JP2003519444A - ウェハ製造制御 - Google Patents

ウェハ製造制御

Info

Publication number
JP2003519444A
JP2003519444A JP2001550501A JP2001550501A JP2003519444A JP 2003519444 A JP2003519444 A JP 2003519444A JP 2001550501 A JP2001550501 A JP 2001550501A JP 2001550501 A JP2001550501 A JP 2001550501A JP 2003519444 A JP2003519444 A JP 2003519444A
Authority
JP
Japan
Prior art keywords
tool
process chambers
operating parameters
controller
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001550501A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003519444A5 (enExample
Inventor
クリスチャン，クレイグ・ダブリュ
デイビス，ブラッドリー・エム
エバンス，アレン・エル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2003519444A publication Critical patent/JP2003519444A/ja
Publication of JP2003519444A5 publication Critical patent/JP2003519444A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32182—If state of tool, product deviates from standard, adjust system, feedback
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37576—Post-process, measure worpiece after machining, use results for new or same
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • General Factory Administration (AREA)
  • Chemical Vapour Deposition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2001550501A 2000-01-03 2000-09-20 ウェハ製造制御 Pending JP2003519444A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/476,892 2000-01-03
US09/476,892 US6684122B1 (en) 2000-01-03 2000-01-03 Control mechanism for matching process parameters in a multi-chamber process tool
PCT/US2000/025723 WO2001050206A1 (en) 2000-01-03 2000-09-20 Wafer manufacturing control

Publications (2)

Publication Number Publication Date
JP2003519444A true JP2003519444A (ja) 2003-06-17
JP2003519444A5 JP2003519444A5 (enExample) 2007-11-08

Family

ID=23893672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001550501A Pending JP2003519444A (ja) 2000-01-03 2000-09-20 ウェハ製造制御

Country Status (6)

Country Link
US (1) US6684122B1 (enExample)
EP (1) EP1254401B1 (enExample)
JP (1) JP2003519444A (enExample)
KR (1) KR100747126B1 (enExample)
DE (1) DE60011143T2 (enExample)
WO (1) WO2001050206A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150107659A (ko) * 2014-03-13 2015-09-23 도쿄엘렉트론가부시키가이샤 제어 장치, 기판 처리 장치 및 기판 처리 시스템

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US9785140B2 (en) * 2000-02-01 2017-10-10 Peer Intellectual Property Inc. Multi-protocol multi-client equipment server
JP4348412B2 (ja) * 2001-04-26 2009-10-21 東京エレクトロン株式会社 計測システムクラスター
US7089075B2 (en) * 2001-05-04 2006-08-08 Tokyo Electron Limited Systems and methods for metrology recipe and model generation
US6657716B1 (en) * 2001-05-23 2003-12-02 Advanced Micro Devices Inc. Method and apparatus for detecting necking over field/active transitions
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
DE10151259A1 (de) * 2001-10-17 2003-04-30 Aixtron Ag Verfahren und Vorrichtung zur Gewinnung von Korrelations-Werten aus Prozessparametern und Schichteigenschaften in einem CVD-Prozess
DE10240115B4 (de) * 2002-08-30 2004-10-28 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Handhaben von Substraten in einer Produktionslinie mit einer Cluster-Anlage und einer Messanlage
US6957119B2 (en) * 2002-09-09 2005-10-18 Macronix International Co., Ltd. Method for monitoring matched machine overlay
US7376472B2 (en) * 2002-09-11 2008-05-20 Fisher-Rosemount Systems, Inc. Integrated model predictive control and optimization within a process control system
US7369913B2 (en) * 2004-04-02 2008-05-06 Siemens Medical Solutions Usa, Inc. Recipe editor and controller
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US7206532B2 (en) * 2004-08-13 2007-04-17 Xerox Corporation Multiple object sources controlled and/or selected based on a common sensor
US20060079983A1 (en) * 2004-10-13 2006-04-13 Tokyo Electron Limited R2R controller to automate the data collection during a DOE
US7620516B2 (en) * 2005-05-02 2009-11-17 Mks Instruments, Inc. Versatile semiconductor manufacturing controller with statistically repeatable response times
JP2007123643A (ja) 2005-10-31 2007-05-17 Matsushita Electric Ind Co Ltd 成膜装置、成膜方法、成膜装置のモニタリングプログラムおよびその記録媒体
JP4925650B2 (ja) * 2005-11-28 2012-05-09 東京エレクトロン株式会社 基板処理装置
US8180594B2 (en) * 2007-09-06 2012-05-15 Asm International, N.V. System and method for automated customizable error diagnostics
US20100063610A1 (en) * 2008-09-08 2010-03-11 David Angell Method of process modules performance matching
US9177219B2 (en) * 2010-07-09 2015-11-03 Asml Netherlands B.V. Method of calibrating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product
US9606519B2 (en) * 2013-10-14 2017-03-28 Applied Materials, Inc. Matching process controllers for improved matching of process
KR102238648B1 (ko) * 2014-06-03 2021-04-09 삼성전자주식회사 반도체 공정 관리 시스템, 이를 포함하는 반도체 제조 시스템 및 반도체 제조 방법
EP3704734A4 (en) 2017-11-03 2021-08-11 Tokyo Electron Limited IMPROVING THE PERFORMANCE OF FUNCTIONAL MICROELECTRONIC DEVICES
US11244873B2 (en) 2018-10-31 2022-02-08 Tokyo Electron Limited Systems and methods for manufacturing microelectronic devices
JP7529363B2 (ja) * 2020-08-31 2024-08-06 東京エレクトロン株式会社 半導体製造システム、制御装置、制御方法及びプログラム
US11868119B2 (en) 2021-09-24 2024-01-09 Tokyo Electron Limited Method and process using fingerprint based semiconductor manufacturing process fault detection

