JP2003535158A5 - - Google Patents

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Publication number
JP2003535158A5
JP2003535158A5 JP2001572639A JP2001572639A JP2003535158A5 JP 2003535158 A5 JP2003535158 A5 JP 2003535158A5 JP 2001572639 A JP2001572639 A JP 2001572639A JP 2001572639 A JP2001572639 A JP 2001572639A JP 2003535158 A5 JP2003535158 A5 JP 2003535158A5
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JP
Japan
Prior art keywords
adhesive
weight
dispersion
aqueous
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001572639A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003535158A (ja
JP5009469B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2001/003627 external-priority patent/WO2001074961A1/de
Publication of JP2003535158A publication Critical patent/JP2003535158A/ja
Publication of JP2003535158A5 publication Critical patent/JP2003535158A5/ja
Application granted granted Critical
Publication of JP5009469B2 publication Critical patent/JP5009469B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001572639A 2000-04-04 2001-03-30 水性ポリマー分散体に基づく二次接着剤 Expired - Fee Related JP5009469B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10016673.3 2000-04-04
DE10016673 2000-04-04
PCT/EP2001/003627 WO2001074961A1 (de) 2000-04-04 2001-03-30 Montageklebstoff auf der basis einer wässrigen polymer-dispersion

Publications (3)

Publication Number Publication Date
JP2003535158A JP2003535158A (ja) 2003-11-25
JP2003535158A5 true JP2003535158A5 (enExample) 2008-05-15
JP5009469B2 JP5009469B2 (ja) 2012-08-22

Family

ID=7637518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001572639A Expired - Fee Related JP5009469B2 (ja) 2000-04-04 2001-03-30 水性ポリマー分散体に基づく二次接着剤

Country Status (11)

Country Link
US (1) US6770706B2 (enExample)
EP (1) EP1268698B1 (enExample)
JP (1) JP5009469B2 (enExample)
AT (1) ATE267856T1 (enExample)
AU (2) AU4252201A (enExample)
CA (1) CA2405446A1 (enExample)
DE (2) DE10116023A1 (enExample)
MX (1) MXPA02009363A (enExample)
PL (1) PL207954B1 (enExample)
TR (1) TR200402071T4 (enExample)
WO (1) WO2001074961A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10312062A1 (de) * 2003-03-18 2004-09-30 Tesa Ag Schmelzhaftkleber mit geringem Rückschrumpf, Verfahren zu seiner Herstellung und Verwendung
DE10338858A1 (de) * 2003-08-20 2005-03-17 Basf Ag Montagekleber auf Basis einer wässrigen Polymer-Dispersion
DE10343090A1 (de) * 2003-09-17 2005-04-14 Henkel Kgaa 2-K-Montageklebstoff mit hoher Anfangshaftung
DE102004017915A1 (de) * 2004-04-13 2005-11-03 Basf Ag Mikroporöses Gerüstsilikat und Verfahren zu seiner Herstellung
DE102005003087A1 (de) * 2005-01-22 2006-07-27 Remmers Baustofftechnik Gmbh Dispersionsfarbe
DE102007011511A1 (de) * 2007-03-09 2008-09-11 Henkel Ag & Co. Kgaa Ein-Komponenten-Montageklebstoff mit hoher Anfangshaftung
JP5010454B2 (ja) 2007-12-21 2012-08-29 日東電工株式会社 液晶セルの製造方法
US20120097685A1 (en) * 2010-10-25 2012-04-26 Vladislav Babinsky Insulated Beverage Container
DE202011107844U1 (de) * 2011-11-15 2013-02-18 Surface Technologies Gmbh & Co. Kg Paneel mit Kantenbrechung
WO2013088188A1 (en) * 2011-12-16 2013-06-20 Celanese Emulsions Gmbh Polymer dispersions and their use in pigmented coating compositions
EP2669073A1 (de) 2012-05-29 2013-12-04 Basf Se Verfahren zur Herstellung von zumindest zweilagigen Schaumstoffplatten durch Verkleben
EP2669072A1 (de) 2012-05-29 2013-12-04 Basf Se Verfahren zur Herstellung von zumindest zweilagigen thermoplastischen Schaumstoffplatten durch thermisches Verschweißen
US8912670B2 (en) 2012-09-28 2014-12-16 Intel Corporation Bumpless build-up layer package including an integrated heat spreader
US9136236B2 (en) 2012-09-28 2015-09-15 Intel Corporation Localized high density substrate routing
DE102012023181A1 (de) 2012-11-28 2014-05-28 Basf Se Verfahren zur Herstellung von zumindest zweilagigen Schaumstoffplatten durch strukturiertes Verkleben
US9190380B2 (en) 2012-12-06 2015-11-17 Intel Corporation High density substrate routing in BBUL package
US9349703B2 (en) 2013-09-25 2016-05-24 Intel Corporation Method for making high density substrate interconnect using inkjet printing
US9159690B2 (en) 2013-09-25 2015-10-13 Intel Corporation Tall solders for through-mold interconnect
FR3030557B1 (fr) * 2014-12-17 2016-12-23 Bostik Sa Composition adhesive de fixation a base aqueuse presentant une tenue au fluage amelioree
CN112094607B (zh) * 2020-08-22 2022-04-15 临海市春竹粘胶有限公司 一种水性结构密封胶及制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2061990B (en) * 1979-11-03 1984-03-21 Building Adhesives Ltd Ceramic tile adhesive
US4425469A (en) * 1980-09-08 1984-01-10 Rohm And Haas Company Polyacrylamide flow modifier-adsorber
GB8429320D0 (en) * 1984-11-20 1984-12-27 Scott Bader Co Water resistant compositions
JPH0912992A (ja) * 1995-03-27 1997-01-14 Sumitomo Chem Co Ltd 接着剤及び接着方法
US6726798B2 (en) 1995-08-11 2004-04-27 Henkel Kommanditgesellschaft Auf Aktien Polystyrene binders
US6485601B1 (en) * 1997-08-13 2002-11-26 Basf Corporation Water based construction adhesive having improved moisture resistance useful for binding two substrates
DE69906694T2 (de) * 1998-01-23 2004-01-29 Ian Alexander Durrant Ausgabepistole
DE19822790A1 (de) * 1998-05-20 1999-11-25 Basf Ag Wässrige Zubereitungen

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