DE50102412D1 - Montageklebstoff auf der basis einer wässrigen polymer-dispersion - Google Patents

Montageklebstoff auf der basis einer wässrigen polymer-dispersion

Info

Publication number
DE50102412D1
DE50102412D1 DE50102412T DE50102412T DE50102412D1 DE 50102412 D1 DE50102412 D1 DE 50102412D1 DE 50102412 T DE50102412 T DE 50102412T DE 50102412 T DE50102412 T DE 50102412T DE 50102412 D1 DE50102412 D1 DE 50102412D1
Authority
DE
Germany
Prior art keywords
dispersion
aqueous polymer
polymer dispersion
adhesive based
assembly adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50102412T
Other languages
German (de)
English (en)
Inventor
Anke Lewin
Wolfgang Klauck
Gaby Schilling
Martin Majolo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Priority to DE50102412T priority Critical patent/DE50102412D1/de
Application granted granted Critical
Publication of DE50102412D1 publication Critical patent/DE50102412D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C09J125/14—Copolymers of styrene with unsaturated esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/24—Homopolymers or copolymers of amides or imides
    • C08L33/26—Homopolymers or copolymers of acrylamide or methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE50102412T 2000-04-04 2001-03-30 Montageklebstoff auf der basis einer wässrigen polymer-dispersion Expired - Lifetime DE50102412D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50102412T DE50102412D1 (de) 2000-04-04 2001-03-30 Montageklebstoff auf der basis einer wässrigen polymer-dispersion

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10016673 2000-04-04
PCT/EP2001/003627 WO2001074961A1 (de) 2000-04-04 2001-03-30 Montageklebstoff auf der basis einer wässrigen polymer-dispersion
DE50102412T DE50102412D1 (de) 2000-04-04 2001-03-30 Montageklebstoff auf der basis einer wässrigen polymer-dispersion

Publications (1)

Publication Number Publication Date
DE50102412D1 true DE50102412D1 (de) 2004-07-01

Family

ID=7637518

Family Applications (2)

Application Number Title Priority Date Filing Date
DE50102412T Expired - Lifetime DE50102412D1 (de) 2000-04-04 2001-03-30 Montageklebstoff auf der basis einer wässrigen polymer-dispersion
DE10116023A Withdrawn DE10116023A1 (de) 2000-04-04 2001-03-30 Klebstoff auf der Basis einer wäßrigen Polymer-Dispersion

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE10116023A Withdrawn DE10116023A1 (de) 2000-04-04 2001-03-30 Klebstoff auf der Basis einer wäßrigen Polymer-Dispersion

Country Status (11)