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226207A (ja) * 1992-02-17 1993-09-03 Nec Yamagata Ltd 半導体装置の製造システム
JPH11329917A (ja) * 1998-05-15 1999-11-30 Hamamatsu Photonics Kk 半導体製造装置制御システム

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US5126028A (en) 1989-04-17 1992-06-30 Materials Research Corporation Sputter coating process control method and apparatus
US5270222A (en) 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
US5812261A (en) * 1992-07-08 1998-09-22 Active Impulse Systems, Inc. Method and device for measuring the thickness of opaque and transparent films
US5555177A (en) 1994-05-27 1996-09-10 Ontrak Systems, Inc. Method and apparatus for resetting individual processes in a control system
US5614247A (en) * 1994-09-30 1997-03-25 International Business Machines Corporation Apparatus for chemical vapor deposition of aluminum oxide
US5715361A (en) * 1995-04-13 1998-02-03 Cvc Products, Inc. Rapid thermal processing high-performance multizone illuminator for wafer backside heating
US5665214A (en) 1995-05-03 1997-09-09 Sony Corporation Automatic film deposition control method and system
US5536317A (en) * 1995-10-27 1996-07-16 Specialty Coating Systems, Inc. Parylene deposition apparatus including a quartz crystal thickness/rate controller
JP2965002B2 (ja) 1997-06-20 1999-10-18 日本電気株式会社 半導体記憶装置
JPH1116973A (ja) * 1997-06-26 1999-01-22 Hitachi Ltd 半導体装置製造方法及びその半導体装置製造方法で製造された半導体装置
EP0932194A1 (en) * 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision
US6303395B1 (en) * 1999-06-01 2001-10-16 Applied Materials, Inc. Semiconductor processing techniques
FR2808098B1 (fr) * 2000-04-20 2002-07-19 Cit Alcatel Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226207A (ja) * 1992-02-17 1993-09-03 Nec Yamagata Ltd 半導体装置の製造システム
JPH11329917A (ja) * 1998-05-15 1999-11-30 Hamamatsu Photonics Kk 半導体製造装置制御システム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150107659A (ko) * 2014-03-13 2015-09-23 도쿄엘렉트론가부시키가이샤 제어 장치, 기판 처리 장치 및 기판 처리 시스템
JP2015176903A (ja) * 2014-03-13 2015-10-05 東京エレクトロン株式会社 制御装置、基板処理装置及び基板処理システム
KR101868669B1 (ko) * 2014-03-13 2018-06-18 도쿄엘렉트론가부시키가이샤 제어 장치, 기판 처리 장치 및 기판 처리 시스템

Also Published As

Publication number Publication date
WO2001050206A1 (en) 2001-07-12
DE60011143D1 (de) 2004-07-01
KR20020063269A (ko) 2002-08-01
KR100747126B1 (ko) 2007-08-09
EP1254401A1 (en) 2002-11-06
US6684122B1 (en) 2004-01-27
EP1254401B1 (en) 2004-05-26
DE60011143T2 (de) 2005-06-02

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