JP2003531483A - 電磁干渉遮蔽装置 - Google Patents

電磁干渉遮蔽装置

Info

Publication number
JP2003531483A
JP2003531483A JP2001576733A JP2001576733A JP2003531483A JP 2003531483 A JP2003531483 A JP 2003531483A JP 2001576733 A JP2001576733 A JP 2001576733A JP 2001576733 A JP2001576733 A JP 2001576733A JP 2003531483 A JP2003531483 A JP 2003531483A
Authority
JP
Japan
Prior art keywords
gasket device
gasket
elastic material
conductive
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001576733A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003531483A5 (enExample
Inventor
シー ベン ジュニア ロバート
Original Assignee
ヴァンガード プロダクツ コーポレイション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヴァンガード プロダクツ コーポレイション filed Critical ヴァンガード プロダクツ コーポレイション
Publication of JP2003531483A publication Critical patent/JP2003531483A/ja
Publication of JP2003531483A5 publication Critical patent/JP2003531483A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/92—Seal including electromagnetic shielding feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Gasket Seals (AREA)
  • Surgical Instruments (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2001576733A 2000-04-18 2000-06-13 電磁干渉遮蔽装置 Pending JP2003531483A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/551,079 2000-04-18
US09/551,079 US6613976B1 (en) 1998-12-15 2000-04-18 Electromagnetic interference shielding gasket
PCT/US2000/016098 WO2001080617A1 (en) 2000-04-18 2000-06-13 Electromagnetic interference shielding device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010181429A Division JP4971487B2 (ja) 2000-04-18 2010-08-13 電磁干渉遮蔽装置

Publications (2)

Publication Number Publication Date
JP2003531483A true JP2003531483A (ja) 2003-10-21
JP2003531483A5 JP2003531483A5 (enExample) 2010-01-14

Family

ID=24199753

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2001576733A Pending JP2003531483A (ja) 2000-04-18 2000-06-13 電磁干渉遮蔽装置
JP2010181429A Expired - Lifetime JP4971487B2 (ja) 2000-04-18 2010-08-13 電磁干渉遮蔽装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010181429A Expired - Lifetime JP4971487B2 (ja) 2000-04-18 2010-08-13 電磁干渉遮蔽装置

Country Status (10)

Country Link
US (1) US6613976B1 (enExample)
EP (1) EP1188354B1 (enExample)
JP (2) JP2003531483A (enExample)
CN (1) CN1212051C (enExample)
AT (1) ATE397844T1 (enExample)
AU (1) AU2000254823A1 (enExample)
DE (1) DE60039110D1 (enExample)
ES (1) ES2310518T3 (enExample)
HK (1) HK1044097B (enExample)
WO (1) WO2001080617A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014076998A1 (en) * 2012-11-15 2014-05-22 Kabushiki Kaisha Toshiba Grounding gasket and electronic apparatus
US9078351B2 (en) 2012-11-15 2015-07-07 Kabushiki Kaisha Toshiba Grounding gasket and electronic apparatus

