JP2003288827A5 - - Google Patents

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Publication number
JP2003288827A5
JP2003288827A5 JP2002089270A JP2002089270A JP2003288827A5 JP 2003288827 A5 JP2003288827 A5 JP 2003288827A5 JP 2002089270 A JP2002089270 A JP 2002089270A JP 2002089270 A JP2002089270 A JP 2002089270A JP 2003288827 A5 JP2003288827 A5 JP 2003288827A5
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JP
Japan
Prior art keywords
chip
lead
circuit board
printed circuit
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002089270A
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Japanese (ja)
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JP2003288827A (en
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Publication date
Application filed filed Critical
Priority to JP2002089270A priority Critical patent/JP2003288827A/en
Priority claimed from JP2002089270A external-priority patent/JP2003288827A/en
Publication of JP2003288827A publication Critical patent/JP2003288827A/en
Publication of JP2003288827A5 publication Critical patent/JP2003288827A5/ja
Pending legal-status Critical Current

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Claims (5)

絶縁ケ−ス部材に固定された一対のリ−ド部材と、このリード部材間に架設したフラックスを被着した低融点可溶合金と、前記絶縁ケ−ス部材の開口をカバーする絶縁キャップ部材とにより構成され、前記絶縁キャップ部材および前記絶縁ケース部材が熱可塑性樹脂の成形体からなりカバ−合体面に係留シ−ル手段を形成して気密パッケージ化したことを特徴とするチップタイプ温度ヒューズ。A pair of lead members fixed to the insulating case member, a low melting point soluble alloy coated with a flux laid between the lead members, and an insulating cap member covering the opening of the insulating case member A chip-type thermal fuse , wherein the insulating cap member and the insulating case member are formed of a thermoplastic resin molded body, and are formed into an airtight package by forming a mooring seal means on a cover combining surface. . 前記一対のリ−ド部材は電極部と導出部を有し、ニッケル、りん青銅、鉄の平板状導体からなり、前記電極部をめっき処理して前記低融点可溶合金の溶着を容易にしたことを特徴とする請求項１に記載のチップタイプ温度ヒュ−ズ。 The pair of lead members have an electrode portion and a lead portion, and are made of a flat conductor of nickel, phosphor bronze, and iron, and the electrode portion is plated to facilitate the welding of the low melting point soluble alloy. The chip-type temperature fuse according to claim 1. 請求項１および２に記載のチップタイプ温度ヒューズをプリント基板へ実装する構造であって、前記一対のリ−ド部材の導出部と前記プリント基板の配線パターンとを超音波接合、摩擦圧接、熱圧着、抵抗溶接のいずれかの方法で、かつ印刷金属、アモルファス銅、インジウム、はんだチップなどの低融点化物質を介在させ電気機械的に結合したチップタイプ温度ヒューズの実装構造。3. A structure in which the chip-type thermal fuse according to claim 1 or 2 is mounted on a printed circuit board, wherein the lead-out portion of the pair of lead members and the wiring pattern of the printed circuit board are joined by ultrasonic bonding, friction welding, heat A chip-type thermal fuse mounting structure that is electromechanically coupled by either a crimping method or resistance welding method and interposing a low melting point material such as printed metal, amorphous copper, indium, or solder chip. 前記プリント基板は前記チップタイプ温度ヒュ−ズの収納手段を配置位置に形成し、前記一対のリ−ド部材の導出部をほぼフラット状態で前記配線パタ−ン間に結合したことを特徴とする請求項３に記載のチップタイプ温度ヒュ−ズの実装構造。The printed circuit board is characterized in that the chip type temperature fuse storage means is formed at an arrangement position, and the lead-out portions of the pair of lead members are coupled between the wiring patterns in a substantially flat state. The mounting structure of the chip type temperature fuse according to claim 3. 前記収納手段が前記チップタイプ温度ヒュ−ズの絶縁ケース部材を収容する切り欠きであり、前記プリント基板の両面から温度検知できるようしたことを特徴とする請求項４に記載のチップタイプ温度ヒューズの実装構造。5. The chip-type thermal fuse according to claim 4, wherein the housing means is a notch that houses an insulating case member of the chip-type temperature fuse, and the temperature can be detected from both sides of the printed circuit board. Mounting structure.
JP2002089270A 2002-03-27 2002-03-27 Chip type temperature fuse and its mounting structure Pending JP2003288827A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002089270A JP2003288827A (en) 2002-03-27 2002-03-27 Chip type temperature fuse and its mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002089270A JP2003288827A (en) 2002-03-27 2002-03-27 Chip type temperature fuse and its mounting structure

Publications (2)

Publication Number Publication Date
JP2003288827A JP2003288827A (en) 2003-10-10
JP2003288827A5 true JP2003288827A5 (en) 2005-08-25

Family

ID=29234894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002089270A Pending JP2003288827A (en) 2002-03-27 2002-03-27 Chip type temperature fuse and its mounting structure

Country Status (1)

Country Link
JP (1) JP2003288827A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005024346B4 (en) 2005-05-27 2012-04-26 Infineon Technologies Ag Fuse element with trigger support
DE102005024347B8 (en) 2005-05-27 2010-07-08 Infineon Technologies Ag Electrical component with fused power supply connection
DE102005024321B8 (en) 2005-05-27 2012-10-04 Infineon Technologies Ag protection circuit
DE102008020912A1 (en) * 2008-04-17 2009-10-22 Varta Microbattery Gmbh Galvanic cell with irreversible fuse
CN103722260A (en) * 2013-12-12 2014-04-16 成都赛英科技有限公司 Tin soldering micro-packaging process of dies

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