KR100747126B1 - 웨이퍼 제조 제어 - Google Patents

웨이퍼 제조 제어 Download PDF

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Publication number
KR100747126B1
KR100747126B1 KR1020027008329A KR20027008329A KR100747126B1 KR 100747126 B1 KR100747126 B1 KR 100747126B1 KR 1020027008329 A KR1020027008329 A KR 1020027008329A KR 20027008329 A KR20027008329 A KR 20027008329A KR 100747126 B1 KR100747126 B1 KR 100747126B1
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KR
South Korea
Prior art keywords
tool
process chambers
computer
wafer
operating parameters
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020027008329A
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English (en)
Korean (ko)
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KR20020063269A (ko
Inventor
크리스틴크라이그더블유.
데이비스브래들리엠.
이반스알렌엘.
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
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Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20020063269A publication Critical patent/KR20020063269A/ko
Application granted granted Critical
Publication of KR100747126B1 publication Critical patent/KR100747126B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32182—If state of tool, product deviates from standard, adjust system, feedback
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37576—Post-process, measure worpiece after machining, use results for new or same
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • General Factory Administration (AREA)
  • Chemical Vapour Deposition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020027008329A 2000-01-03 2000-09-20 웨이퍼 제조 제어 Expired - Fee Related KR100747126B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/476,892 2000-01-03
US09/476,892 US6684122B1 (en) 2000-01-03 2000-01-03 Control mechanism for matching process parameters in a multi-chamber process tool

Publications (2)

Publication Number Publication Date
KR20020063269A KR20020063269A (ko) 2002-08-01
KR100747126B1 true KR100747126B1 (ko) 2007-08-09

Family

ID=23893672

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027008329A Expired - Fee Related KR100747126B1 (ko) 2000-01-03 2000-09-20 웨이퍼 제조 제어

Country Status (6)

Country Link
US (1) US6684122B1 (enExample)
EP (1) EP1254401B1 (enExample)
JP (1) JP2003519444A (enExample)
KR (1) KR100747126B1 (enExample)
DE (1) DE60011143T2 (enExample)
WO (1) WO2001050206A1 (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9785140B2 (en) * 2000-02-01 2017-10-10 Peer Intellectual Property Inc. Multi-protocol multi-client equipment server
JP4348412B2 (ja) * 2001-04-26 2009-10-21 東京エレクトロン株式会社 計測システムクラスター
US7089075B2 (en) * 2001-05-04 2006-08-08 Tokyo Electron Limited Systems and methods for metrology recipe and model generation
US6657716B1 (en) * 2001-05-23 2003-12-02 Advanced Micro Devices Inc. Method and apparatus for detecting necking over field/active transitions
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
DE10151259A1 (de) * 2001-10-17 2003-04-30 Aixtron Ag Verfahren und Vorrichtung zur Gewinnung von Korrelations-Werten aus Prozessparametern und Schichteigenschaften in einem CVD-Prozess
DE10240115B4 (de) 2002-08-30 2004-10-28 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Handhaben von Substraten in einer Produktionslinie mit einer Cluster-Anlage und einer Messanlage
US6957119B2 (en) * 2002-09-09 2005-10-18 Macronix International Co., Ltd. Method for monitoring matched machine overlay
US7376472B2 (en) * 2002-09-11 2008-05-20 Fisher-Rosemount Systems, Inc. Integrated model predictive control and optimization within a process control system
US7369913B2 (en) * 2004-04-02 2008-05-06 Siemens Medical Solutions Usa, Inc. Recipe editor and controller
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US7206532B2 (en) * 2004-08-13 2007-04-17 Xerox Corporation Multiple object sources controlled and/or selected based on a common sensor
US20060079983A1 (en) * 2004-10-13 2006-04-13 Tokyo Electron Limited R2R controller to automate the data collection during a DOE
US7620516B2 (en) 2005-05-02 2009-11-17 Mks Instruments, Inc. Versatile semiconductor manufacturing controller with statistically repeatable response times
JP2007123643A (ja) 2005-10-31 2007-05-17 Matsushita Electric Ind Co Ltd 成膜装置、成膜方法、成膜装置のモニタリングプログラムおよびその記録媒体
JP4925650B2 (ja) * 2005-11-28 2012-05-09 東京エレクトロン株式会社 基板処理装置
US8180594B2 (en) * 2007-09-06 2012-05-15 Asm International, N.V. System and method for automated customizable error diagnostics
US20100063610A1 (en) * 2008-09-08 2010-03-11 David Angell Method of process modules performance matching
US9177219B2 (en) * 2010-07-09 2015-11-03 Asml Netherlands B.V. Method of calibrating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product
US9606519B2 (en) 2013-10-14 2017-03-28 Applied Materials, Inc. Matching process controllers for improved matching of process
JP6211960B2 (ja) * 2014-03-13 2017-10-11 東京エレクトロン株式会社 制御装置、基板処理装置及び基板処理システム
KR102238648B1 (ko) * 2014-06-03 2021-04-09 삼성전자주식회사 반도체 공정 관리 시스템, 이를 포함하는 반도체 제조 시스템 및 반도체 제조 방법
TWI797187B (zh) 2017-11-03 2023-04-01 日商東京威力科創股份有限公司 功能微電子元件之良率提高
US11244873B2 (en) 2018-10-31 2022-02-08 Tokyo Electron Limited Systems and methods for manufacturing microelectronic devices
JP7529363B2 (ja) * 2020-08-31 2024-08-06 東京エレクトロン株式会社 半導体製造システム、制御装置、制御方法及びプログラム
US11868119B2 (en) 2021-09-24 2024-01-09 Tokyo Electron Limited Method and process using fingerprint based semiconductor manufacturing process fault detection

