JP2007125867A - Disk-shaped blade and cutting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a disk-shaped blade which stably exhibits excellent cutting performance to a working object, formed from a hard and brittle material, and a cutting apparatus which stably exhibits excellent cutting performance and which can be easily designed. <P>SOLUTION: A motor is powered on, and a rotating shaft 3 is rotated. Next, an ultrasonic alternating voltage with a frequency of about 230 KHz from an ultrasonic-wave oscillation circuit, not shown in Fig., is applied to ring-shaped piezoelectric elements 8a and 8b made of piezoelectric ceramics, which are joined to the cutting blade via rotary transformers 9a and 9b. Subsequently, cooling water is imparted from a nozzle to the rotating disk-shaped cutting blade 1 and the working object, not shown in Fig., so that the working object can be cut or grooved. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a disk-shaped blade and a cutting device that can be advantageously used for cutting or grooving a workpiece formed of a brittle material such as glass or silicon.

  A cutting device with a disk-shaped blade is generally used for cutting or grooving a workpiece formed from a hard and brittle material such as glass, silicon, silicon nitride, rare earth magnet material or super hard metal. It is used.

  FIG. 1 is a front view showing a configuration example of a conventional cutting device 5 described in Patent Document 1, and FIG. 2 is a side view of the cutting device 5 of FIG. The cutting device 5 shown in FIGS. 1 and 2 includes a first flange 2a, a disc-shaped cutting blade 1, and a second flange 2b attached to the rotary shaft 3 of the rotary drive device 6, and these flanges 2a, It comprises a nut 4 for fastening and fixing the cutting blade 1 by 2b. Then, the workpiece is cut or grooved while the rotary drive device 6 of the cutting device 5 is operated to rotate the disc-shaped cutting blade 1.

  On the other hand, a method of cutting an object to be processed while applying ultrasonic vibration to a tool such as a tool of a machine tool is known. Such a cutting method is called ultrasonic cutting, and is described in detail in Non-Patent Document 1. Ultrasonic cutting has the advantages that the frictional resistance between the workpiece and the tool is reduced, so that the thermal distortion of the machined surface is reduced, the machining accuracy is increased, and the life of the cutting tool is extended. ing. Further, it is described in detail in Non-Patent Document 2 that the processing speed is doubled or more.

Patent Document 2 discloses a cutting device having a configuration in which an ultrasonic transducer is attached to a rotating shaft that rotates a disk-shaped blade. This cutting device rotates at the outer edge of the blade while rotating the disk-shaped blade and applying the ultrasonic vibration generated by the ultrasonic vibrator to the disk-shaped blade via the rotating shaft. Cut the object. The disk-shaped blade of this cutting device is fixed to the tip of the rotating shaft while being tightened by a vibration transmission direction changer and a nut. The ultrasonic vibrator attached to the rotating shaft generates ultrasonic vibration that vibrates in the axial direction of the rotating shaft, and this ultrasonic vibration is supersonic that vibrates in the direction in which the diameter of the blade is expanded or contracted by the vibration transmission direction converter. It is converted into sonic vibration and applied to the blade. In order to convert the transmission direction of the ultrasonic vibration, the rotating shaft and the vibration transmission direction converter are designed in a predetermined shape by numerical calculation using a finite element method or the like.
JP-A-8-127003 JP 2000-210928 A Ultrasonic Handbook Editorial Committee, “Ultrasonic Handbook”, Maruzen Co., Ltd., August 1999, p679-684 Japan Electromechanical Industry Association, "Ultrasonic Engineering", Corona Co., Ltd., 1993, p218-229

  In the cutting apparatus described in Patent Document 2, the frequency of ultrasonic vibration applied to the blade is 50 KHz at most because the ultrasonic vibrator attached to the rotating shaft is a Langevin type ultrasonic vibrator. Degree. Further, when a vibration frequency of 100 KHz or higher is given due to the shape of the rotating shaft or the vibration transmission direction changer, the vibration mode becomes complicated and desired vibration in the radial direction of the blade cannot be obtained.

An object of the present invention is to provide a disk-shaped blade with stable excellent cutting performance.
Another object of the present invention is to provide a cutting device that stably exhibits excellent cutting performance and is easy to design.

