DE102005024321B8 - Absicherungsschaltung - Google Patents

Absicherungsschaltung Download PDF

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Publication number
DE102005024321B8
DE102005024321B8 DE102005024321A DE102005024321A DE102005024321B8 DE 102005024321 B8 DE102005024321 B8 DE 102005024321B8 DE 102005024321 A DE102005024321 A DE 102005024321A DE 102005024321 A DE102005024321 A DE 102005024321A DE 102005024321 B8 DE102005024321 B8 DE 102005024321B8
Authority
DE
Germany
Prior art keywords
protection circuit
protection
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102005024321A
Other languages
English (en)
Other versions
DE102005024321A1 (de
DE102005024321B4 (de
Inventor
Alfons Graf
Martin März
Dipl.-Ing. Saliternig Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Infineon Technologies AG
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV, Infineon Technologies AG filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority to DE102005024321A priority Critical patent/DE102005024321B8/de
Priority to US11/420,277 priority patent/US7508295B2/en
Publication of DE102005024321A1 publication Critical patent/DE102005024321A1/de
Publication of DE102005024321B4 publication Critical patent/DE102005024321B4/de
Application granted granted Critical
Publication of DE102005024321B8 publication Critical patent/DE102005024321B8/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
    • H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
    • H02H5/047—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature using a temperature responsive switch
    • H02H5/048—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature using a temperature responsive switch additionally responsive to excess current due to heating of the switch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H2037/768—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material characterised by the composition of the fusible material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/0241—Structural association of a fuse and another component or apparatus
    • H01H2085/0275—Structural association with a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/0241—Structural association of a fuse and another component or apparatus
    • H01H2085/0283—Structural association with a semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/143—Electrical contacts; Fastening fusible members to such contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
DE102005024321A 2005-05-27 2005-05-27 Absicherungsschaltung Expired - Fee Related DE102005024321B8 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102005024321A DE102005024321B8 (de) 2005-05-27 2005-05-27 Absicherungsschaltung
US11/420,277 US7508295B2 (en) 2005-05-27 2006-05-25 Protection circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005024321A DE102005024321B8 (de) 2005-05-27 2005-05-27 Absicherungsschaltung

Publications (3)

Publication Number Publication Date
DE102005024321A1 DE102005024321A1 (de) 2006-11-30
DE102005024321B4 DE102005024321B4 (de) 2012-03-29
DE102005024321B8 true DE102005024321B8 (de) 2012-10-04

Family

ID=37387694

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005024321A Expired - Fee Related DE102005024321B8 (de) 2005-05-27 2005-05-27 Absicherungsschaltung

Country Status (2)

Country Link
US (1) US7508295B2 (de)
DE (1) DE102005024321B8 (de)

