JP2987427B2 - Drilling method for zirconium dioxide ceramics - Google Patents

Drilling method for zirconium dioxide ceramics

Info

Publication number
JP2987427B2
JP2987427B2 JP9008412A JP841297A JP2987427B2 JP 2987427 B2 JP2987427 B2 JP 2987427B2 JP 9008412 A JP9008412 A JP 9008412A JP 841297 A JP841297 A JP 841297A JP 2987427 B2 JP2987427 B2 JP 2987427B2
Authority
JP
Japan
Prior art keywords
zirconium dioxide
drilling
processing
present
ceramics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9008412A
Other languages
Japanese (ja)
Other versions
JPH10202647A (en
Inventor
毅 道津
義弘 岳
秀樹 柳本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Diamond Industries Co Ltd
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Noritake Diamond Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology, Noritake Diamond Industries Co Ltd filed Critical Agency of Industrial Science and Technology
Priority to JP9008412A priority Critical patent/JP2987427B2/en
Publication of JPH10202647A publication Critical patent/JPH10202647A/en
Application granted granted Critical
Publication of JP2987427B2 publication Critical patent/JP2987427B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/021Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by drilling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drilling And Boring (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、二酸化ジルコニウ
ムセラミックスに微小な穴あけ加工を高精度で施す方法
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for performing high-precision drilling on zirconium dioxide ceramics.

【0002】[0002]

【従来の技術】これまで、アルミナセラミックスや窒化
ケイ素セラミックスのような破壊靭性値の高い難削性セ
ラミックスを穴あけする際に、40kHzの高周波振動
を付加したダイヤモンドコアドリルを用い、振幅24〜
28μmの条件下、回転周速度2〜7m/分という低い
回転速度で加工することは知られている(平成7年11
月7日発行,1995年度精密工学会九州支部鹿児島地
方講演会講演論文集,第59ページ)。しかし、このよ
うな低速回転では、加工速度が遅く、実用に適さない。
2. Description of the Related Art Heretofore, when drilling hard-to-cut ceramics having a high fracture toughness value, such as alumina ceramics and silicon nitride ceramics, a diamond core drill to which a high-frequency vibration of 40 kHz is applied is used.
It is known that machining is performed at a low rotational speed of 2 to 7 m / min under the condition of 28 μm (November 1995
(Published on May 7, 1995, Japan Society of Precision Engineering, Kyushu Branch, Kagoshima Regional Lectures, p. 59). However, such a low-speed rotation results in a low processing speed, which is not suitable for practical use.

【0003】他方、本発明者らは、ケイ素単結晶のよう
な脆く硬い材料を穴あけをする際に、60kHzの高周
波振動を付加したダイヤモンドコアドリルを用い、振幅
1.5μmの条件下、回転速度3000rpm及び送り
速度6.0mm/分までの高速でエッジ部のチッピング
を生じることなく穴あけ加工できることを見いだした
(平成8年10月20日発行,1996年度精密工学会
中国四国支部・九州支部共催学術講演会講演論文集,第
9ページ)。しかしながら、これまで、二酸化ジルコニ
ウムセラミックスのような硬質セラミックスを迅速かつ
高い加工効率で、しかもエッジ部にチッピングを生じる
ことなく、穴あけ加工する方法は知られていなかった。
On the other hand, when drilling a brittle and hard material such as a silicon single crystal, the present inventors used a diamond core drill to which a high frequency vibration of 60 kHz was applied, and under a condition of an amplitude of 1.5 μm and a rotation speed of 3000 rpm. It was found that drilling can be performed at a high feed rate of up to 6.0 mm / min without chipping of the edge part (issued on October 20, 1996, co-sponsored by the 1996 Society of Precision Engineering, Chugoku-Shikoku Branch and Kyushu Branch, 1996). Conference Lectures, 9th page). However, hitherto, there has been no known method for drilling hard ceramics such as zirconium dioxide ceramics with high speed and high processing efficiency and without causing chipping at the edges.

【0004】[0004]

【発明が解決しようとする課題】本発明は、二酸化ジル
コニウムセラミックスに、エッジ部のチッピングを生じ
ることなく、0.1〜0.5mmという微小な穴を高精
度かつ高速であける方法を提供するためになされたもの
である。
SUMMARY OF THE INVENTION An object of the present invention is to provide a method for forming a fine hole of 0.1 to 0.5 mm in a zirconium dioxide ceramic with high accuracy and at high speed without causing edge chipping. It was done in.

