JP2003297876A5 - - Google Patents
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- Publication number
- JP2003297876A5 JP2003297876A5 JP2002094632A JP2002094632A JP2003297876A5 JP 2003297876 A5 JP2003297876 A5 JP 2003297876A5 JP 2002094632 A JP2002094632 A JP 2002094632A JP 2002094632 A JP2002094632 A JP 2002094632A JP 2003297876 A5 JP2003297876 A5 JP 2003297876A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- photosensitive insulating
- substrate
- semiconductor
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 17
- 239000000758 substrate Substances 0.000 claims 15
- 229920005989 resin Polymers 0.000 claims 12
- 239000011347 resin Substances 0.000 claims 12
- 239000011342 resin composition Substances 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 5
- 239000000178 monomer Substances 0.000 claims 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims 3
- 125000003700 epoxy group Chemical group 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 claims 3
- 125000000524 functional group Chemical group 0.000 claims 3
- -1 methacryloyl group Chemical group 0.000 claims 3
- 229920003986 novolac Polymers 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000003085 diluting agent Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000003999 initiator Substances 0.000 claims 2
- 239000011256 inorganic filler Substances 0.000 claims 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims 2
- 238000000206 photolithography Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000013007 heat curing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002094632A JP3893303B2 (ja) | 2002-03-29 | 2002-03-29 | 半導体パッケージの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002094632A JP3893303B2 (ja) | 2002-03-29 | 2002-03-29 | 半導体パッケージの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003297876A JP2003297876A (ja) | 2003-10-17 |
| JP2003297876A5 true JP2003297876A5 (enrdf_load_stackoverflow) | 2005-10-20 |
| JP3893303B2 JP3893303B2 (ja) | 2007-03-14 |
Family
ID=29387015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002094632A Expired - Fee Related JP3893303B2 (ja) | 2002-03-29 | 2002-03-29 | 半導体パッケージの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3893303B2 (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007291394A (ja) * | 2004-05-31 | 2007-11-08 | Sumitomo Bakelite Co Ltd | 樹脂組成物、接着フィルムおよび樹脂ワニス |
| JP2007291375A (ja) * | 2004-05-31 | 2007-11-08 | Sumitomo Bakelite Co Ltd | 樹脂組成物、接着フィルムおよび樹脂ワニス |
| US20060234159A1 (en) | 2005-04-19 | 2006-10-19 | Nitto Denko Corporation | Photosensitive epoxy resin adhesive composition and use thereof |
| US7767543B2 (en) | 2005-09-06 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a micro-electro-mechanical device with a folded substrate |
| JP4756963B2 (ja) * | 2005-09-08 | 2011-08-24 | 東京応化工業株式会社 | カラーフィルタ用感光性樹脂組成物およびこれを用いたカラーフィルタ |
| JP4959627B2 (ja) * | 2007-05-25 | 2012-06-27 | 住友ベークライト株式会社 | 樹脂組成物、樹脂スペーサ用フィルムおよび半導体装置 |
| JP2008297540A (ja) * | 2008-04-14 | 2008-12-11 | Sumitomo Bakelite Co Ltd | 感光性接着剤樹脂組成物、接着フィルムおよび受光装置 |
| JP5414622B2 (ja) * | 2010-05-27 | 2014-02-12 | パナソニック株式会社 | 半導体実装基板およびそれを用いた実装構造体 |
| JP6205955B2 (ja) * | 2013-07-31 | 2017-10-04 | 日立化成株式会社 | 半導体装置の製造方法及びその製造方法によって得られる半導体装置 |
-
2002
- 2002-03-29 JP JP2002094632A patent/JP3893303B2/ja not_active Expired - Fee Related
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