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WO2007110850A1 (en) * 2006-03-28 2007-10-04 Littelfuse Ireland Limited Transient voltage surge suppression
DE102006034679A1 (de) * 2006-07-24 2008-01-31 Infineon Technologies Ag Halbleitermodul mit Leistungshalbleiterchip und passiven Bauelement sowie Verfahren zur Herstellung desselben
US7986212B2 (en) * 2007-05-15 2011-07-26 Yazaki Corporation Fuse
US8035947B2 (en) * 2008-06-27 2011-10-11 Panamax Corporation Controlled convection thermal disconnector
WO2010031434A1 (de) * 2008-09-18 2010-03-25 Schurter Ag Verfahren und vorrichtung zur herstellung von smd-sicherungselementen
US8319596B2 (en) * 2009-05-20 2012-11-27 GM Global Technology Operations LLC Active material circuit protector
DE102009040022B3 (de) 2009-09-03 2011-03-24 Beru Ag Verfahren zum Ausbilden einer Schmelzsicherung und Leiterplatte mit Schmelzsicherung
DE102009045181B4 (de) * 2009-09-30 2020-07-09 Infineon Technologies Ag Leistungshalbleitermodul
JP5571466B2 (ja) * 2010-06-10 2014-08-13 イビデン株式会社 プリント配線板、電子デバイス、及びプリント配線板の製造方法
JP5778398B2 (ja) 2010-08-10 2015-09-16 ジーブイビービー ホールディングス エス．エイ．アール．エル． 電子回路
US8854784B2 (en) * 2010-10-29 2014-10-07 Tyco Electronics Corporation Integrated FET and reflowable thermal fuse switch device
DE102013101050B4 (de) * 2013-02-01 2023-02-16 Pilz Gmbh & Co. Kg Sicherheitsschaltvorrichtung mit sicherem Netzteil
CN104810878B (zh) * 2014-01-28 2017-05-10 广东欧珀移动通信有限公司 过压过流保护电路和移动终端
WO2015123436A1 (en) * 2014-02-12 2015-08-20 Owen Oil Tools Lp Detonator interrupter for well tools
DE102014008021B4 (de) * 2014-05-27 2021-06-10 Hkr Automotive Gmbh Schaltungsanordnung zum thermischen Schutz eines Leistungshalbleiters
JP6317189B2 (ja) * 2014-06-16 2018-04-25 富士工業株式会社 レンジフード用スイッチ装置
JP6307762B2 (ja) * 2014-09-26 2018-04-11 デクセリアルズ株式会社 電線
DE102014118982A1 (de) 2014-12-18 2016-06-23 Turck Holding Gmbh Schutzschaltung
US10283304B2 (en) * 2016-01-21 2019-05-07 Littelfuse, Inc. Surface mounted protection device
US10693363B1 (en) 2016-08-10 2020-06-23 Apple Inc. Self clearing power module
CN112385007A (zh) * 2018-06-28 2021-02-19 松下知识产权经营株式会社 蓄电装置、电源装置、移动体、电容器以及蓄电装置的保护方法
DE102021206554A1 (de) 2021-06-24 2022-12-29 Continental Teves Ag & Co. Ohg Elektronische Baugruppe und Verfahren zur Herstellung
KR102422880B1 (ko) * 2022-01-24 2022-07-21 에이에프더블류 주식회사 퓨징 부스바 제조방법
TWI812203B (zh) * 2022-05-05 2023-08-11 創意電子股份有限公司 探針卡裝置及其電路保護組件

Citations (14)

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DE7809564U1 (de) * 1978-03-31 1978-08-17 Deutsche Vitrohm Gmbh & Co Kg, 2080 Pinneberg Hochlast-drahtwiderstand
DE3610886A1 (de) * 1986-04-02 1987-10-08 Pudenz Wilhelm Gmbh Schmelzsicherung mit einem als leiterplatte ausgebildeten sicherungskoerper
GB2205455A (en) * 1987-05-29 1988-12-07 Crystalate Electronics Thermal fuse
JPS644053A (en) * 1987-06-26 1989-01-09 Hitachi Ltd Semiconductor device
US5682057A (en) * 1995-03-03 1997-10-28 Rohm Co. Ltd. Semiconductor device incorporating a temperature fuse
DE19714544A1 (de) * 1996-04-09 1997-10-30 Rohm Co Ltd Verfahren zum Anbringen eines Trockenelektrolytkondensators auf einer Leiterplatte und Anordnung des Kondensators und der Platine
JPH11213852A (ja) * 1998-01-28 1999-08-06 Nec Kansai Ltd 電流ヒューズ
US6094128A (en) * 1998-08-11 2000-07-25 Maida Development Company Overload protected solid state varistors
EP1079674A1 (de) * 1998-05-15 2001-02-28 Rohm Co., Ltd. Montageanordnung für eine temperaturempfindliche schmelzsicherung auf einer leiterplatte
US6504467B1 (en) * 1999-07-31 2003-01-07 Mannesmann Vdo Ag Switch integral in a semiconductor element
WO2004002202A1 (de) * 2002-06-21 2003-12-31 Continental Teves Ag & Co. Ohg Leiterplatte für elektronische kraftfahrzeugsteuergeräte
US20050001710A1 (en) * 2003-07-01 2005-01-06 Takahiro Mukai Fuse, battery pack using the fuse, and method of manufacturing the fuse
DE10334433A1 (de) * 2003-07-28 2005-03-03 Infineon Technologies Ag Vorrichtung zur Unterbrechung des Stromflusses zum bzw. vom Halbleiterkörper eines Halbleiterbauelements
DE102004025420A1 (de) * 2004-05-24 2005-12-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Schaltungselement und Verfahren zum Sichern einer Lastschaltung

