JP2003315296A5 - - Google Patents

Download PDF

Info

Publication number
JP2003315296A5
JP2003315296A5 JP2002121228A JP2002121228A JP2003315296A5 JP 2003315296 A5 JP2003315296 A5 JP 2003315296A5 JP 2002121228 A JP2002121228 A JP 2002121228A JP 2002121228 A JP2002121228 A JP 2002121228A JP 2003315296 A5 JP2003315296 A5 JP 2003315296A5
Authority
JP
Japan
Prior art keywords
substrate
base
detection device
gap
detection apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002121228A
Other languages
English (en)
Japanese (ja)
Other versions
JP3931294B2 (ja
JP2003315296A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002121228A priority Critical patent/JP3931294B2/ja
Priority claimed from JP2002121228A external-priority patent/JP3931294B2/ja
Publication of JP2003315296A publication Critical patent/JP2003315296A/ja
Publication of JP2003315296A5 publication Critical patent/JP2003315296A5/ja
Application granted granted Critical
Publication of JP3931294B2 publication Critical patent/JP3931294B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2002121228A 2002-04-23 2002-04-23 検出装置 Expired - Lifetime JP3931294B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002121228A JP3931294B2 (ja) 2002-04-23 2002-04-23 検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002121228A JP3931294B2 (ja) 2002-04-23 2002-04-23 検出装置

Publications (3)

Publication Number Publication Date
JP2003315296A JP2003315296A (ja) 2003-11-06
JP2003315296A5 true JP2003315296A5 (enExample) 2005-09-22
JP3931294B2 JP3931294B2 (ja) 2007-06-13

Family

ID=29537232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002121228A Expired - Lifetime JP3931294B2 (ja) 2002-04-23 2002-04-23 検出装置

Country Status (1)

Country Link
JP (1) JP3931294B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007086268A1 (ja) * 2006-01-24 2007-08-02 National Institute Of Advanced Industrial Science And Technology 微小電極およびその製造方法
JP2009063462A (ja) * 2007-09-07 2009-03-26 Sony Corp 光学測定装置及び微粒子解析装置
JP5681965B2 (ja) * 2007-09-26 2015-03-11 瑞穂 森田 検出素子およびそれを用いた検出装置
JP2015141074A (ja) * 2014-01-28 2015-08-03 九州エレクトロン株式会社 微粒子検出装置
CN107810411B (zh) * 2015-06-30 2020-04-14 豪夫迈·罗氏有限公司 用于使用纳米制造的设备来测量分析物的设计和方法
JP6645902B2 (ja) * 2016-04-26 2020-02-14 京セラ株式会社 粒子状物質検出装置
DE102016107888A1 (de) * 2016-04-28 2017-11-02 Heraeus Sensor Technology Gmbh Sensor zur Detektion elektrisch leitfähiger und/oder polarisierbarer Partikel, Sensorsystem, Verfahren zum Betreiben eines Sensors und Verwendung eines derartigen Sensors
JP6656732B2 (ja) * 2016-08-10 2020-03-04 メイン—エナージア インコーポレイテッド 太陽光電池モジュールの表面の汚染度測定装置

Similar Documents

Publication Publication Date Title
CA2325148A1 (en) Bus bar heat sink
US20160088720A1 (en) Transistor thermal and emi management solution for fast edge rate environment
PL1956647T3 (pl) Układ przełączający z urządzeniem połączeniowym oraz sposób jego wykonania
JP2011151185A5 (ja) 半導体装置
US3396361A (en) Combined mounting support, heat sink, and electrical terminal connection assembly
KR20140122185A (ko) 인쇄 회로 보드에 통합된 열전 쿨러/히터
TW200501345A (en) Stacked-type semiconductor device
KR910005418A (ko) 근접결합된 기판 온도감지 소자용 반도체 구조물
WO2005013339A3 (en) Methods of forming conductive structures including titanium-tungsten base layers and related structures
ATE316290T1 (de) Flüssigkeitshaltiges photovoltaisches element
TW200511534A (en) Tape circuit substrate and semiconductor chip package using the same
JP2003315296A5 (enExample)
WO2018148398A3 (en) Thermoelectric module and flexible thermoelectric circuit assembly
WO2009020240A3 (en) Semiconductor device and method for manufacturing the same
KR101008772B1 (ko) 집적 회로 장치, 전자 회로 지지 기판 및 집적 회로와 히트싱크의 열적 접속 방법
TWI268575B (en) Semiconductor device with suppressed copper migration
KR940020539A (ko) 저 인덕턴스 반도체 패키지(Low inductance semiconductor package)
US9258882B2 (en) Electronic devices comprising printed circuit boards
US7564128B2 (en) Fully testable surface mount die package configured for two-sided cooling
EP2866258A3 (en) Semiconductor device and manufacturing method thereof
TW200511548A (en) Ball grid array package for high speed devices
JP2020067415A5 (enExample)
JP2005101128A5 (enExample)
JP2022061662A (ja) 異常ネルンスト効果を利用した発電素子
TW200618726A (en) Power module and electric transportation apparatus incorporating the same