  The present invention is a cutting apparatus or grinding apparatus having a disk-shaped blade, in which a piezoelectric element is joined to the disk-shaped blade and a high frequency voltage of 100 KHz or more is applied to the piezoelectric element.

  The present invention also provides a cutting device or a grinding device having a disk-shaped blade, in which a piezoelectric element is joined to the disk-shaped blade, and a high frequency voltage of 1 MHz or more is applied to the piezoelectric element.

  The present invention also provides a cutting device or a grinding device having a disk-shaped blade, in which a piezoelectric element is bonded to a support plate in contact with the disk-shaped blade, and a high-frequency voltage of 100 KHz or more is applied to the piezoelectric element.

  The present invention is also a cutting apparatus or grinding apparatus having a disk-shaped blade, in which a piezoelectric element is bonded to a support plate in contact with the disk-shaped blade, and a high frequency voltage of 1 MHz or more is applied to the piezoelectric element.

  The present invention also provides a cutting device or grinding device having a disk-shaped blade, in which a piezoelectric element is joined to a flange that holds and holds the disk-shaped blade, and a high frequency voltage of 100 KHz or more is applied to the piezoelectric element.

  The present invention also provides a cutting device or a grinding device having a disk-shaped blade, in which a piezoelectric element is joined to a flange that holds and holds the disk-shaped blade, and a high-frequency voltage of 1 MHz or more is applied to the piezoelectric element.

  In the cutting apparatus or grinding apparatus having a disk-shaped blade according to the present invention, ultrasonic vibrations of 100 KHz or more are excited on the disk-shaped blade, so that the vibration acceleration excited by the disk-shaped blade is large, but the vibration displacement is small. . For this reason, the cutting device of the present invention naturally reduces the vibration displacement perpendicular to the blade surface which is not necessary for the disk-shaped blade, so that the cutting width can be made highly accurate. In addition, blade consumption is reduced.

  In the cutting apparatus or grinding apparatus having a disk-shaped blade according to the present invention, since ultrasonic vibration of 1 MHz or more is excited on the disk-shaped blade, the vibration acceleration excited on the disk-shaped blade is still larger, but the vibration displacement is Even smaller. For this reason, the cutting device according to the present invention naturally reduces vibration displacement perpendicular to the blade surface which is not necessary for the disk-shaped blade, so that it is particularly effective when higher accuracy of the cutting width is required. become. And the roughness of the processed surface is also greatly improved. In addition, blade consumption is reduced.

  The first embodiment of the present invention will be described with reference to the front view of FIG. 3 and the cross-sectional view of FIG. 4 taken along line AA of FIG. Here, the cutting blade 1 is composed of a circular substrate and an electrodeposited abrasive layer. The circular substrate is made of, for example, a steel plate having a thickness of about 0.06 mm and an outer diameter of about 70 mm, or a metal plate such as aluminum, and a mounting hole for mounting on the rotating shaft is formed at the center.

  Moreover, in order to form an electrodeposited abrasive grain layer on a circular substrate, a normal electroplating method can be used. That is, diamond abrasive grains are mixed with nickel sulfate liquid contained in a plating tank, and nickel plating is performed on a circular substrate in a plating liquid in which diamond abrasive grains are mixed with the nickel sulfate liquid. An electrodeposited abrasive layer composed of a fixed composite plating layer can be formed. Piezoelectric elements 8a and 8b made of a ring-shaped PZT-based piezoelectric ceramic having an outer diameter of about 60 mm, an inner diameter of about 45 mm, and a thickness of about 0.5 mm, which coincide with the central axis of the circular substrate of the cutting blade 1, are made of epoxy resin. Join. The piezoelectric element 8 is polarized in the thickness direction. Here, a PZT piezoelectric ceramic is used as the piezoelectric element 8, but it is needless to say that it may be a crystal, a lithium niobate single crystal, or the like.

  FIG. 6 which is a plan view of FIG. 5 and a cross-sectional view taken along line AA of FIG. 5 shows a state where the cutting blade 1 in which the piezoelectric element 8 is bonded with an epoxy resin is mounted on the rotary shaft 3 of the cutting device. Here, the rotation drive mechanism, the bearing mechanism, and the like are not shown. The cutting blade 1 is sandwiched between a first flange 2b and a second flange 2a attached to the tip of the rotary shaft 3, and is fixed by a tightening nut 4 screwed onto a screw portion of the rotary shaft 3. . A fixed rotary transformer 9a is attached to the case 15, and an ultrasonic oscillator (not shown) is connected to the fixed rotary transformer 9a by a lead wire. The rotary rotary transformer 9b is fixed to the flange 2a side with a screw (not shown).

