JP2003249509A - 半導体封止方法および封止された半導体 - Google Patents
半導体封止方法および封止された半導体Info
- Publication number
- JP2003249509A JP2003249509A JP2002049535A JP2002049535A JP2003249509A JP 2003249509 A JP2003249509 A JP 2003249509A JP 2002049535 A JP2002049535 A JP 2002049535A JP 2002049535 A JP2002049535 A JP 2002049535A JP 2003249509 A JP2003249509 A JP 2003249509A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- resin
- thickness
- sealing
- semiconductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 180
- 238000007789 sealing Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims description 43
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 239000003822 epoxy resin Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 37
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 37
- 239000000853 adhesive Substances 0.000 claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 claims abstract description 32
- 229920001721 polyimide Polymers 0.000 claims abstract description 28
- 239000009719 polyimide resin Substances 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 238000005538 encapsulation Methods 0.000 claims description 23
- 239000003566 sealing material Substances 0.000 claims description 22
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 239000000126 substance Substances 0.000 abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 13
- 238000010292 electrical insulation Methods 0.000 abstract description 11
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 238000007796 conventional method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002049535A JP2003249509A (ja) | 2002-02-26 | 2002-02-26 | 半導体封止方法および封止された半導体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002049535A JP2003249509A (ja) | 2002-02-26 | 2002-02-26 | 半導体封止方法および封止された半導体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003249509A true JP2003249509A (ja) | 2003-09-05 |
| JP2003249509A5 JP2003249509A5 (enrdf_load_stackoverflow) | 2005-08-25 |
Family
ID=28662019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002049535A Pending JP2003249509A (ja) | 2002-02-26 | 2002-02-26 | 半導体封止方法および封止された半導体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003249509A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009527117A (ja) * | 2006-02-14 | 2009-07-23 | デルファイ・テクノロジーズ・インコーポレーテッド | 圧電アクチュエータ |
| JP2012059743A (ja) * | 2010-09-06 | 2012-03-22 | Nitto Denko Corp | 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート |
| JP2012151451A (ja) * | 2010-12-27 | 2012-08-09 | Shin Etsu Chem Co Ltd | 繊維含有樹脂基板、封止後半導体素子搭載基板及び封止後半導体素子形成ウエハ、半導体装置、及び半導体装置の製造方法 |
| JP2013147589A (ja) * | 2012-01-20 | 2013-08-01 | Nitto Denko Corp | 電子部品封止用樹脂組成物シートおよびそれを用いた電子部品装置の製法 |
| JP2014076606A (ja) * | 2012-10-11 | 2014-05-01 | Nitto Denko Corp | 積層体 |
| WO2014080717A1 (ja) * | 2012-11-20 | 2014-05-30 | 日東電工株式会社 | 電子部品装置の製造方法、及び、電子部品装置 |
-
2002
- 2002-02-26 JP JP2002049535A patent/JP2003249509A/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009527117A (ja) * | 2006-02-14 | 2009-07-23 | デルファイ・テクノロジーズ・インコーポレーテッド | 圧電アクチュエータ |
| JP2012059743A (ja) * | 2010-09-06 | 2012-03-22 | Nitto Denko Corp | 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート |
| JP2012151451A (ja) * | 2010-12-27 | 2012-08-09 | Shin Etsu Chem Co Ltd | 繊維含有樹脂基板、封止後半導体素子搭載基板及び封止後半導体素子形成ウエハ、半導体装置、及び半導体装置の製造方法 |
| US9240332B2 (en) | 2010-12-27 | 2016-01-19 | Shin-Etsu Chemical Co., Ltd. | Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus |
| EP2469590A3 (en) * | 2010-12-27 | 2016-06-08 | Shin-Etsu Chemical Co., Ltd. | Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus |
| JP2013147589A (ja) * | 2012-01-20 | 2013-08-01 | Nitto Denko Corp | 電子部品封止用樹脂組成物シートおよびそれを用いた電子部品装置の製法 |
| JP2014076606A (ja) * | 2012-10-11 | 2014-05-01 | Nitto Denko Corp | 積層体 |
| WO2014080717A1 (ja) * | 2012-11-20 | 2014-05-30 | 日東電工株式会社 | 電子部品装置の製造方法、及び、電子部品装置 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050215 |
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| A621 | Written request for application examination |
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| A977 | Report on retrieval |
Effective date: 20050822 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
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| A131 | Notification of reasons for refusal |
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