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US6734781B1 (en) 1999-04-30 2004-05-11 Rohm Co., Ltd. Mounting structure for temperature-sensitive fuse on circuit board
JP2000323308A (ja) 1999-05-10 2000-11-24 Nec Kansai Ltd 表面実装型デバイスおよびその実装方法
US6507264B1 (en) * 2000-08-28 2003-01-14 Littelfuse, Inc. Integral fuse for use in semiconductor packages
DE10137873C1 (de) 2001-08-02 2002-10-17 Epcos Ag Elektrokeramisches Bauelement
JP2003288827A (ja) 2002-03-27 2003-10-10 Nec Schott Components Corp チップタイプ温度ヒューズおよびその実装構造
JP3761857B2 (ja) * 2002-10-11 2006-03-29 三菱電機株式会社 半導体装置

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7809564U1 (de) * 1978-03-31 1978-08-17 Deutsche Vitrohm Gmbh & Co Kg, 2080 Pinneberg Hochlast-drahtwiderstand
DE3610886A1 (de) * 1986-04-02 1987-10-08 Pudenz Wilhelm Gmbh Schmelzsicherung mit einem als leiterplatte ausgebildeten sicherungskoerper
GB2205455A (en) * 1987-05-29 1988-12-07 Crystalate Electronics Thermal fuse
JPS644053A (en) * 1987-06-26 1989-01-09 Hitachi Ltd Semiconductor device
US5682057A (en) * 1995-03-03 1997-10-28 Rohm Co. Ltd. Semiconductor device incorporating a temperature fuse
DE19714544A1 (de) * 1996-04-09 1997-10-30 Rohm Co Ltd Verfahren zum Anbringen eines Trockenelektrolytkondensators auf einer Leiterplatte und Anordnung des Kondensators und der Platine
JPH11213852A (ja) * 1998-01-28 1999-08-06 Nec Kansai Ltd 電流ヒューズ
EP1079674A1 (de) * 1998-05-15 2001-02-28 Rohm Co., Ltd. Montageanordnung für eine temperaturempfindliche schmelzsicherung auf einer leiterplatte
US6094128A (en) * 1998-08-11 2000-07-25 Maida Development Company Overload protected solid state varistors
US6504467B1 (en) * 1999-07-31 2003-01-07 Mannesmann Vdo Ag Switch integral in a semiconductor element
WO2004002202A1 (de) * 2002-06-21 2003-12-31 Continental Teves Ag & Co. Ohg Leiterplatte für elektronische kraftfahrzeugsteuergeräte
US20050001710A1 (en) * 2003-07-01 2005-01-06 Takahiro Mukai Fuse, battery pack using the fuse, and method of manufacturing the fuse
DE10334433A1 (de) * 2003-07-28 2005-03-03 Infineon Technologies Ag Vorrichtung zur Unterbrechung des Stromflusses zum bzw. vom Halbleiterkörper eines Halbleiterbauelements
DE102004025420A1 (de) * 2004-05-24 2005-12-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Schaltungselement und Verfahren zum Sichern einer Lastschaltung

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KLEIN WASSINK, R.J.: Weichlöten in der Elektronik. 2. Auflage. Saulg./Württ. : Eugen G. Leuze Verlag, 1991. S. 211-212. - ISBN 3-87480-066-0 *

Also Published As

Publication number Publication date
DE102005024321A1 (de) 2006-11-30
US7508295B2 (en) 2009-03-24
US20060268645A1 (en) 2006-11-30
DE102005024321B4 (de) 2012-03-29

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