Country Link
US (1) US6770706B2 (enExample)
EP (1) EP1268698B1 (enExample)
JP (1) JP5009469B2 (enExample)
AT (1) ATE267856T1 (enExample)
AU (2) AU4252201A (enExample)
CA (1) CA2405446A1 (enExample)
DE (2) DE50102412D1 (enExample)
MX (1) MXPA02009363A (enExample)
PL (1) PL207954B1 (enExample)
TR (1) TR200402071T4 (enExample)
WO (1) WO2001074961A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10312062A1 (de) * 2003-03-18 2004-09-30 Tesa Ag Schmelzhaftkleber mit geringem Rückschrumpf, Verfahren zu seiner Herstellung und Verwendung
DE10338858A1 (de) * 2003-08-20 2005-03-17 Basf Ag Montagekleber auf Basis einer wässrigen Polymer-Dispersion
DE10343090A1 (de) * 2003-09-17 2005-04-14 Henkel Kgaa 2-K-Montageklebstoff mit hoher Anfangshaftung
DE102004017915A1 (de) * 2004-04-13 2005-11-03 Basf Ag Mikroporöses Gerüstsilikat und Verfahren zu seiner Herstellung
DE102005003087A1 (de) * 2005-01-22 2006-07-27 Remmers Baustofftechnik Gmbh Dispersionsfarbe
DE102007011511A1 (de) 2007-03-09 2008-09-11 Henkel Ag & Co. Kgaa Ein-Komponenten-Montageklebstoff mit hoher Anfangshaftung
JP5010454B2 (ja) 2007-12-21 2012-08-29 日東電工株式会社 液晶セルの製造方法
US20120097685A1 (en) * 2010-10-25 2012-04-26 Vladislav Babinsky Insulated Beverage Container
DE202011107844U1 (de) 2011-11-15 2013-02-18 Surface Technologies Gmbh & Co. Kg Paneel mit Kantenbrechung
WO2013088188A1 (en) * 2011-12-16 2013-06-20 Celanese Emulsions Gmbh Polymer dispersions and their use in pigmented coating compositions
EP2669072A1 (de) 2012-05-29 2013-12-04 Basf Se Verfahren zur Herstellung von zumindest zweilagigen thermoplastischen Schaumstoffplatten durch thermisches Verschweißen
EP2669073A1 (de) 2012-05-29 2013-12-04 Basf Se Verfahren zur Herstellung von zumindest zweilagigen Schaumstoffplatten durch Verkleben
US9136236B2 (en) 2012-09-28 2015-09-15 Intel Corporation Localized high density substrate routing
US8912670B2 (en) 2012-09-28 2014-12-16 Intel Corporation Bumpless build-up layer package including an integrated heat spreader
DE102012023181A1 (de) 2012-11-28 2014-05-28 Basf Se Verfahren zur Herstellung von zumindest zweilagigen Schaumstoffplatten durch strukturiertes Verkleben
US9190380B2 (en) 2012-12-06 2015-11-17 Intel Corporation High density substrate routing in BBUL package
US9349703B2 (en) 2013-09-25 2016-05-24 Intel Corporation Method for making high density substrate interconnect using inkjet printing
US9159690B2 (en) 2013-09-25 2015-10-13 Intel Corporation Tall solders for through-mold interconnect
FR3030557B1 (fr) * 2014-12-17 2016-12-23 Bostik Sa Composition adhesive de fixation a base aqueuse presentant une tenue au fluage amelioree
CN112094607B (zh) * 2020-08-22 2022-04-15 临海市春竹粘胶有限公司 一种水性结构密封胶及制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2061990B (en) * 1979-11-03 1984-03-21 Building Adhesives Ltd Ceramic tile adhesive
US4425469A (en) * 1980-09-08 1984-01-10 Rohm And Haas Company Polyacrylamide flow modifier-adsorber
GB8429320D0 (en) 1984-11-20 1984-12-27 Scott Bader Co Water resistant compositions
JPH0912992A (ja) * 1995-03-27 1997-01-14 Sumitomo Chem Co Ltd 接着剤及び接着方法
CN1143884C (zh) 1995-08-11 2004-03-31 汉克尔股份两合公司 粘合剂的用途
US6485601B1 (en) * 1997-08-13 2002-11-26 Basf Corporation Water based construction adhesive having improved moisture resistance useful for binding two substrates
CN1124906C (zh) * 1998-01-23 2003-10-22 伊昂·亚历山大·杜让脱 改进的分配枪
DE19822790A1 (de) * 1998-05-20 1999-11-25 Basf Ag Wässrige Zubereitungen

Also Published As

Publication number Publication date
CA2405446A1 (en) 2002-10-04
US20030144405A1 (en) 2003-07-31
MXPA02009363A (es) 2003-02-12
DE10116023A1 (de) 2001-10-11
ATE267856T1 (de) 2004-06-15
AU4252201A (en) 2001-10-15
US6770706B2 (en) 2004-08-03
AU2001242522B2 (en) 2005-02-24
TR200402071T4 (tr) 2004-10-21
WO2001074961A1 (de) 2001-10-11
JP5009469B2 (ja) 2012-08-22
JP2003535158A (ja) 2003-11-25
PL207954B1 (pl) 2011-02-28
PL357294A1 (en) 2004-07-26
EP1268698A1 (de) 2003-01-02
EP1268698B1 (de) 2004-05-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HENKEL AG & CO. KGAA, 40589 DUESSELDORF, DE