JP2003264388A - 電気部品装置 - Google Patents

電気部品装置

Info

Publication number
JP2003264388A
JP2003264388A JP2002064163A JP2002064163A JP2003264388A JP 2003264388 A JP2003264388 A JP 2003264388A JP 2002064163 A JP2002064163 A JP 2002064163A JP 2002064163 A JP2002064163 A JP 2002064163A JP 2003264388 A JP2003264388 A JP 2003264388A
Authority
JP
Japan
Prior art keywords
circuit board
spacer
printed circuit
semiconductor element
electric component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002064163A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003264388A5 (enExample
Inventor
Atsuyuki Hiruma
淳之 蛭間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carrier Japan Corp
Original Assignee
Toshiba Carrier Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Carrier Corp filed Critical Toshiba Carrier Corp
Priority to JP2002064163A priority Critical patent/JP2003264388A/ja
Priority to CN03119886.4A priority patent/CN1256010C/zh
Publication of JP2003264388A publication Critical patent/JP2003264388A/ja
Publication of JP2003264388A5 publication Critical patent/JP2003264388A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2002064163A 2002-03-08 2002-03-08 電気部品装置 Pending JP2003264388A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002064163A JP2003264388A (ja) 2002-03-08 2002-03-08 電気部品装置
CN03119886.4A CN1256010C (zh) 2002-03-08 2003-03-07 电气部件装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002064163A JP2003264388A (ja) 2002-03-08 2002-03-08 電気部品装置

Publications (2)

Publication Number Publication Date
JP2003264388A true JP2003264388A (ja) 2003-09-19
JP2003264388A5 JP2003264388A5 (enExample) 2005-05-19

Family

ID=28034865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002064163A Pending JP2003264388A (ja) 2002-03-08 2002-03-08 電気部品装置

Country Status (2)

Country Link
JP (1) JP2003264388A (enExample)
CN (1) CN1256010C (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005114339A (ja) * 2003-09-17 2005-04-28 Sanyo Electric Co Ltd 空気調和機の室外機
JP2009188208A (ja) * 2008-02-06 2009-08-20 Tdk-Lambda Corp 放熱器
JP2011067064A (ja) * 2009-09-18 2011-03-31 Mitsubishi Heavy Ind Ltd インバータ一体型電動圧縮機
CN102306638A (zh) * 2011-08-31 2012-01-04 昆山锦泰电子器材有限公司 带有半导体三极管的组装散热片
JP2012069649A (ja) * 2010-09-22 2012-04-05 Hitachi Automotive Systems Ltd 電子制御装置
JP2015073100A (ja) * 2010-03-24 2015-04-16 三菱エンジニアリングプラスチックス株式会社 放熱部材及び発熱体の放熱構造
JP2016076609A (ja) * 2014-10-07 2016-05-12 アール・ビー・コントロールズ株式会社 プリント配線基板用スペーサ
EP1887621A3 (de) * 2006-08-12 2016-05-25 Diehl AKO Stiftung & Co. KG Leistungselektronik mit Kühlkörper
EP3168868A1 (en) * 2015-11-13 2017-05-17 Covidien LP System and method for thermal management of electronic devices
JP2018190847A (ja) * 2017-05-09 2018-11-29 三菱電機株式会社 ヒートシンク及び照明器具、並びにヒートシンクの製造方法
JPWO2023145964A1 (enExample) * 2022-01-31 2023-08-03
JP7791217B2 (ja) 2022-01-31 2025-12-23 京セラ株式会社 半導体モジュール

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100397600C (zh) * 2005-04-26 2008-06-25 佛山市顺德区顺达电脑厂有限公司 晶体管模块组装方法及其治具
DE102012222959B4 (de) * 2012-12-12 2015-04-02 Semikron Elektronik Gmbh & Co. Kg Leistungsbauelementeinrichtung
JP6168362B2 (ja) * 2014-09-05 2017-07-26 株式会社オートネットワーク技術研究所 回路構成体、電気接続箱及びスペーサ
US10701799B2 (en) * 2015-03-31 2020-06-30 Hewlett-Packard Development Company, L.P. Printed circuit board
CN109887894B (zh) * 2019-02-28 2020-11-20 北京比特大陆科技有限公司 散热器、电路板和计算设备
CN110848820A (zh) * 2019-10-22 2020-02-28 青岛海尔空调器有限总公司 散热器和空调器

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005114339A (ja) * 2003-09-17 2005-04-28 Sanyo Electric Co Ltd 空気調和機の室外機
EP1887621A3 (de) * 2006-08-12 2016-05-25 Diehl AKO Stiftung & Co. KG Leistungselektronik mit Kühlkörper
JP2009188208A (ja) * 2008-02-06 2009-08-20 Tdk-Lambda Corp 放熱器
JP2011067064A (ja) * 2009-09-18 2011-03-31 Mitsubishi Heavy Ind Ltd インバータ一体型電動圧縮機
JP2015073100A (ja) * 2010-03-24 2015-04-16 三菱エンジニアリングプラスチックス株式会社 放熱部材及び発熱体の放熱構造
JP2012069649A (ja) * 2010-09-22 2012-04-05 Hitachi Automotive Systems Ltd 電子制御装置
CN102306638A (zh) * 2011-08-31 2012-01-04 昆山锦泰电子器材有限公司 带有半导体三极管的组装散热片
JP2016076609A (ja) * 2014-10-07 2016-05-12 アール・ビー・コントロールズ株式会社 プリント配線基板用スペーサ
EP3168868A1 (en) * 2015-11-13 2017-05-17 Covidien LP System and method for thermal management of electronic devices
US10123460B2 (en) 2015-11-13 2018-11-06 Covidien LLP System and method for thermal management of electronic devices
JP2018190847A (ja) * 2017-05-09 2018-11-29 三菱電機株式会社 ヒートシンク及び照明器具、並びにヒートシンクの製造方法
JPWO2023145964A1 (enExample) * 2022-01-31 2023-08-03
JP7791217B2 (ja) 2022-01-31 2025-12-23 京セラ株式会社 半導体モジュール

Also Published As

Publication number Publication date
CN1444438A (zh) 2003-09-24
CN1256010C (zh) 2006-05-10

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