JP3923379B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP3923379B2
JP3923379B2 JP2002182099A JP2002182099A JP3923379B2 JP 3923379 B2 JP3923379 B2 JP 3923379B2 JP 2002182099 A JP2002182099 A JP 2002182099A JP 2002182099 A JP2002182099 A JP 2002182099A JP 3923379 B2 JP3923379 B2 JP 3923379B2
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Japan
Prior art keywords
wire
semiconductor chip
pad
lead terminal
ball
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Expired - Fee Related
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JP2002182099A
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English (en)
Japanese (ja)
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JP2004031451A (ja
JP2004031451A5 (enExample
Inventor
和子 鳴瀧
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Renesas Technology Corp
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Renesas Technology Corp
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Publication of JP2004031451A5 publication Critical patent/JP2004031451A5/ja
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  • Computer Hardware Design (AREA)
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  • Wire Bonding (AREA)
JP2002182099A 2002-06-21 2002-06-21 半導体装置 Expired - Fee Related JP3923379B2 (ja)

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Application Number Priority Date Filing Date Title
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