JP2004022290A - チップタイプ温度ヒューズの実装構造 - Google Patents

チップタイプ温度ヒューズの実装構造 Download PDF

Info

Publication number
JP2004022290A
JP2004022290A JP2002174419A JP2002174419A JP2004022290A JP 2004022290 A JP2004022290 A JP 2004022290A JP 2002174419 A JP2002174419 A JP 2002174419A JP 2002174419 A JP2002174419 A JP 2002174419A JP 2004022290 A JP2004022290 A JP 2004022290A
Authority
JP
Japan
Prior art keywords
lead
chip
mounting
wiring
type thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002174419A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004022290A5 (enExample
Inventor
Tokihiro Yoshikawa
吉川　時弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Schott Components Corp
Original Assignee
NEC Schott Components Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Schott Components Corp filed Critical NEC Schott Components Corp
Priority to JP2002174419A priority Critical patent/JP2004022290A/ja
Publication of JP2004022290A publication Critical patent/JP2004022290A/ja
Publication of JP2004022290A5 publication Critical patent/JP2004022290A5/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Fuses (AREA)
JP2002174419A 2002-06-14 2002-06-14 チップタイプ温度ヒューズの実装構造 Pending JP2004022290A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002174419A JP2004022290A (ja) 2002-06-14 2002-06-14 チップタイプ温度ヒューズの実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002174419A JP2004022290A (ja) 2002-06-14 2002-06-14 チップタイプ温度ヒューズの実装構造

Publications (2)

Publication Number Publication Date
JP2004022290A true JP2004022290A (ja) 2004-01-22
JP2004022290A5 JP2004022290A5 (enExample) 2005-10-13

Family

ID=31173389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002174419A Pending JP2004022290A (ja) 2002-06-14 2002-06-14 チップタイプ温度ヒューズの実装構造

Country Status (1)

Country Link
JP (1) JP2004022290A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015035280A (ja) * 2013-08-07 2015-02-19 デクセリアルズ株式会社 保護回路基板
US10032583B2 (en) 2016-02-17 2018-07-24 Dexerials Corporation Protective circuit substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015035280A (ja) * 2013-08-07 2015-02-19 デクセリアルズ株式会社 保護回路基板
US10032583B2 (en) 2016-02-17 2018-07-24 Dexerials Corporation Protective circuit substrate

Similar Documents

Publication Publication Date Title
KR100629826B1 (ko) 접합재 및 이를 이용한 회로 장치
JP2001102734A (ja) 多層フレキシブル配線板
JPH077038A (ja) 電子パッケージ
JP7231527B2 (ja) 保護素子用ヒューズ素子およびそれを利用した保護素子
JP2004179551A (ja) コイル装置、及び、その製造方法
JP2004165637A (ja) 半導体装置
JP3702117B2 (ja) 電子部品装置
WO2010070779A1 (ja) 異方性導電樹脂、基板接続構造及び電子機器
US7199468B2 (en) Hybrid integrated circuit device with high melting point brazing material
JP2004022290A (ja) チップタイプ温度ヒューズの実装構造
JP2006269970A (ja) 電子部品のはんだ接合方法
JP2006339174A (ja) 半導体装置
JP2637863B2 (ja) 半導体装置
JP2003288827A (ja) チップタイプ温度ヒューズおよびその実装構造
JP4002117B2 (ja) 多層基板及びその製造方法
JP2006041363A (ja) 樹脂封止型半導体装置
CN221728566U (zh) 电路板组件及终端装置
US20250118519A1 (en) Surface mount fuse and fuse element thereof
JP2633745B2 (ja) 半導体装置の実装体
JP3225936B2 (ja) インダクタンス素子及びその製造方法
JP2002271005A (ja) 実装構造体及びその製造方法
JP2002368038A (ja) フリップチップ実装方法
JP2002043466A (ja) ボールグリッドアレイパッケージ
JPH10200307A (ja) 非可逆回路素子
JP2002246261A (ja) 樹脂封止型電子部品装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050531

A621 Written request for application examination

Effective date: 20050531

Free format text: JAPANESE INTERMEDIATE CODE: A621

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080222

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080626