【0005】[0005]

【課題を解決するための手段】本発明者らは、二酸化ジ
ルコニウムセラミックスの穴あけ加工について種々研究
を重ねた結果、これまで使用されていなかった60kH
zという大きい高周波振動を付加したダイヤモンドコア
ドリルを用いると、送り速度が0.1mm/分〜0.3
mm/分と比較的高速でかつ回転速度をおとすことな
く、チッピングのほとんどみられない高精度な穴あけが
できることを見出し、この知見に基づいて本発明をなす
に至った。
The present inventors have conducted various studies on drilling of zirconium dioxide ceramics, and as a result, have found that 60 kHz which has not been used so far.
When a diamond core drill to which a high frequency vibration of z is applied is used, the feed rate is 0.1 mm / min to 0.3 mm.
The present inventors have found that high-precision drilling with little chipping can be performed at a relatively high speed of mm / min and without reducing the rotation speed, and based on this finding, the present invention has been accomplished.

【0006】すなわち、本発明は、高周波振動を付加し
たダイヤモンドコアドリルにより二酸化ジルコニウムセ
ラミックスに穴あけ加工を施すに当り、周波数60±1
kHz、振幅1〜5μmの条件下、送り速度0.1〜
0.3mm/分で行うことを特徴とする穴あけ加工方法
を提供するものである。
That is, according to the present invention, when drilling zirconium dioxide ceramics with a diamond core drill to which high-frequency vibration is applied, the frequency is 60 ± 1.
kHz, amplitude 1-5 μm, feed rate 0.1-
It is intended to provide a drilling method characterized by performing at a rate of 0.3 mm / min.

【0007】[0007]

【発明の実施の形態】次に、添付図面にしたがって本発
明を詳細に説明する。図1は、本発明方法を行うのに用
いられる加工装置の構造の1例を説明するための側面図
であって、回転しているダイヤモンドコアドリル1には
発振器2よりホーン3を介して高周波振動が付加され、
支持部4に支持されて試料6に接触している。高周波発
生装置5は、従来使用されている最高周波数40kHz
のものよりもはるかに高い60kHzのものであり、こ
れは発振器2に直結している。このような構造の加工装
置におけるダイヤモンドコアドリル1を二酸化ジルコニ
ウムセラミックス試料6の表面に接触させると、ドリル
の回転と上下振動により、穴あけ加工が施される。この
加工装置の主体部分1〜4は、通常ベルトを介して駆動
されているが、これをモータに直結して駆動すると、回
転精度が高くなる。さらに60kHzの高い周波数を使
用しているので、設計上ホーンが短くなり、振幅も小さ
くなるので、小型、軽量化することができる上に、高精
度、微細な加工が可能になるので有利である。
Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a side view for explaining an example of the structure of a processing apparatus used for carrying out the method of the present invention. A high-frequency vibration is applied to a rotating diamond core drill 1 via a horn 3 from an oscillator 2. Is added,
The sample is supported by the support unit 4 and is in contact with the sample 6. The high frequency generator 5 has a maximum frequency of 40 kHz conventionally used.
Which is much higher than that of 60 kHz, which is directly connected to the oscillator 2. When the diamond core drill 1 in the processing apparatus having such a structure is brought into contact with the surface of the zirconium dioxide ceramic sample 6, drilling is performed by rotation and vertical vibration of the drill. The main parts 1 to 4 of the processing apparatus are usually driven via a belt. However, when the main parts are directly connected to a motor and driven, the rotation accuracy is increased. Further, since a high frequency of 60 kHz is used, the horn is shortened in design and the amplitude is also reduced, so that it is possible to reduce the size and weight and to achieve high precision and fine processing, which is advantageous. .

【0008】本発明においては、このような装置を用
い、周波数60±1kHz、振幅1〜5μm、好ましく
は1.5〜2.5μmで穴あけ加工する。この際のダイ
ヤモンドコアドリルの回転数としては通常のドリルによ
り穴あけの際に用いられる回転数1000〜6000r
pmの範囲で任意に選ぶことができる。このようにし
て、送り速度0.1〜0.3mm/分という比較的高速
で、約10N〜30Nの加工力(回転数3000rpm
における値)により高精密に二酸化ジルコニウムセラミ
ックスに穴あけ加工をすることができる。また、使用工
具の摩耗も少なく加工可能である。
In the present invention, a hole is formed by using such an apparatus at a frequency of 60 ± 1 kHz and an amplitude of 1 to 5 μm, preferably 1.5 to 2.5 μm. In this case, the number of rotations of the diamond core drill is 1000 to 6000 r which is used for drilling with a normal drill.
pm can be arbitrarily selected. In this way, at a relatively high feed rate of 0.1 to 0.3 mm / min, a processing force of about 10 N to 30 N (rotation speed 3000 rpm)
The value in (1) allows highly accurate drilling of zirconium dioxide ceramics. In addition, machining can be performed with little wear of the tool used.

