JP4247611B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4247611B2
JP4247611B2 JP2003330999A JP2003330999A JP4247611B2 JP 4247611 B2 JP4247611 B2 JP 4247611B2 JP 2003330999 A JP2003330999 A JP 2003330999A JP 2003330999 A JP2003330999 A JP 2003330999A JP 4247611 B2 JP4247611 B2 JP 4247611B2
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JP
Japan
Prior art keywords
resin layer
semiconductor device
conductive film
semiconductor substrate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003330999A
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English (en)
Japanese (ja)
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JP2005101128A5 (enExample
JP2005101128A (ja
Inventor
浩司 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2003330999A priority Critical patent/JP4247611B2/ja
Publication of JP2005101128A publication Critical patent/JP2005101128A/ja
Publication of JP2005101128A5 publication Critical patent/JP2005101128A5/ja
Application granted granted Critical
Publication of JP4247611B2 publication Critical patent/JP4247611B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2003330999A 2003-09-24 2003-09-24 半導体装置 Expired - Fee Related JP4247611B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003330999A JP4247611B2 (ja) 2003-09-24 2003-09-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003330999A JP4247611B2 (ja) 2003-09-24 2003-09-24 半導体装置

Publications (3)

Publication Number Publication Date
JP2005101128A JP2005101128A (ja) 2005-04-14
JP2005101128A5 JP2005101128A5 (enExample) 2006-11-09
JP4247611B2 true JP4247611B2 (ja) 2009-04-02

Family

ID=34459773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003330999A Expired - Fee Related JP4247611B2 (ja) 2003-09-24 2003-09-24 半導体装置

Country Status (1)

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JP (1) JP4247611B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105305965A (zh) * 2014-07-25 2016-02-03 精工爱普生株式会社 半导体电路元件、电子设备以及移动体

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4311376B2 (ja) 2005-06-08 2009-08-12 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法、電子部品、回路基板及び電子機器
JP2008211806A (ja) * 2008-03-06 2008-09-11 Seiko Epson Corp 半導体装置、半導体装置の製造方法、電子部品、回路基板及び電子機器
JP5516511B2 (ja) * 2011-06-09 2014-06-11 セイコーエプソン株式会社 電子部品、回路基板及び電子機器
JP5569473B2 (ja) * 2011-06-09 2014-08-13 セイコーエプソン株式会社 電子部品、回路基板及び電子機器
JP5773027B2 (ja) * 2014-04-28 2015-09-02 セイコーエプソン株式会社 電子部品及び電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105305965A (zh) * 2014-07-25 2016-02-03 精工爱普生株式会社 半导体电路元件、电子设备以及移动体

Also Published As

Publication number Publication date
JP2005101128A (ja) 2005-04-14

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