效率，也避免了锡铅焊料中重金属铅引起的环境污染。
进一步地，方形扁平无引脚封装结构还包括环氧树脂材质的密封胶层，所述密封胶层封装在所述芯片和支架上。
密封胶层封装芯片和支架，与外界空气形成隔离，保护芯片、支架及各连接关系。并且能够固定元件的位置关系及连接关系。
【附图说明】
图1为一实施例的方形扁平无引脚封装结构的内部结构示意图；
图2为图1方形扁平无引脚封装结构的内部结构示意图中虚线部分的结构放大图。
【具体实施方式】
为了便于理解本实用新型，下面将参照相关附图对本实用新型进行更全面的描述。附图中给出了本实用新型的较佳实施例。但是，本实用新型可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本实用新型的公开内容理解的更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本实用新型的技术领域的技术人员通常理解的含义相同。本文中在本实用新型的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本实用新型。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请参阅图1，方形扁平无引脚封装结构100包括芯片110、引线120、支架130和植球140。
引线120的一端与芯片110连接。引线120为合金线。在本实施例中，引线120采用曲线状的银合金线。
支架130设有内引脚(图未示)，引线120的另一端与内引脚连接。支架130为镀钯支架。
请同时参阅图2，植球140位于引线120与芯片110的连接部(图未标)及引线120与支架130的连接部(图未标)，通过植球140固定连接引线120与连接部。植球140为与引线120的材料相同的球缺结构。
在芯片110上设有植球140，引线120与芯片110连接时，引线120先与植球140连接，植球140较容易的与引线120共金熔合。并且，植球140和引线120的材料相同，引线120与植球140能够更容易的形成共金熔合，使得引线120连接地更加稳固，达到了很好的连接作用。使用合金线作为引线120，节约了成本。植球140与芯片110连接时，植球140的横截面积要远远大于引线120的横截面积，所以植球140与芯片110结合的受力面积也大，能够有效的缓解外界对连接部的压力，植球140与芯片110能够稳固连接。同理，引线120与支架130连接时，引线120先与植球140连接，引线120与植球140共金熔合，再将植球140连接在支架130的内引脚上，植球140与内引脚连接的受力面积远远大于引线120直接焊接在内引脚上的受力面积。支架130表面镀有钯薄层结构(图未示)。钯具有良好的耐高温性与耐氧化性，具有良好的结合性和焊接性，并且钯硬度高，具有一定的耐磨性。支架130具有钯薄层结构可以提高支架130与引线120的连接强度，所以引线120与支架130的内引脚形成稳固连接。综上所述，通过植球140连接，使引线120与芯片110和支架130形成稳固连接。
方形扁平无引脚封装结构100还包括芯片底座150，芯片110固定在芯片底座150上。
芯片底座150位于芯片110的下方，芯片底座150是由散热性能良好的材料制成的，提高了芯片110的散热性能。
方形扁平无引脚封装结构100还包括导电连接层160，导电连接层160位于芯片110与芯片底座150之间，用于固定连接芯片110。
在本实施例中，导电连接层160采用导电银胶。导电银胶是一种固化干燥后具有一定导电性能的胶黏剂，并且可以选择适宜的固化温度进行粘接。可以避免了焊接高温可能导致的材料变形、电子器件的热损伤和内应力的形成。而且导电连接层160工艺简单，易于操作，可提高生产效率，也避免了锡铅焊料中重金属铅引起的环境污染。
方形扁平无引脚封装结构100还包括环氧树脂材质的密封胶层170，密封胶层170封装在芯片110和支架130上。
密封胶层170利用高温高压法封装芯片110和支架130，与外界空气形成隔离，保护芯片110、支架130及各连接关系。并且能够固定元件的位置关系及连接关系。此时导电连接层160对芯片110还可以起到缓冲压力的作用，防止压力过大而对芯片110造成伤害。
以上所述实施例仅表达了本实用新型的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本实用新型专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本实用新型构思的前提下，还可以做出若干变形和改进，这些都属于本实用新型的保护范围。因此，本实用新型专利的保护范围应以所附权利要求为准。

Claims (7)

1.一种方形扁平无引脚封装结构，其特征在于，所述方形扁平无引脚封装结构包括：
芯片；
引线，其一端与所述芯片连接；
支架，设有内引脚，所述引线的另一端与所述内引脚连接；及
植球，位于所述引线与所述芯片的连接部及所述引线与所述支架的连接部，通过所述植球固定连接所述引线与所述连接部。
2.根据权利要求1所述的方形扁平无引脚封装结构，其特征在于，所述引线为曲线状的合金线。
3.根据权利要求1所述的方形扁平无引脚封装结构，其特征在于，所述植球为与所述引线的材料相同的球缺结构。
4.根据权利要求1所述的方形扁平无引脚封装结构，其特征在于，所述支架表面镀有钯薄层结构。
5.根据权利要求1所述的方形扁平无引脚封装结构，其特征在于，所述方形扁平无引脚封装结构还包括芯片底座，所述芯片固定在所述芯片底座上。
6.根据权利要求5所述的方形扁平无引脚封装结构，其特征在于，所述方形扁平无引脚封装结构还包括位于所述芯片与所述芯片底座之间的导电连接层，用于固定连接所述芯片。
7.根据权利要求1所述的方形扁平无引脚封装结构，其特征在于，所述方形扁平无引脚封装结构还包括环氧树脂材质的密封胶层，所述密封胶层封装在所述芯片和支架上。
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Publication number Priority date Publication date Assignee Title
CN113782454A (zh) * 2021-09-07 2021-12-10 西安微电子技术研究所 一种实现无预镀层引线框架表面引线键合的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113782454A (zh) * 2021-09-07 2021-12-10 西安微电子技术研究所 一种实现无预镀层引线框架表面引线键合的方法

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