【0009】[0009]

【発明の効果】本発明においては、二酸化ジルコニウム
セラミックスを従来の約3倍の送り速度及びドリルの高
速回転により高能率に穴あけ加工しうるとともに、高い
周波数を用いることにより、高周波音が低下し、周囲環
境に与える雑音を少なくすることができる上に、軸方向
加工力が従来の約15%と小さく、かつホーンが短くな
るため、精度を向上させることができる上に、工具の寿
命も長いという利点がある。さらに作用する加工力が非
常に小さいため、本発明により加工した面は、加工に起
因するダメージが少なく、したがって高品質の加工を行
うことができる。
According to the present invention, zirconium dioxide ceramics can be drilled with high efficiency by using a feed rate approximately three times that of the prior art and a high-speed rotation of a drill, and high-frequency sound is reduced by using a high frequency. In addition to reducing noise to the surrounding environment, the axial machining force is as small as about 15% of the conventional one, and the horn is shortened, so that accuracy can be improved and the tool life is long. There are advantages. Furthermore, since the acting force is very small, the surface processed according to the present invention suffers less damage due to the processing, and therefore can perform high-quality processing.

【0010】[0010]

【実施例】次に、実施例により本発明をさらに詳細に説
明する。
Next, the present invention will be described in more detail with reference to examples.

【0011】参考例 図1に示す構造の高周波振動付加加工装置を用いた。こ
の装置における振動系に関する機能は、周波数60±1
kHz、振幅1〜5μm、発振器出力100W、スピン
ドル系に関する機能は、モータ出力400W、回転数0
〜6000rpmであった。この装置に径3.0mmの
ダイヤモンド電着インターナル軸付き砥石(#150)
を工具ホルダーにより取り付け、ガラス板にワックスで
接着した50×50mm、厚さ0.5mmの二酸化ジル
コニウムセラミックスに貫通穴をあけた。加工液として
はソリューブルタイプを使用し、これを1.5リットル
/分で側方から加工部へ注入した。加工力は、工具動力
計(キスラー)を使用して軸方向分力と回転力を測定し
た。このようにして、送り速度0.1mm/分及び回転
数3000rpmで穴あけしたときの軸方向加工力と回
転力の変動状態を図2に示す。この図においてA域(図
の左側)は従来行われている高周波を付加しない加工方
法によるもの、B域(図の右側)は本発明の加工方法に
よるものである。このように、従来の加工方法では約1
30Nの軸方向加工力が作用しているのに対し、本発明
の加工方法では約20N(従来方法の約15%)と非常
に小さく、しかも安定している。
REFERENCE EXAMPLE A high-frequency vibration processing apparatus having the structure shown in FIG. 1 was used. The function related to the vibration system in this device has a frequency of 60 ± 1.
kHz, amplitude 1-5 μm, oscillator output 100 W, functions related to spindle system, motor output 400 W, rotation speed 0
66000 rpm. A grindstone with a 3.0 mm diameter electrodeposited diamond internal shaft (# 150)
Was attached with a tool holder, and a through hole was made in a 50 × 50 mm, 0.5 mm thick zirconium dioxide ceramics bonded to a glass plate with wax. A solution type was used as a working fluid, and the solution was injected into the working portion from the side at a rate of 1.5 L / min. The processing force was measured for axial component force and rotational force using a tool dynamometer (Kistler). FIG. 2 shows the fluctuation state of the axial processing force and the rotational force when the hole is drilled at the feed rate of 0.1 mm / min and the rotation number of 3000 rpm. In this figure, area A (left side in the figure) is based on the conventional processing method without adding a high frequency, and area B (right side in the figure) is based on the processing method of the present invention. Thus, in the conventional processing method, about 1
While an axial working force of 30 N is applied, the working method of the present invention is very small, about 20 N (about 15% of the conventional method), and is stable.

