ES2310518T3 - Dispositivo de apantallamiento de interferencias electromagneticas. - Google Patents

Dispositivo de apantallamiento de interferencias electromagneticas. Download PDF

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Publication number
ES2310518T3
ES2310518T3 ES00939794T ES00939794T ES2310518T3 ES 2310518 T3 ES2310518 T3 ES 2310518T3 ES 00939794 T ES00939794 T ES 00939794T ES 00939794 T ES00939794 T ES 00939794T ES 2310518 T3 ES2310518 T3 ES 2310518T3
Authority
ES
Spain
Prior art keywords
conductive
joint
elastomeric material
joint device
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES00939794T
Other languages
English (en)
Spanish (es)
Inventor
Robert C. Benn, Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vanguard Products Corp
Original Assignee
Vanguard Products Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vanguard Products Corp filed Critical Vanguard Products Corp
Application granted granted Critical
Publication of ES2310518T3 publication Critical patent/ES2310518T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0015Gaskets or seals
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00Seal for a joint or juncture
    • Y10S277/92Seal including electromagnetic shielding feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Gasket Seals (AREA)
  • Surgical Instruments (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
ES00939794T 2000-04-18 2000-06-13 Dispositivo de apantallamiento de interferencias electromagneticas. Expired - Lifetime ES2310518T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US551079 2000-04-18
US09/551,079 US6613976B1 (en) 1998-12-15 2000-04-18 Electromagnetic interference shielding gasket

Publications (1)

Publication Number Publication Date
ES2310518T3 true ES2310518T3 (es) 2009-01-16

Family

ID=24199753

Family Applications (1)

Application Number Title Priority Date Filing Date
ES00939794T Expired - Lifetime ES2310518T3 (es) 2000-04-18 2000-06-13 Dispositivo de apantallamiento de interferencias electromagneticas.

Country Status (10)

Country Link
US (1) US6613976B1 (enExample)
EP (1) EP1188354B1 (enExample)
JP (2) JP2003531483A (enExample)
CN (1) CN1212051C (enExample)
AT (1) ATE397844T1 (enExample)
AU (1) AU2000254823A1 (enExample)
DE (1) DE60039110D1 (enExample)
ES (1) ES2310518T3 (enExample)
HK (1) HK1044097B (enExample)
WO (1) WO2001080617A1 (enExample)

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US6972369B2 (en) * 2003-12-19 2005-12-06 Hewlett-Packard Development Company, L.P. Flexible grounding strip
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US7470866B2 (en) * 2004-11-18 2008-12-30 Jemic Shielding Technology Electrically conductive gasket
US7732714B2 (en) * 2004-12-15 2010-06-08 Jemic Shielding Technology Electrically conductive gasket with paint masking
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US20090000818A1 (en) * 2007-06-29 2009-01-01 Michael Poulsen Perforated emi gaskets and related methods
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CN101971427B (zh) * 2008-09-16 2013-05-29 富士高分子工业株式会社 导电橡胶部件
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RU2504933C2 (ru) * 2009-10-02 2014-01-20 Сэнт-Гобен Перформанс Пластикс Корпорейшн Уплотнение, содержащая его система и способ изготовления уплотнения
SG181555A1 (en) * 2009-12-29 2012-07-30 Rogers Corp Conductive polymer foams, method of manufacture, and uses thereof
CN103039138B (zh) * 2010-05-12 2015-12-02 派克汉尼芬公司 低力偏转与腐蚀抗性emi垫片
US20110306252A1 (en) * 2010-06-15 2011-12-15 Research In Motion Limited Spring finger grounding component and method of manufacture
KR101048083B1 (ko) * 2010-10-14 2011-07-11 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
KR101033193B1 (ko) * 2010-10-14 2011-05-06 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
CN102984929B (zh) 2011-09-07 2015-07-08 港易有限公司 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法
JP2014099558A (ja) * 2012-11-15 2014-05-29 Toshiba Corp グラウンディングガスケットおよび電子機器
US9078351B2 (en) 2012-11-15 2015-07-07 Kabushiki Kaisha Toshiba Grounding gasket and electronic apparatus
US9226433B2 (en) 2013-03-15 2015-12-29 Laird Technologies, Inc. Selectively conductive EMI gaskets
US8884168B2 (en) 2013-03-15 2014-11-11 Laird Technologies, Inc. Selectively conductive EMI gaskets
US9089044B1 (en) * 2014-04-04 2015-07-21 Laird Technologies, Inc. EMI shielding connector gasket
US9357683B2 (en) * 2014-09-26 2016-05-31 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam
GB2566922B (en) * 2017-07-26 2022-02-23 Global Invacom Ltd Electrical isolation apparatus and method
KR101951926B1 (ko) * 2017-11-24 2019-02-26 조인셋 주식회사 Emi 개스킷
US10058014B1 (en) * 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
US10537048B2 (en) * 2018-03-26 2020-01-14 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Systems and methods for preventing leakage of electromagnetic waves from electronic devices

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Also Published As

Publication number Publication date
WO2001080617A1 (en) 2001-10-25
JP2003531483A (ja) 2003-10-21
JP4971487B2 (ja) 2012-07-11
AU2000254823A1 (en) 2001-10-30
EP1188354B1 (en) 2008-06-04
US6613976B1 (en) 2003-09-02
HK1044097A1 (en) 2002-10-04
HK1044097B (en) 2008-10-31
CN1212051C (zh) 2005-07-20
CN1356020A (zh) 2002-06-26
JP2010283375A (ja) 2010-12-16
EP1188354A1 (en) 2002-03-20
DE60039110D1 (de) 2008-07-17
ATE397844T1 (de) 2008-06-15

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