JP2003234020A - 導電性微粒子 - Google Patents

導電性微粒子

Info

Publication number
JP2003234020A
JP2003234020A JP2002029784A JP2002029784A JP2003234020A JP 2003234020 A JP2003234020 A JP 2003234020A JP 2002029784 A JP2002029784 A JP 2002029784A JP 2002029784 A JP2002029784 A JP 2002029784A JP 2003234020 A JP2003234020 A JP 2003234020A
Authority
JP
Japan
Prior art keywords
conductive
fine particles
particles
metal layer
conductive fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002029784A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003234020A5 (enExample
Inventor
Yoshikazu Yoneda
義和 米田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2002029784A priority Critical patent/JP2003234020A/ja
Publication of JP2003234020A publication Critical patent/JP2003234020A/ja
Publication of JP2003234020A5 publication Critical patent/JP2003234020A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
JP2002029784A 2002-02-06 2002-02-06 導電性微粒子 Pending JP2003234020A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002029784A JP2003234020A (ja) 2002-02-06 2002-02-06 導電性微粒子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002029784A JP2003234020A (ja) 2002-02-06 2002-02-06 導電性微粒子

Publications (2)

Publication Number Publication Date
JP2003234020A true JP2003234020A (ja) 2003-08-22
JP2003234020A5 JP2003234020A5 (enExample) 2005-08-11

Family

ID=27773836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002029784A Pending JP2003234020A (ja) 2002-02-06 2002-02-06 導電性微粒子

Country Status (1)

Country Link
JP (1) JP2003234020A (enExample)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317270A (ja) * 2004-04-27 2005-11-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
WO2006019154A1 (ja) * 2004-08-20 2006-02-23 Sekisui Chemical Co., Ltd. 導電性微粒子及び異方性導電材料
JP2006228474A (ja) * 2005-02-15 2006-08-31 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006269296A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd 突起粒子の製造方法、突起粒子、導電性突起粒子及び異方性導電材料
JP2006344416A (ja) * 2005-06-07 2006-12-21 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006351508A (ja) * 2005-05-20 2006-12-28 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法及び異方性導電材料
JP2007035573A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、及び、異方性導電材料
JP2007035572A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、及び、異方性導電材料
JP2007207665A (ja) * 2006-02-03 2007-08-16 Sekisui Chem Co Ltd 導電性粒子の製造方法、導電性粒子及び異方性導電材料
WO2008130080A1 (en) * 2007-04-23 2008-10-30 Hanwha Chemical Corporation Manufacturing method of conductive electroless plating powder
US7491445B2 (en) * 2004-09-02 2009-02-17 Sekisui Chemical Co., Ltd. Electroconductive fine particle and anisotropically electroconductive material comprising non-crystal and crystal nickel plating layers and method of making thereof
WO2009063827A1 (ja) * 2007-11-12 2009-05-22 Hitachi Chemical Company, Ltd. 回路接続材料、及び回路部材の接続構造
JP2012109252A (ja) * 2011-12-22 2012-06-07 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2012151486A (ja) * 2006-01-16 2012-08-09 Hitachi Chem Co Ltd 導電性接着フィルム
US9173302B2 (en) 2006-08-29 2015-10-27 Hitachi Chemical Company, Ltd. Conductive adhesive film and solar cell module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1173818A (ja) * 1997-08-28 1999-03-16 Ricoh Co Ltd 導電性粒子および異方導電性接着材および液晶表示装置
JPH1171560A (ja) * 1997-08-28 1999-03-16 Ricoh Co Ltd 異方導電性接着材および液晶表示装置および液晶表示装置の作製方法
JP2000195339A (ja) * 1998-12-25 2000-07-14 Sony Chem Corp 異方導電性接着フィルム
JP2000243132A (ja) * 1999-02-22 2000-09-08 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1173818A (ja) * 1997-08-28 1999-03-16 Ricoh Co Ltd 導電性粒子および異方導電性接着材および液晶表示装置
JPH1171560A (ja) * 1997-08-28 1999-03-16 Ricoh Co Ltd 異方導電性接着材および液晶表示装置および液晶表示装置の作製方法
JP2000195339A (ja) * 1998-12-25 2000-07-14 Sony Chem Corp 異方導電性接着フィルム
JP2000243132A (ja) * 1999-02-22 2000-09-08 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317270A (ja) * 2004-04-27 2005-11-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
US7470416B2 (en) 2004-08-20 2008-12-30 Sekisui Chemical Co., Ltd. Conductive fine particles and anisotropic conductive material
WO2006019154A1 (ja) * 2004-08-20 2006-02-23 Sekisui Chemical Co., Ltd. 導電性微粒子及び異方性導電材料
JP2006059721A (ja) * 2004-08-20 2006-03-02 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
US7491445B2 (en) * 2004-09-02 2009-02-17 Sekisui Chemical Co., Ltd. Electroconductive fine particle and anisotropically electroconductive material comprising non-crystal and crystal nickel plating layers and method of making thereof
JP2006228474A (ja) * 2005-02-15 2006-08-31 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006269296A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd 突起粒子の製造方法、突起粒子、導電性突起粒子及び異方性導電材料
JP2006351508A (ja) * 2005-05-20 2006-12-28 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法及び異方性導電材料
JP2006344416A (ja) * 2005-06-07 2006-12-21 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2007035572A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、及び、異方性導電材料
JP2007035573A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、及び、異方性導電材料
JP2012151486A (ja) * 2006-01-16 2012-08-09 Hitachi Chem Co Ltd 導電性接着フィルム
JP2007207665A (ja) * 2006-02-03 2007-08-16 Sekisui Chem Co Ltd 導電性粒子の製造方法、導電性粒子及び異方性導電材料
US9173302B2 (en) 2006-08-29 2015-10-27 Hitachi Chemical Company, Ltd. Conductive adhesive film and solar cell module
WO2008130080A1 (en) * 2007-04-23 2008-10-30 Hanwha Chemical Corporation Manufacturing method of conductive electroless plating powder
KR100879578B1 (ko) * 2007-04-23 2009-01-22 한화석유화학 주식회사 도전성 무전해 도금분체의 제조방법
WO2009063827A1 (ja) * 2007-11-12 2009-05-22 Hitachi Chemical Company, Ltd. 回路接続材料、及び回路部材の接続構造
JP2012109252A (ja) * 2011-12-22 2012-06-07 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体

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