JP2003220530A - Machining vibration table device with ultrasonic vibration and adsorption function - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To overcome limits such that there is a limit in corresponding to reduction of the diameter and the depth even though shape accuracy of the size or the like in mechanical machining to a hard and brittle material such as ceramics, glass, silicon is relatively excellent, for example, the diameter of a hole with several hundreds microns is a limit in boring, it is very difficult to bore a hole with several hundreds microns or less in diameter, and the limit of the depth to the diameter (an aspect ratio) is 5-10. <P>SOLUTION: Boring of very fine diameter and grooving of a hard and brittle hard-to-cut material can be facilitated by assisting removal of machining chips with so-called a surface wave and by suppressing increase of frictional resistance between the tool tip and an object to be machined by applying ultrasonic vibration in the longitudinal direction to a mechanical machining table for mounting the object to be machined. <P>COPYRIGHT: (C)2003,JPO

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a technique for mechanically processing a hard and brittle material such as ceramics, silicon, and glass, and more specifically, to a workpiece. The present invention relates to a novel machining table device having an ultrasonic vibration function and a vacuum suction function on a mounting machining table. 2. Description of the Related Art In a conventional processing method using ultrasonic waves, it is known that a bolted vibrator is arranged on a spindle side and vibration amplitude is transmitted between a vibrator and a tool via a horn. However, this method requires a horn design corresponding to the shape of the tool, and the length of the tool itself is limited, making it impossible to use an ideal tool for the workpiece. As a result, the processing efficiency is reduced. [0003] The conventional processing machine X ·
The main purpose of the processing table installed on the Y-axis stage is to mount a workpiece. As mentioned above, we solved the impossibility rate when applying vibration to the tool side, and considered a method to increase machining efficiency due to vibration. Devised. In recent years, miniaturization has been rapidly progressing in a wide range of fields such as electronic components including semiconductors. Materials used in these fields have also been improved in performance and function, and hard-brittle hard-to-cut materials such as ceramics, glass, and silicon have been increasing. In processing such as drilling and grooving of these materials, mechanical processing, thermal processing, chemical processing, and the like are used, all of which have advantages and disadvantages. For example,
Regarding the hole shape accuracy in fine drilling, mechanical processing is relatively good. However, there is a limit in mechanical processing in terms of miniaturization. For example, in drilling, the diameter of a hole is limited to several hundred microns, and a diameter less than 100 μm is very difficult. Therefore, it would be possible to easily and efficiently perform ultra-fine diameter drilling and grooving of hard and brittle hard-to-cut materials by mechanical processing, which would contribute to the development of processing technology in related industries. [0004] If the removal of machining debris is not performed smoothly in mechanical machining, the frictional resistance between the tip of the tool being machined and the workpiece increases, and finally, It leads to tool breakage. In the case of drilling, for example, the smaller the diameter of the hole, the more difficult it is to remove machining chips, which is an obstacle to micromachining in mechanical machining. Therefore, by applying ultrasonic vibration in the vertical direction to the machining table for mounting the workpiece, removal of machining chips is assisted,
Suppresses the increase in frictional resistance between the tool tip and the workpiece,
A micro-sized hole drilling and grooving process for hard and brittle difficult-to-cut materials can be easily performed. In addition, since the grinding force is applied by the ultrasonic vibration itself in the vertical direction, the processing efficiency is also improved. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of a working table apparatus according to the present invention will be described. One or a plurality of ultrasonic vibrators 1 are fixed to the back of a working table upper plate 2 by bolts in FIG. , Is built in a cylindrical processing table main body case 3. The ultrasonic oscillator 5 and the ultrasonic oscillator 1 are connected by a signal cable 4, and the ultrasonic oscillator 1 is vibrated by a signal from the ultrasonic oscillator 5, and a processing table top plate 2 for mounting a workpiece. Vibrates vertically. The ultrasonic transmitter 5 can automatically track the resonance frequency of the vibration system and can control the amplitude of the ultrasonic vibrator 1 to be constant irrespective of the load fluctuation. A plurality of vacuum suction grooves 7, a plurality of vacuum suction holes 8, and a vacuum suction tube 6 are provided on the surface of the processing table top plate 2 for mounting a workpiece. FIG. 2 shows a machining table in which a machining table device of the present invention is installed on a machining machine. A machining table main body case 3 is mounted on an XY axis stage 20 having a structure in which the X axis and the Y axis can move simultaneously. Has been fixed. A workpiece 19 is fixed to the processing table upper surface plate 2 by a vacuum suction method or a bolting method, and the workpiece 19 is ground by a small-diameter tool 18 mounted on a spindle 17 mounted on a Z-axis 16 capable of moving up and down. I do. During the processing, a vertical ultrasonic vibration is applied to the workpiece 19 by the processing table device of the present invention. This transmitter is a bolted Langevin type transducer (BLT)
This is a transmitter that can automatically track the resonance frequency of a vibration system using a PLL. It consists of a PLL transmission circuit, a power variable circuit, and an automatic amplitude control circuit. Have. [0007] The main purpose of the processing table installed on the X / Y axis stage of the conventional processing machine is to mount a workpiece. It has a role to assist mechanical grinding itself by adding a sound wave vibration function. According to this, by suppressing the grinding resistance at the time of working, it is possible to facilitate the drilling and grooving work of the hard and brittle difficult-to-cut material, shorten the working time, and extend the tool life.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a schematic configuration of a processing table device of the present invention. FIG. 2 is a perspective view showing a state where the processing table device of the present invention is installed on a processing machine. [Description of Signs] 1 Ultrasonic vibrator 2 Processing table top plate 3 Processing table body case 4 Signal cable 5 Ultrasonic transmitter 6 Vacuum suction tube 7 Vacuum suction groove 8 Vacuum suction hole 9 Frequency adjustment dial 10 Alarm Lamp 11 Power lamp 12 Power switch 13 Automatic / manual switch 14 Output switch 15 Amplitude adjustment dial 16 Z axis 17 Spindle 18 Micro diameter tool 19 Workpiece 20 X / Y axis stage

Claims (1)

Claims: 1. A vacuum suction type machining table apparatus for mounting a workpiece and a dedicated ultrasonic transmitter having a vertical ultrasonic vibration function by a bolted vibrator.