JP3893303B2 - 半導体パッケージの製造方法 - Google Patents

半導体パッケージの製造方法 Download PDF

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Publication number
JP3893303B2
JP3893303B2 JP2002094632A JP2002094632A JP3893303B2 JP 3893303 B2 JP3893303 B2 JP 3893303B2 JP 2002094632 A JP2002094632 A JP 2002094632A JP 2002094632 A JP2002094632 A JP 2002094632A JP 3893303 B2 JP3893303 B2 JP 3893303B2
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JP
Japan
Prior art keywords
insulating resin
substrate
photosensitive insulating
semiconductor
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002094632A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003297876A (ja
JP2003297876A5 (enrdf_load_stackoverflow
Inventor
均 川口
高橋　　豊誠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2002094632A priority Critical patent/JP3893303B2/ja
Publication of JP2003297876A publication Critical patent/JP2003297876A/ja
Publication of JP2003297876A5 publication Critical patent/JP2003297876A5/ja
Application granted granted Critical
Publication of JP3893303B2 publication Critical patent/JP3893303B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]

Landscapes

  • Materials For Photolithography (AREA)
  • Wire Bonding (AREA)
JP2002094632A 2002-03-29 2002-03-29 半導体パッケージの製造方法 Expired - Fee Related JP3893303B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002094632A JP3893303B2 (ja) 2002-03-29 2002-03-29 半導体パッケージの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002094632A JP3893303B2 (ja) 2002-03-29 2002-03-29 半導体パッケージの製造方法

Publications (3)

Publication Number Publication Date
JP2003297876A JP2003297876A (ja) 2003-10-17
JP2003297876A5 JP2003297876A5 (enrdf_load_stackoverflow) 2005-10-20
JP3893303B2 true JP3893303B2 (ja) 2007-03-14

Family

ID=29387015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002094632A Expired - Fee Related JP3893303B2 (ja) 2002-03-29 2002-03-29 半導体パッケージの製造方法

Country Status (1)

Country Link
JP (1) JP3893303B2 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007291375A (ja) * 2004-05-31 2007-11-08 Sumitomo Bakelite Co Ltd 樹脂組成物、接着フィルムおよび樹脂ワニス
JP2007291394A (ja) * 2004-05-31 2007-11-08 Sumitomo Bakelite Co Ltd 樹脂組成物、接着フィルムおよび樹脂ワニス
US20060234159A1 (en) 2005-04-19 2006-10-19 Nitto Denko Corporation Photosensitive epoxy resin adhesive composition and use thereof
US7767543B2 (en) 2005-09-06 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a micro-electro-mechanical device with a folded substrate
JP4756963B2 (ja) * 2005-09-08 2011-08-24 東京応化工業株式会社 カラーフィルタ用感光性樹脂組成物およびこれを用いたカラーフィルタ
JP4959627B2 (ja) * 2007-05-25 2012-06-27 住友ベークライト株式会社 樹脂組成物、樹脂スペーサ用フィルムおよび半導体装置
JP2008297540A (ja) * 2008-04-14 2008-12-11 Sumitomo Bakelite Co Ltd 感光性接着剤樹脂組成物、接着フィルムおよび受光装置
JP5414622B2 (ja) * 2010-05-27 2014-02-12 パナソニック株式会社 半導体実装基板およびそれを用いた実装構造体
JP6205955B2 (ja) * 2013-07-31 2017-10-04 日立化成株式会社 半導体装置の製造方法及びその製造方法によって得られる半導体装置

Also Published As

Publication number Publication date
JP2003297876A (ja) 2003-10-17

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