JP2004022655A - 半導体露光装置及びその制御方法、並びに半導体デバイスの製造方法 - Google Patents

半導体露光装置及びその制御方法、並びに半導体デバイスの製造方法 Download PDF

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Publication number
JP2004022655A
JP2004022655A JP2002172829A JP2002172829A JP2004022655A JP 2004022655 A JP2004022655 A JP 2004022655A JP 2002172829 A JP2002172829 A JP 2002172829A JP 2002172829 A JP2002172829 A JP 2002172829A JP 2004022655 A JP2004022655 A JP 2004022655A
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JP
Japan
Prior art keywords
wafer
height information
exposure
exposure apparatus
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002172829A
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English (en)
Japanese (ja)
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JP2004022655A5 (https=
Inventor
Toshinobu Tokita
時田　俊伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2002172829A priority Critical patent/JP2004022655A/ja
Priority to US10/454,577 priority patent/US6876438B2/en
Priority to EP03253658A priority patent/EP1372041A3/en
Publication of JP2004022655A publication Critical patent/JP2004022655A/ja
Publication of JP2004022655A5 publication Critical patent/JP2004022655A5/ja
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2002172829A 2002-06-13 2002-06-13 半導体露光装置及びその制御方法、並びに半導体デバイスの製造方法 Withdrawn JP2004022655A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002172829A JP2004022655A (ja) 2002-06-13 2002-06-13 半導体露光装置及びその制御方法、並びに半導体デバイスの製造方法
US10/454,577 US6876438B2 (en) 2002-06-13 2003-06-05 Semiconductor exposure apparatus, control method therefor, and semiconductor device manufacturing method
EP03253658A EP1372041A3 (en) 2002-06-13 2003-06-10 Control of an apparatus for exposing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002172829A JP2004022655A (ja) 2002-06-13 2002-06-13 半導体露光装置及びその制御方法、並びに半導体デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2004022655A true JP2004022655A (ja) 2004-01-22
JP2004022655A5 JP2004022655A5 (https=) 2005-10-20

Family

ID=29561798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002172829A Withdrawn JP2004022655A (ja) 2002-06-13 2002-06-13 半導体露光装置及びその制御方法、並びに半導体デバイスの製造方法

Country Status (3)

Country Link
US (1) US6876438B2 (https=)
EP (1) EP1372041A3 (https=)
JP (1) JP2004022655A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014007218A (ja) * 2012-06-22 2014-01-16 Canon Inc 露光装置、露光システム、それらを用いたデバイスの製造方法
JP2014041211A (ja) * 2012-08-21 2014-03-06 Canon Inc 露光システム、露光装置、それを用いたデバイスの製造方法
JP2015005666A (ja) * 2013-06-21 2015-01-08 キヤノン株式会社 露光装置、情報管理装置、露光システムおよびデバイス製造方法
US11467505B2 (en) 2016-11-02 2022-10-11 Asml Netherlands B.V. Height sensor, lithographic apparatus and method for manufacturing devices

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7170075B2 (en) * 2002-07-18 2007-01-30 Rudolph Technologies, Inc. Inspection tool with a 3D point sensor to develop a focus map
JP4028814B2 (ja) * 2003-04-21 2007-12-26 川崎重工業株式会社 マッピング装置
US7196300B2 (en) * 2003-07-18 2007-03-27 Rudolph Technologies, Inc. Dynamic focusing method and apparatus
JP2005191393A (ja) * 2003-12-26 2005-07-14 Canon Inc 露光方法及び装置
JP2006165371A (ja) * 2004-12-09 2006-06-22 Canon Inc 転写装置およびデバイス製造方法
JP2009200105A (ja) * 2008-02-19 2009-09-03 Canon Inc 露光装置
WO2012081234A1 (ja) * 2010-12-14 2012-06-21 株式会社ニコン 露光方法及び露光装置、並びにデバイス製造方法
EP2752870A1 (en) * 2013-01-04 2014-07-09 Süss Microtec Lithography GmbH Chuck, in particular for use in a mask aligner
JP7218262B2 (ja) * 2019-09-12 2023-02-06 株式会社日立ハイテク パターン高さ情報補正システム及びパターン高さ情報の補正方法
CN117930602B (zh) * 2024-03-21 2024-07-02 上海图双精密装备有限公司 掩膜对准系统和方法、以及光刻机

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2770960B2 (ja) 1988-10-06 1998-07-02 キヤノン株式会社 Ｓｏｒ−ｘ線露光装置
JPH05152186A (ja) * 1991-05-01 1993-06-18 Canon Inc 測定装置及び露光装置及び露光装置の位置決め方法
US5777722A (en) * 1994-04-28 1998-07-07 Nikon Corporation Scanning exposure apparatus and method
JP3555230B2 (ja) * 1994-05-18 2004-08-18 株式会社ニコン 投影露光装置
JP3634068B2 (ja) * 1995-07-13 2005-03-30 株式会社ニコン 露光方法及び装置
JP3376179B2 (ja) * 1995-08-03 2003-02-10 キヤノン株式会社 面位置検出方法
JP3377165B2 (ja) 1997-05-19 2003-02-17 キヤノン株式会社 半導体露光装置
JP4208277B2 (ja) * 1997-11-26 2009-01-14 キヤノン株式会社 露光方法及び露光装置
JP4095186B2 (ja) * 1998-11-20 2008-06-04 キヤノン株式会社 露光方法
JP2000228355A (ja) 1998-12-04 2000-08-15 Canon Inc 半導体露光装置およびデバイス製造方法
EP1037117A3 (en) * 1999-03-08 2003-11-12 ASML Netherlands B.V. Off-axis levelling in lithographic projection apparatus
JP4585649B2 (ja) * 2000-05-19 2010-11-24 キヤノン株式会社 露光装置およびデバイス製造方法
KR100471018B1 (ko) * 2000-11-28 2005-03-08 스미도모쥬기가이고교 가부시키가이샤 두 개의 대상물 간의 갭 조절장치 및 조절방법
US6836316B2 (en) 2001-07-26 2004-12-28 Canon Kabushiki Kaisha Substrate holding apparatus and exposure apparatus using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014007218A (ja) * 2012-06-22 2014-01-16 Canon Inc 露光装置、露光システム、それらを用いたデバイスの製造方法
JP2014041211A (ja) * 2012-08-21 2014-03-06 Canon Inc 露光システム、露光装置、それを用いたデバイスの製造方法
JP2015005666A (ja) * 2013-06-21 2015-01-08 キヤノン株式会社 露光装置、情報管理装置、露光システムおよびデバイス製造方法
US11467505B2 (en) 2016-11-02 2022-10-11 Asml Netherlands B.V. Height sensor, lithographic apparatus and method for manufacturing devices

Also Published As

Publication number Publication date
EP1372041A2 (en) 2003-12-17
US6876438B2 (en) 2005-04-05
EP1372041A3 (en) 2006-01-11
US20030230730A1 (en) 2003-12-18

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