CN1256010C - 电气部件装置 - Google Patents

电气部件装置 Download PDF

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Publication number
CN1256010C
CN1256010C CN03119886.4A CN03119886A CN1256010C CN 1256010 C CN1256010 C CN 1256010C CN 03119886 A CN03119886 A CN 03119886A CN 1256010 C CN1256010 C CN 1256010C
Authority
CN
China
Prior art keywords
mentioned
spacer
semiconductor device
heat sink
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN03119886.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN1444438A (zh
Inventor
蛭间淳之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carrier Japan Corp
Original Assignee
Toshiba Carrier Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Carrier Corp filed Critical Toshiba Carrier Corp
Publication of CN1444438A publication Critical patent/CN1444438A/zh
Application granted granted Critical
Publication of CN1256010C publication Critical patent/CN1256010C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN03119886.4A 2002-03-08 2003-03-07 电气部件装置 Expired - Fee Related CN1256010C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP064163/2002 2002-03-08
JP2002064163A JP2003264388A (ja) 2002-03-08 2002-03-08 電気部品装置

Publications (2)

Publication Number Publication Date
CN1444438A CN1444438A (zh) 2003-09-24
CN1256010C true CN1256010C (zh) 2006-05-10

Family

ID=28034865

Family Applications (1)

Application Number Title Priority Date Filing Date
CN03119886.4A Expired - Fee Related CN1256010C (zh) 2002-03-08 2003-03-07 电气部件装置

Country Status (2)

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JP (1) JP2003264388A (enExample)
CN (1) CN1256010C (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005114339A (ja) * 2003-09-17 2005-04-28 Sanyo Electric Co Ltd 空気調和機の室外機
CN100397600C (zh) * 2005-04-26 2008-06-25 佛山市顺德区顺达电脑厂有限公司 晶体管模块组装方法及其治具
DE102006061215A1 (de) * 2006-08-12 2008-02-21 Diehl Ako Stiftung & Co. Kg Leistungselektronik mit Kühlkörper
JP5177794B2 (ja) * 2008-02-06 2013-04-10 Ｔｄｋラムダ株式会社 放熱器
JP5529477B2 (ja) * 2009-09-18 2014-06-25 三菱重工業株式会社 インバータ一体型電動圧縮機
JP5712697B2 (ja) * 2010-03-24 2015-05-07 三菱エンジニアリングプラスチックス株式会社 放熱部材及び発熱体の放熱構造
JP5336448B2 (ja) * 2010-09-22 2013-11-06 日立オートモティブシステムズ株式会社 電子制御装置
CN102306638A (zh) * 2011-08-31 2012-01-04 昆山锦泰电子器材有限公司 带有半导体三极管的组装散热片
DE102012222959B4 (de) * 2012-12-12 2015-04-02 Semikron Elektronik Gmbh & Co. Kg Leistungsbauelementeinrichtung
JP6168362B2 (ja) * 2014-09-05 2017-07-26 株式会社オートネットワーク技術研究所 回路構成体、電気接続箱及びスペーサ
JP2016076609A (ja) * 2014-10-07 2016-05-12 アール・ビー・コントロールズ株式会社 プリント配線基板用スペーサ
US10701799B2 (en) * 2015-03-31 2020-06-30 Hewlett-Packard Development Company, L.P. Printed circuit board
US10123460B2 (en) 2015-11-13 2018-11-06 Covidien LLP System and method for thermal management of electronic devices
JP6939068B2 (ja) * 2017-05-09 2021-09-22 三菱電機株式会社 ヒートシンク及び照明器具、並びにヒートシンクの製造方法
CN109887894B (zh) * 2019-02-28 2020-11-20 北京比特大陆科技有限公司 散热器、电路板和计算设备
CN110848820A (zh) * 2019-10-22 2020-02-28 青岛海尔空调器有限总公司 散热器和空调器

Also Published As

Publication number Publication date
JP2003264388A (ja) 2003-09-19
CN1444438A (zh) 2003-09-24

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060510

Termination date: 20100307