  Next, the operation method of the cutting apparatus using the disk-shaped blade 1 will be described with reference to the sectional view of FIG. First, the power of a motor (not shown) is turned on to rotate the rotary shaft 3. Next, an ultrasonic AC voltage of about 230 KHz from an ultrasonic oscillation circuit (not shown) is applied to the ring-shaped piezoelectric ceramic piezoelectric elements 8a and 8b joined to the cutting blade 1 via the rotary transformers 9a and 9b. By applying the ultrasonic alternating voltage, the disc-shaped cutting blade 1 is excited by vibration of about 230 KHz. The outline of the vibration mode is as follows. The ring-shaped piezoelectric ceramic piezoelectric elements 8a and 8b have a width that is half the difference between the outer diameter and the inner diameter, and the intermediate diameter between the outer diameter and the inner diameter is a vibration node. Vibrate. Next, cooling water is supplied from a nozzle to the rotating disk-shaped cutting blade 1 and a workpiece (not shown), and the workpiece is cut or grooved.

  The object to be processed was made of glass, and the rotation speed of the rotating shaft was set to 12000 rpm. As a result, although the tip vibration displacement of the cutting blade is 0.1 μm or less in both the radial direction and the direction perpendicular to the diameter, the amount of wear of the cutting blade is about 1/6 compared to when ultrasonic vibration is not applied. And the size of the chipping was reduced to about 1/12.

  This result is significantly different from the conventional ultrasonic machining conditions. Non-Patent Document 1, page 679 describes general ultrasonic vibration cutting conditions. According to this, a frequency of 20 to 50 KHz and a vibration amplitude of 5 to 40 μm are described.

Non-Patent Document 3 describes in detail the vibration of the disc and the vibration of the ring used in the above example. Recently, the finite element method is often used because the vibration calculation method using the finite element method can be calculated more accurately.
Kenzo Nagai, “Electric / mechanical vibrators and their applications”, Corona Co., Ltd., March 1974, p101-104

  By exciting a vibration mode having a natural frequency of 100 KHz or higher, which is a higher-order vibration mode of an annulus or a disk, as described above, by reducing vibration displacement and increasing vibration acceleration, Since the cutting effect is equal to or higher and the lateral vibration of the blade is reduced, the machining accuracy is improved.

For example, the vibration acceleration of a vibration displacement of 1 μm at 20 KHz is 1.58 × 10 ⁴ m / s ² , and the vibration acceleration of a vibration displacement of 0.1 μm at 200 KHz is 1.58 × 10 ⁵ m / s ² . By increasing the vibration frequency in this way, it is possible to reduce the vibration displacement and simultaneously increase the vibration acceleration. Furthermore, the vibration acceleration of a vibration displacement of 0.01 μm at 2 MHz is 1.58 × 10 ⁶ m / s ² . In this way, machining at a frequency of MHz or higher results in almost complete acceleration energy machining with a vibration displacement of almost zero level. In other words, it is an acceleration energy processing technology that is a processing technology that has never existed before.

  For machining at a frequency of MHz or higher, only the method of bonding a piezoelectric element to the tool itself can effectively excite the acceleration of the frequency of MHz or higher on the tool. However, it has not been considered to join a piezoelectric element to the tool itself, so it is considered that an acceleration energy processing technique having a frequency of MHz or more could not be developed.

  Therefore, as another example of using the technique of the present invention, if a tool is a tool, a piezoelectric element is bonded to the tool chip itself, and if an acceleration energy machining technique with a vibration frequency of MHz or more and a vibration displacement of 0.1 μm or less is used, naturally Needless to say, the machining accuracy and the roughness of the machined surface can be improved as compared with conventional ultrasonic vibration machining. In addition, tool wear can be greatly improved. The shank or holder that holds the bite tip in the previous example of the bite is a tool holder, and a piezoelectric element may be joined to it, but the acceleration energy at a frequency of MHz or higher is attenuated in the tool holder. Therefore, the effect becomes small.