【0012】次に同じ加工装置及び条件で複数個の穴あ
けを行い、ダイヤモンドコアドリルが摩耗により使用で
きなくなる限界を調べた。結果は10個以上の穴をあけ
てもダイヤモンドコアドリルの摩耗の程度は少なく、ま
だ加工に利用可能であった。これは従来の高周波振動を
付加しない場合の摩耗の程度とほぼ同様であった。
Next, a plurality of holes were drilled using the same processing equipment and conditions, and the limit at which the diamond core drill became unusable due to wear was examined. As a result, even if 10 or more holes were drilled, the degree of wear of the diamond core drill was small, and the diamond core drill was still usable for processing. This was almost the same as the degree of wear when the conventional high-frequency vibration was not applied.

【0013】実施例 参考例で用いたのと同じ加工装置を用い、50×50m
m、厚さ0.5mmの二酸化ジルコニウムセラミックス
試料に、それぞれ送り速度を0.1〜0.4mm/分の
範囲で0.1mm/分ずつ変え、他の条件は参考例と同
様にして3.0mmの穴あけを行った。この結果をグラ
フとして図3に示す。この図から明らかなように、本発
明方法の場合は送り速度の増加に従い、軸方向加工力は
増大しているが、0.3mm/分までは加工力が約30
N以下と小さく安定した加工が可能であることがわか
る。この送り速度0.3mm/分という値は、従来の高
周波振動を付加しない方法の約3倍の値であり、本発明
方法では高速に加工を行っても、穴あけを高精度に行う
ことが可能であることがわかる。また、穴のエッジ部の
チッピングを観察したところ、いずれの送り速度におい
てもほとんどチッピングは認められなかった。
Example Using the same processing apparatus as used in the reference example, 50 × 50 m
m and a zirconium dioxide ceramic sample having a thickness of 0.5 mm, the feed rate was changed by 0.1 mm / min in the range of 0.1 to 0.4 mm / min, and the other conditions were the same as in the reference example. A 0 mm hole was drilled. This result is shown in FIG. 3 as a graph. As is clear from this figure, in the case of the method of the present invention, the axial processing force increases as the feed rate increases, but the processing force is about 30 mm up to 0.3 mm / min.
It can be seen that small and stable processing is possible at N or less. This feed rate of 0.3 mm / min is about three times the value of the conventional method that does not apply high-frequency vibration, and the method of the present invention enables high-precision drilling even when processing is performed at high speed. It can be seen that it is. When chipping of the edge of the hole was observed, almost no chipping was observed at any feed speed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明方法に用いる加工装置の構造の1例を
示す側面図。
FIG. 1 is a side view showing an example of the structure of a processing apparatus used in the method of the present invention.

【図2】 従来方法と本発明方法における軸方向加工力
を示すグラフ。
FIG. 2 is a graph showing the axial working force in the conventional method and the method of the present invention.

【図3】 従来方法と本発明方法における送り速度と軸
方向加工力との関係を示すグラフ。
FIG. 3 is a graph showing a relationship between a feed rate and an axial processing force in the conventional method and the method of the present invention.

【符号の説明】[Explanation of symbols]

1 ダイヤモンドコアドリル 2 発振器 3 ホーン 4 支持部 5 高周波発生装置 6 試料 DESCRIPTION OF SYMBOLS 1 Diamond core drill 2 Oscillator 3 Horn 4 Support part 5 High frequency generator 6 Sample

フロントページの続き (72)発明者 岳 義弘 福岡県春日市大谷1丁目36番地 株式会 社岳将内 (72)発明者 柳本 秀樹 福岡県浮羽郡田主丸町大字竹野210番地 ノリタケダイヤ株式会社内 審査官 西川 恵雄 (56)参考文献 特開 昭60−60980(JP,A) 特開 平3−256658(JP,A) 特開 平9−220716(JP,A) 特開 平10−71612(JP,A) 道津毅、岳義弘、柳本秀樹、「60kH z高周波振動付加によるSi単結晶の微 細加工」、1996年度精密工学会中国四国 支部、九州支部共催学術講演会講演論文 集、平成8年10月20日発行、P9−10 (58)調査した分野(Int.Cl.6,DB名) B28D 1/14 B23B 35/00 Continued on the front page (72) Yoshihiro Take, 1-36 Otani, Kasuga-shi, Fukuoka Japan Shogun Inc. Norio Nishikawa (56) References JP-A-60-60980 (JP, A) JP-A-3-256658 (JP, A) JP-A-9-220716 (JP, A) JP-A-10-71612 (JP, A A) Takeshi Michitsu, Yoshihiro Take, and Hideki Yanagimoto, "Microfabrication of Si Single Crystal by Applying High Frequency Vibration at 60kHz", Proc. Of the Japan Society of Precision Engineering, Chugoku-Shikoku Branch and Kyushu Branch, 1996. Published October 20, P9-10 (58) Fields investigated (Int. Cl. 6 , DB name) B28D 1/14 B23B 35/00