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US6621000B2 (en) * 2001-08-21 2003-09-16 Dell Products L.P. Perforated EMI gasket
US6972369B2 (en) * 2003-12-19 2005-12-06 Hewlett-Packard Development Company, L.P. Flexible grounding strip
JP4176723B2 (ja) * 2004-02-10 2008-11-05 日本ジッパーチュービング株式会社 電磁波シールドガスケット及びその製造方法
FI20045270A0 (fi) * 2004-07-09 2004-07-09 Nokia Corp Elektroniikkalaite ja tiiviste elektroniikkalaitetta varten suojauksen muodostamiseksi sähkömagneettisia häiriöitä vastaan
US7470866B2 (en) * 2004-11-18 2008-12-30 Jemic Shielding Technology Electrically conductive gasket
US7732714B2 (en) * 2004-12-15 2010-06-08 Jemic Shielding Technology Electrically conductive gasket with paint masking
US7084344B1 (en) * 2006-01-05 2006-08-01 International Business Machines Corporation V-seal EMC gasket assembly for precise placement, conduction and retention without adhesives
US7288727B1 (en) * 2006-05-31 2007-10-30 Motorola, Inc. Shield frame for a radio frequency shielding assembly
US8623265B2 (en) * 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
US7875345B1 (en) * 2007-02-06 2011-01-25 World Properties, Inc. Conductive polymer foams, method of manufacture, and uses thereof
CN101558696B (zh) * 2007-06-11 2011-03-02 富士高分子工业株式会社 金属一体化导电橡胶
US20090000818A1 (en) * 2007-06-29 2009-01-01 Michael Poulsen Perforated emi gaskets and related methods
KR101244022B1 (ko) * 2008-09-04 2013-03-14 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전자기파간섭 억제용 복합시트
CN101971427B (zh) * 2008-09-16 2013-05-29 富士高分子工业株式会社 导电橡胶部件
JP5129396B2 (ja) * 2009-03-06 2013-01-30 サン−ゴバン パフォーマンス プラスティックス コーポレイション 直線運動電気コネクタ組立体
RU2504933C2 (ru) * 2009-10-02 2014-01-20 Сэнт-Гобен Перформанс Пластикс Корпорейшн Уплотнение, содержащая его система и способ изготовления уплотнения
SG181555A1 (en) * 2009-12-29 2012-07-30 Rogers Corp Conductive polymer foams, method of manufacture, and uses thereof
CN103039138B (zh) * 2010-05-12 2015-12-02 派克汉尼芬公司 低力偏转与腐蚀抗性emi垫片
US20110306252A1 (en) * 2010-06-15 2011-12-15 Research In Motion Limited Spring finger grounding component and method of manufacture
KR101048083B1 (ko) * 2010-10-14 2011-07-11 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
KR101033193B1 (ko) * 2010-10-14 2011-05-06 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
CN102984929B (zh) 2011-09-07 2015-07-08 港易有限公司 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法
US9226433B2 (en) 2013-03-15 2015-12-29 Laird Technologies, Inc. Selectively conductive EMI gaskets
US8884168B2 (en) 2013-03-15 2014-11-11 Laird Technologies, Inc. Selectively conductive EMI gaskets
US9089044B1 (en) * 2014-04-04 2015-07-21 Laird Technologies, Inc. EMI shielding connector gasket
US9357683B2 (en) * 2014-09-26 2016-05-31 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam
GB2566922B (en) * 2017-07-26 2022-02-23 Global Invacom Ltd Electrical isolation apparatus and method
KR101951926B1 (ko) * 2017-11-24 2019-02-26 조인셋 주식회사 Emi 개스킷
US10058014B1 (en) * 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
US10537048B2 (en) * 2018-03-26 2020-01-14 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Systems and methods for preventing leakage of electromagnetic waves from electronic devices

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JPS61149399U (enExample) * 1985-03-07 1986-09-16
JPS628597A (ja) * 1985-06-28 1987-01-16 ヤ−コプ　ゼン 密封装置
JPH01235398A (ja) * 1988-03-16 1989-09-20 Taigaasu Polymer Kk 導電性パッキン
JPH08504059A (ja) * 1992-11-25 1996-04-30 アメスバリー グループ，インコーポレイテッド Ｅｍｉ遮蔽ガスケット

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US3140342A (en) 1963-07-05 1964-07-07 Chomerics Inc Electrical shielding and sealing gasket
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Publication number Priority date Publication date Assignee Title
JPS61149399U (enExample) * 1985-03-07 1986-09-16
JPS628597A (ja) * 1985-06-28 1987-01-16 ヤ−コプ　ゼン 密封装置
JPH01235398A (ja) * 1988-03-16 1989-09-20 Taigaasu Polymer Kk 導電性パッキン
JPH08504059A (ja) * 1992-11-25 1996-04-30 アメスバリー グループ，インコーポレイテッド Ｅｍｉ遮蔽ガスケット

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014076998A1 (en) * 2012-11-15 2014-05-22 Kabushiki Kaisha Toshiba Grounding gasket and electronic apparatus
CN103959930A (zh) * 2012-11-15 2014-07-30 株式会社东芝 接地垫片和电子设备
US9078351B2 (en) 2012-11-15 2015-07-07 Kabushiki Kaisha Toshiba Grounding gasket and electronic apparatus

Also Published As

Publication number Publication date
WO2001080617A1 (en) 2001-10-25
JP4971487B2 (ja) 2012-07-11
AU2000254823A1 (en) 2001-10-30
EP1188354B1 (en) 2008-06-04
US6613976B1 (en) 2003-09-02
HK1044097A1 (en) 2002-10-04
HK1044097B (en) 2008-10-31
CN1212051C (zh) 2005-07-20
CN1356020A (zh) 2002-06-26
JP2010283375A (ja) 2010-12-16
ES2310518T3 (es) 2009-01-16
EP1188354A1 (en) 2002-03-20
DE60039110D1 (de) 2008-07-17
ATE397844T1 (de) 2008-06-15

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