  As an example of a tool that joins a piezoelectric element to the tool itself of the present invention and uses an acceleration energy machining technique with a frequency of MHz or higher, as a rotating tool, a drill, an end mill, a grinding wheel, a diamond wheel, a tap, a grindstone with a shaft, etc. There is. In addition to tools, tools that do not rotate include drills attached to a lathe and diamond files.

  As described above, by joining the piezoelectric element to the cutting blade and further applying ultrasonic vibration of 100 KHz or more, it is possible to eliminate the disadvantages of the configuration in which the cutting blade is vibrated by the ultrasonic vibration of the method tried in the past.

Further, although the piezoelectric elements are bonded to both sides of the cutting blade 1, it is needless to say that vibration can be excited in the cutting blade 1 with only one piezoelectric element on the cutting blade 1.

  Next, a description will be given of a configuration having the same configuration as that of the first embodiment and a frequency of about 2 MHz. Since it is almost the same as the first embodiment, only the difference will be described by setting the frequency to about 2 MHz. The circular substrate is made of, for example, a steel plate having a thickness of about 0.06 mm and an outer diameter of about 70 mm, or a metal plate such as aluminum, and a mounting hole for mounting on the rotating shaft is formed at the center.

  A piezoelectric element 4 made of a ring-shaped PZT-based piezoelectric ceramic having an outer diameter of about 60 mm, an inner diameter of about 58 mm, and a thickness of about 0.5 mm, which is aligned with the central axis of the circular substrate of the cutting blade 1, is joined by an epoxy resin. . The piezoelectric element 8 is polarized in the thickness direction.

  Next, the operation method of the cutting apparatus using the disk-shaped blade 1 will be described with reference to the sectional view of FIG. First, the power of a motor (not shown) is turned on to rotate the rotary shaft 3. Next, an ultrasonic alternating voltage of about 2 MHz from an ultrasonic oscillation circuit (not shown) is applied to the piezoelectric ceramic ring-shaped piezoelectric elements 8a and 8b joined to the cutting blade via the rotary transformers 9a and 9b. By applying the ultrasonic alternating voltage, the disc-shaped cutting blade 1 is excited by a minute displacement vibration of about 2 MHz. Next, cooling water is supplied from a nozzle to the rotating disk-shaped blade 1 and the workpiece not shown, and the workpiece is cut or grooved.

  The object to be processed was made of glass, and the rotation speed of the rotating shaft was set to 12000 rpm. As a result, the tip vibration displacement of the cutting blade was 0.05 μm or less in both the radial direction and the direction perpendicular to the diameter. The amount of wear of the cutting blade at that time was about 1/8 compared to when no ultrasonic vibration was applied, and the chipping size of the workpiece was about 1/20.

  By exciting vibration of 1 MHz or more to the cutting blade 1 as described above, the vibration displacement is further reduced, and the vibration acceleration is further increased, so that the cutting effect is equal to or greater and the blade lateral vibration is further reduced. Furthermore, processing accuracy is improved.

  A second embodiment of the present invention will be described with reference to the front view of FIG. 7 and the cross-sectional view of FIG. 8 taken along the line AA of FIG.

  First, the support plate 7a was prepared as follows. A piezoelectric ceramic element 8a having an outer diameter of 60 mm, an inner diameter of 45 mm, and a thickness of 0.5 mm is placed on the center of an aluminum annular plate, which is a rigid plate having an outer diameter of 70 mm, an inner diameter of 40 mm, and a thickness of 1.5 mm. Match with the shaft and join with epoxy resin. The rigid plate is preferably an ultrasonic vibration material with a small vibration loss, and a metal such as an aluminum alloy or titanium and an inorganic material such as alumina or glass are suitable. The support plate 7b is formed in the same manner as the support plate 7a. The polarization direction of the piezoelectric ceramic is the plate thickness direction.

  A through-hole bolt 11 with an outer diameter of 40 mm and an inner diameter of 30 mm with a through-hole through which a rotating shaft with a diameter of 30 mm passes through the central axis, a disc-shaped cut with support plates 7a and 7b, a diameter of 78 mm, an inner diameter of 40 mm, and a thickness of 0.06 mm Pass blade 1 through. And these are mechanically integrated by the screw provided in the through-hole bolt 11 and the joining nut 12. The through-hole bolt 11 is provided with four pins 14 through which the four wires provided.