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126028A (en) 1989-04-17 1992-06-30 Materials Research Corporation Sputter coating process control method and apparatus
US5270222A (en) 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2742170B2 (ja) * 1992-02-17 1998-04-22 山形日本電気株式会社 半導体装置の製造システム
US5812261A (en) * 1992-07-08 1998-09-22 Active Impulse Systems, Inc. Method and device for measuring the thickness of opaque and transparent films
US5555177A (en) 1994-05-27 1996-09-10 Ontrak Systems, Inc. Method and apparatus for resetting individual processes in a control system
US5614247A (en) * 1994-09-30 1997-03-25 International Business Machines Corporation Apparatus for chemical vapor deposition of aluminum oxide
US5715361A (en) * 1995-04-13 1998-02-03 Cvc Products, Inc. Rapid thermal processing high-performance multizone illuminator for wafer backside heating
US5665214A (en) 1995-05-03 1997-09-09 Sony Corporation Automatic film deposition control method and system
US5536317A (en) * 1995-10-27 1996-07-16 Specialty Coating Systems, Inc. Parylene deposition apparatus including a quartz crystal thickness/rate controller
JP2965002B2 (ja) 1997-06-20 1999-10-18 日本電気株式会社 半導体記憶装置
JPH1116973A (ja) * 1997-06-26 1999-01-22 Hitachi Ltd 半導体装置製造方法及びその半導体装置製造方法で製造された半導体装置
EP0932194A1 (en) * 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision
JP4271745B2 (ja) * 1998-05-15 2009-06-03 浜松ホトニクス株式会社 半導体製造装置制御システム
US6303395B1 (en) * 1999-06-01 2001-10-16 Applied Materials, Inc. Semiconductor processing techniques
FR2808098B1 (fr) * 2000-04-20 2002-07-19 Cit Alcatel Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126028A (en) 1989-04-17 1992-06-30 Materials Research Corporation Sputter coating process control method and apparatus
US5270222A (en) 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis

Also Published As

Publication number Publication date
DE60011143D1 (de) 2004-07-01
EP1254401A1 (en) 2002-11-06
WO2001050206A1 (en) 2001-07-12
DE60011143T2 (de) 2005-06-02
KR20020063269A (ko) 2002-08-01
EP1254401B1 (en) 2004-05-26
JP2003519444A (ja) 2003-06-17
US6684122B1 (en) 2004-01-27

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