JP2003288827A5 - - Google Patents
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- Publication number
- JP2003288827A5 JP2003288827A5 JP2002089270A JP2002089270A JP2003288827A5 JP 2003288827 A5 JP2003288827 A5 JP 2003288827A5 JP 2002089270 A JP2002089270 A JP 2002089270A JP 2002089270 A JP2002089270 A JP 2002089270A JP 2003288827 A5 JP2003288827 A5 JP 2003288827A5
- Authority
- JP
- Japan
- Prior art keywords
- chip
- lead
- circuit board
- printed circuit
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002844 melting Methods 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 3
- 238000003466 welding Methods 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 238000002788 crimping Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002089270A JP2003288827A (ja) | 2002-03-27 | 2002-03-27 | チップタイプ温度ヒューズおよびその実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002089270A JP2003288827A (ja) | 2002-03-27 | 2002-03-27 | チップタイプ温度ヒューズおよびその実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003288827A JP2003288827A (ja) | 2003-10-10 |
| JP2003288827A5 true JP2003288827A5 (enExample) | 2005-08-25 |
Family
ID=29234894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002089270A Pending JP2003288827A (ja) | 2002-03-27 | 2002-03-27 | チップタイプ温度ヒューズおよびその実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003288827A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005024321B8 (de) | 2005-05-27 | 2012-10-04 | Infineon Technologies Ag | Absicherungsschaltung |
| DE102005024347B8 (de) | 2005-05-27 | 2010-07-08 | Infineon Technologies Ag | Elektrisches Bauteil mit abgesichertem Stromzuführungsanschluss |
| DE102005024346B4 (de) * | 2005-05-27 | 2012-04-26 | Infineon Technologies Ag | Sicherungselement mit Auslöseunterstützung |
| DE102008020912A1 (de) * | 2008-04-17 | 2009-10-22 | Varta Microbattery Gmbh | Galvanische Zelle mit irreversibler Sicherung |
| CN103722260A (zh) * | 2013-12-12 | 2014-04-16 | 成都赛英科技有限公司 | 锡焊微封装管芯工艺 |
-
2002
- 2002-03-27 JP JP2002089270A patent/JP2003288827A/ja active Pending
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