  FIG. 9 is a plan view of the structure in which the support plates 7a and 7b and the disc-shaped cutting blade 1 are mechanically integrated by passing through the through-hole bolts 11 and joined to the rotary shaft 3 by mechanically integrating them with the joining nuts 12. FIG. 10 is a cross-sectional view taken along the line AA of FIG.

  The rotary transformer 9a on the rotating side is fixed to a flange 2b having a structure in which the sleeve 15 and the inner flange 2b are integrated with screws (not shown). Then, an integrated blade is inserted along the outer diameter surface of the sleeve 15. Next, the flange 2 a is inserted along the outer diameter surface of the sleeve 15. Furthermore, these are integrated by the flange nut 10. The shapes of the surfaces of the flanges 2a and 2b contacting the support plates 7a and 7b are an outer diameter of 70 mm and an inner diameter of 65 mm. A sleeve 15 to which an integrated blade is attached is attached to the rotary shaft 3 with a nut 4.

  Next, the operation method of the cutting apparatus using the above disk-shaped cutting blade 1 will be described with reference to the sectional view of FIG. First, the power of a motor (not shown) is turned on to rotate the rotary shaft 3. Next, an ultrasonic alternating voltage of about 200 KHz from an ultrasonic oscillation circuit (not shown) is applied to the ring-shaped piezoelectric ceramic piezoelectric elements 8a and 8b constituting the support plates 7a and 7b via the rotary transformers 9a and 9b. By applying the ultrasonic alternating voltage, the support plates 7a and 7b and the disk-shaped blade 1 are excited by vibration of about 200 KHz. Next, cooling water is supplied from a nozzle to the rotating disk-shaped cutting blade 1 and a workpiece (not shown), and the workpiece is cut or grooved.

  The object to be processed was made of glass, and the rotation speed of the rotating shaft was set to 12000 rotations / minute. As a result, when the vibration displacement at the tip of the cutting blade is 0.1 μm or less in both the radial direction and the direction perpendicular to the diameter, the amount of wear at the tip of the cutting blade is about ３ compared to when no ultrasonic vibration is applied. And the size of chipping became about 1/9.

  In the above embodiment, a metal blade is used. However, the same effect can be obtained with a resin blade.

  Next, a description will be given of a configuration having the same configuration as that of the second embodiment and a frequency of about 2 MHz. Since it is almost the same as the second embodiment, only the parts that are different will be described by setting the frequency to about 2 MHz.

  The support plate 7a was prepared as follows. An aluminum annular plate, which is a rigid plate having an outer diameter of 70 mm, an inner diameter of 40 mm, and a thickness of 1.5 mm, and a piezoelectric element 8a made of a piezoelectric ceramic having an outer diameter of 60 mm, an inner diameter of 58 mm, and a thickness of 0.5 mm at the center. Match with the shaft and join with epoxy resin. The polarization direction of the piezoelectric ceramic is the plate thickness direction.

  Next, the operation method of the cutting device using the disk-shaped blade 1 will be described with reference to the sectional view of FIG. First, the power of a motor (not shown) is turned on to rotate the rotary shaft 3. Next, an ultrasonic alternating voltage of about 2 MHz from an ultrasonic oscillation circuit (not shown) is applied to the ring-shaped piezoelectric ceramic piezoelectric elements 8a and 8b constituting the support plates 7a and 7b via the rotary transformers 9a and 9b. By applying the ultrasonic alternating voltage, the support plates 7a and 7b and the disk-shaped blade 1 are excited by vibration of about 2 MHz. Next, cooling water is supplied from a nozzle to the rotating disk-shaped blade 1 and the workpiece not shown, and the workpiece is cut or grooved.

  The object to be processed was made of glass, and the rotation speed of the rotating shaft was set to 12000 rotations / minute. As a result, the tip vibration displacement of the cutting blade 1 was 0.05 μm or less in both the radial direction and the direction perpendicular to the diameter. Then, the amount of wear of the cutting blade at that time was about 1/5 compared to when no ultrasonic vibration was applied, and the size of chipping was about 1/10.

  Of course, the same effect can be obtained by applying ultrasonic vibration of 100 KHz or more or 1 MHz or more to the rotating processing tool.

