JP2003324104A5 - - Google Patents
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- Publication number
- JP2003324104A5 JP2003324104A5 JP2002127488A JP2002127488A JP2003324104A5 JP 2003324104 A5 JP2003324104 A5 JP 2003324104A5 JP 2002127488 A JP2002127488 A JP 2002127488A JP 2002127488 A JP2002127488 A JP 2002127488A JP 2003324104 A5 JP2003324104 A5 JP 2003324104A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- manufacturing
- resist
- resist layer
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 18
- 238000004519 manufacturing process Methods 0.000 claims 12
- 238000005498 polishing Methods 0.000 claims 8
- 239000010409 thin film Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 4
- 239000010408 film Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 235000011114 ammonium hydroxide Nutrition 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000003618 dip coating Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 238000004528 spin coating Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000001771 vacuum deposition Methods 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002127488A JP2003324104A (ja) | 2002-04-26 | 2002-04-26 | 半導体装置の製造方法 |
| US10/310,625 US6881656B1 (en) | 2002-04-26 | 2002-12-05 | Production process for semiconductor apparatus |
| TW091135256A TWI251864B (en) | 2002-04-26 | 2002-12-05 | Production process for semiconductor apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002127488A JP2003324104A (ja) | 2002-04-26 | 2002-04-26 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003324104A JP2003324104A (ja) | 2003-11-14 |
| JP2003324104A5 true JP2003324104A5 (enExample) | 2005-09-22 |
Family
ID=29541583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002127488A Pending JP2003324104A (ja) | 2002-04-26 | 2002-04-26 | 半導体装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6881656B1 (enExample) |
| JP (1) | JP2003324104A (enExample) |
| TW (1) | TWI251864B (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250016843A (ko) * | 2023-07-26 | 2025-02-04 | 에스케이하이닉스 주식회사 | 메모리 장치 및 이의 제조방법 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5679610A (en) * | 1994-12-15 | 1997-10-21 | Kabushiki Kaisha Toshiba | Method of planarizing a semiconductor workpiece surface |
| US6858909B2 (en) * | 2002-11-29 | 2005-02-22 | International Business Machines Corporation | CMP assisted liftoff micropatterning |
-
2002
- 2002-04-26 JP JP2002127488A patent/JP2003324104A/ja active Pending
- 2002-12-05 TW TW091135256A patent/TWI251864B/zh not_active IP Right Cessation
- 2002-12-05 US US10/310,625 patent/US6881656B1/en not_active Expired - Fee Related
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