JP2004022290A5 - - Google Patents
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- Publication number
- JP2004022290A5 JP2004022290A5 JP2002174419A JP2002174419A JP2004022290A5 JP 2004022290 A5 JP2004022290 A5 JP 2004022290A5 JP 2002174419 A JP2002174419 A JP 2002174419A JP 2002174419 A JP2002174419 A JP 2002174419A JP 2004022290 A5 JP2004022290 A5 JP 2004022290A5
- Authority
- JP
- Japan
- Prior art keywords
- lead
- chip
- pair
- mounting structure
- members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 238000002788 crimping Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002174419A JP2004022290A (ja) | 2002-06-14 | 2002-06-14 | チップタイプ温度ヒューズの実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002174419A JP2004022290A (ja) | 2002-06-14 | 2002-06-14 | チップタイプ温度ヒューズの実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004022290A JP2004022290A (ja) | 2004-01-22 |
| JP2004022290A5 true JP2004022290A5 (enExample) | 2005-10-13 |
Family
ID=31173389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002174419A Pending JP2004022290A (ja) | 2002-06-14 | 2002-06-14 | チップタイプ温度ヒューズの実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004022290A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6231324B2 (ja) * | 2013-08-07 | 2017-11-15 | デクセリアルズ株式会社 | 保護回路基板 |
| US10032583B2 (en) | 2016-02-17 | 2018-07-24 | Dexerials Corporation | Protective circuit substrate |
-
2002
- 2002-06-14 JP JP2002174419A patent/JP2004022290A/ja active Pending
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