  Furthermore, by joining a piezoelectric element 8 made of piezoelectric ceramic to the flange 2 as shown in FIG. 11 and applying ultrasonic vibration of 100 KHz or more or 1 MHz or more, the same effect can be expected. Is not as effective as the above example. However, electrical wiring is simplified, and a cutting blade or a support plate to which a piezoelectric element is bonded is not necessary, so that the apparatus can be simplified and can be provided at low cost.

  Here, the processing result of glass will be briefly described. First, a piezoelectric element 8 made of piezoelectric ceramic was joined to the flange 2 to excite ultrasonic vibration of about 200 KHz. When the rotational speed of the rotary shaft was 12000 rotations / minute, the tip vibration displacement of the cutting blade was changed in the radial direction and diameter. The cutting blade tip consumption at that time is about ½ compared to when no ultrasonic vibration is applied, and the chipping size is about 1/6. Became.

  As another example, when a piezoelectric element 8 made of piezoelectric ceramic is joined to the flange 2 to excite ultrasonic vibration of about 2 MHz, the tip vibration displacement of the cutting blade is reduced in diameter when the rotational speed of the rotating shaft is 12000 rpm. Both the direction and the direction perpendicular to the diameter are 0.05 μm or less, the amount of wear of the cutting blade tip at that time is about ½ compared to when no ultrasonic vibration is applied, and the size of chipping is about It became 1/5.

  According to the technique of the present invention, the vibration displacement of the cutting blade can be made small enough to be ignored, the consumption of the cutting blade can be reduced, and the processing quality such as chipping can be improved. Therefore, a method of applying ultrasonic vibrations of 100 KHz or more is particularly suitable for a cutting blade having an extremely thin thickness of 50 μm or less.

  The disk-shaped blade and cutting device of the present invention can be advantageously used for cutting or grooving a workpiece formed from a brittle material such as glass or silicon.

It is a front view which shows the structural example of the conventional cutting device. It is a side view of the cutting device of FIG. It is a front view which shows the disk shaped cutting blade of the 1st Embodiment of this invention. It is sectional drawing cut | disconnected by the AA line of FIG. It is the front view which attached the disk-shaped cutting blade of the 1st Embodiment of this invention to the rotating shaft. It is sectional drawing cut | disconnected by the AA line of FIG. It is a front which shows the disk-shaped cutting blade and support plate of the 2nd Embodiment of this invention. It is sectional drawing cut | disconnected by the AA line of FIG. It is the front view which attached the disk-shaped cutting blade and supporter board of the 2nd Embodiment of this invention to the rotating shaft. It is sectional drawing cut | disconnected by the AA line of FIG. It is sectional drawing which shows the structure which joined the piezoelectric element to the flange.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cutting blade 2 Flange 3 Rotating shaft 4 Nut 5 Cutting device 6 Rotation drive device 7 Support plate 8 Piezoelectric element 9 Rotary transformer 10 Flange nut 11 Through-hole bolt 12 Joint nut 13 Case 14 Pin 15 Sleeve

Claims (6)

  In a cutting apparatus or a grinding apparatus having a disk-shaped blade, a piezoelectric element is bonded to the disk-shaped blade, and a high frequency voltage of 100 KHz or more is applied to the piezoelectric element.   In a cutting device or a grinding device having a disk-shaped blade, a piezoelectric element is bonded to the disk-shaped blade, and a high frequency voltage of 1 MHz or more is applied to the piezoelectric element.   In a cutting apparatus or a grinding apparatus having a disk-shaped blade, a piezoelectric element is bonded to a support plate that is in contact with the disk-shaped blade, and a high-frequency voltage of 100 KHz or more is applied to the piezoelectric element.   A cutting device or a grinding device having a disk-shaped blade is characterized in that a piezoelectric element is bonded to a support plate in contact with the disk-shaped blade, and a high frequency voltage of 1 MHz or more is applied to the piezoelectric element.   A cutting device or a grinding device having a disk-shaped blade is characterized in that a piezoelectric element is joined to a flange that holds and holds the disk-shaped blade, and a high-frequency voltage of 100 KHz or more is applied to the piezoelectric element.   A cutting device or a grinding device having a disk-shaped blade is characterized in that a piezoelectric element is joined to a flange that holds and holds the disk-shaped blade, and a high-frequency voltage of 1 MHz or more is applied to the piezoelectric element.

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