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 高周波振動を付加したダイヤモンドコア
ドリルにより二酸化ジルコニウムセラミックスに穴あけ
加工を施すに当り、周波数60±1kHz、振幅1〜5
μmの条件下、送り速度0.1〜0.3mm/分で行う
ことを特徴とする穴あけ加工方法。
1. When drilling a zirconium dioxide ceramic with a diamond core drill to which a high frequency vibration is applied, a frequency of 60 ± 1 kHz and an amplitude of 1 to 5 are used.
A drilling method, wherein the drilling is performed at a feed rate of 0.1 to 0.3 mm / min under a condition of μm.
JP9008412A 1997-01-21 1997-01-21 Drilling method for zirconium dioxide ceramics Expired - Lifetime JP2987427B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9008412A JP2987427B2 (en) 1997-01-21 1997-01-21 Drilling method for zirconium dioxide ceramics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9008412A JP2987427B2 (en) 1997-01-21 1997-01-21 Drilling method for zirconium dioxide ceramics

Publications (2)

Publication Number Publication Date
JPH10202647A JPH10202647A (en) 1998-08-04
JP2987427B2 true JP2987427B2 (en) 1999-12-06

Family

ID=11692440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9008412A Expired - Lifetime JP2987427B2 (en) 1997-01-21 1997-01-21 Drilling method for zirconium dioxide ceramics

Country Status (1)

Country Link
JP (1) JP2987427B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002137108A (en) * 2000-10-30 2002-05-14 Mmc Kobelco Tool Kk Drilling method for brittle material and drilling tool used therefor
CN103072209B (en) * 2012-12-27 2016-05-18 洛阳金诺机械工程有限公司 One is drawn material equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
道津毅、岳義弘、柳本秀樹、「60kHz高周波振動付加によるSi単結晶の微細加工」、1996年度精密工学会中国四国支部、九州支部共催学術講演会講演論文集、平成8年10月20日発行、P9−10

Also Published As

Publication number Publication date
JPH10202647A (en) 1998-08-04

Similar Documents

Publication Publication Date Title
Egashira et al. Ultrasonic vibration drilling of microholes in glass
US20100212470A1 (en) Disklike cutting tool and cutting device
JPWO2008108463A1 (en) Polishing tool and polishing apparatus
JP2011088216A (en) Ultrasonic tool holder
JPH07100753A (en) Rotary working device, rotary tool therefor and device body therefor
JP4512737B2 (en) Ultrasonic vibration processing equipment
JPH1110420A (en) Static pressure air bearing spindle
JP2987427B2 (en) Drilling method for zirconium dioxide ceramics
JP2820400B2 (en) Drilling method for silicon single crystal
JP2007216372A (en) Ultrasonic excitation unit/ultrasonic excitation table unit/ultrasonic excitation basin unit/ultrasonic excitation horn unit
JPS62140701A (en) Superposed vibration cutting method
JP2008155287A (en) Workpiece grinding device and workpiece grinding method
JP3088537B2 (en) Finishing method and processing device for holes of high hardness material
JPS62292306A (en) Precision vibration boring method
JPS6176261A (en) Ultrasonic machine
JPH10138200A (en) Slicing method and slicing device
JP2007144605A (en) Cutting tool and machining device
JP2003220530A (en) Machining vibration table device with ultrasonic vibration and adsorption function
JPS6362659A (en) Precise finishing method with complex vibration grinding wheel
JP2001205546A (en) Ultrasonic machining tool manufacturing method and ultrasonic machining device
JPH06339847A (en) Work method for circumferential groove in ceramics
JP2008110593A (en) Disk-shaped blade and cutting device
JPH0253519A (en) Thread groove cutting method and device by ultrasonic vibration of interrupted pulse-cutting force waveform
JP2006346843A (en) Disc-like blade and cutting device
JP2010018016A (en) Cutting device and cutting method

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081008

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091008

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091008

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101008

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101008

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111008

Year of fee payment: 12

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313115

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111008

Year of fee payment: 12

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111008

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121008

Year of fee payment: 13

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121008

Year of fee payment: 13

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131008

Year of fee payment: 14

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term