JP2005101128A5 - - Google Patents

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Publication number
JP2005101128A5
JP2005101128A5 JP2003330999A JP2003330999A JP2005101128A5 JP 2005101128 A5 JP2005101128 A5 JP 2005101128A5 JP 2003330999 A JP2003330999 A JP 2003330999A JP 2003330999 A JP2003330999 A JP 2003330999A JP 2005101128 A5 JP2005101128 A5 JP 2005101128A5
Authority
JP
Japan
Prior art keywords
semiconductor device
conductive film
resin layer
wirings
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003330999A
Other languages
English (en)
Japanese (ja)
Other versions
JP4247611B2 (ja
JP2005101128A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003330999A priority Critical patent/JP4247611B2/ja
Priority claimed from JP2003330999A external-priority patent/JP4247611B2/ja
Publication of JP2005101128A publication Critical patent/JP2005101128A/ja
Publication of JP2005101128A5 publication Critical patent/JP2005101128A5/ja
Application granted granted Critical
Publication of JP4247611B2 publication Critical patent/JP4247611B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003330999A 2003-09-24 2003-09-24 半導体装置 Expired - Fee Related JP4247611B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003330999A JP4247611B2 (ja) 2003-09-24 2003-09-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003330999A JP4247611B2 (ja) 2003-09-24 2003-09-24 半導体装置

Publications (3)

Publication Number Publication Date
JP2005101128A JP2005101128A (ja) 2005-04-14
JP2005101128A5 true JP2005101128A5 (enExample) 2006-11-09
JP4247611B2 JP4247611B2 (ja) 2009-04-02

Family

ID=34459773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003330999A Expired - Fee Related JP4247611B2 (ja) 2003-09-24 2003-09-24 半導体装置

Country Status (1)

Country Link
JP (1) JP4247611B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4311376B2 (ja) 2005-06-08 2009-08-12 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法、電子部品、回路基板及び電子機器
JP2008211806A (ja) * 2008-03-06 2008-09-11 Seiko Epson Corp 半導体装置、半導体装置の製造方法、電子部品、回路基板及び電子機器
JP5516511B2 (ja) * 2011-06-09 2014-06-11 セイコーエプソン株式会社 電子部品、回路基板及び電子機器
JP5569473B2 (ja) * 2011-06-09 2014-08-13 セイコーエプソン株式会社 電子部品、回路基板及び電子機器
JP5773027B2 (ja) * 2014-04-28 2015-09-02 セイコーエプソン株式会社 電子部品及び電子機器
JP6402978B2 (ja) * 2014-07-25 2018-10-10 セイコーエプソン株式会社 半導体回路素子、電子機器、および移動体

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