JPH0120035B2 - - Google Patents
Info
- Publication number
- JPH0120035B2 JPH0120035B2 JP60054660A JP5466085A JPH0120035B2 JP H0120035 B2 JPH0120035 B2 JP H0120035B2 JP 60054660 A JP60054660 A JP 60054660A JP 5466085 A JP5466085 A JP 5466085A JP H0120035 B2 JPH0120035 B2 JP H0120035B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- vibration
- frequency
- ceramics
- amplitude
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 47
- 229910003460 diamond Inorganic materials 0.000 claims description 15
- 239000010432 diamond Substances 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Description
【発明の詳細な説明】
（技術分野）
本発明は、セラミツクスをダイヤモンド砥粒群
によつて構成したダイヤモンド工具を切削方向に
振動させ、断続パルス切削力波形によつて精密平
削りあるいは形削りするセラミツクスの精密振動
平面切削方法に関するものである。[Detailed Description of the Invention] (Technical Field) The present invention vibrates a diamond tool made of ceramics with a group of diamond abrasive grains in the cutting direction, and performs precision planing or shaping using an intermittent pulse cutting force waveform. This invention relates to a method for precision vibratory plane cutting of ceramics.
従来特開昭60−44258号公報に示す如く工具に
超音波振動と低周波振動の重畳振動を与えて工作
物の加工を行うことは公知である。 As disclosed in Japanese Unexamined Patent Publication No. 60-44258, it is known to process a workpiece by applying superimposed vibrations of ultrasonic vibration and low frequency vibration to a tool.
（発明が解決しようとする問題点）
ところで上記従来技術でセラミツクスを平面切
削加工すると、ダイヤモンド砥石を高速回転させ
て平面研削加工する場合と比較して切削抵抗は1/
７程度に減少するが、それ以上に切削抵抗を激減
させることは困難であるという問題点があつた。(Problems to be Solved by the Invention) By the way, when ceramics is subjected to surface cutting using the above-mentioned conventional technique, the cutting resistance is 1/1 compared to when surface grinding is performed by rotating a diamond grindstone at high speed.
However, there was a problem in that it was difficult to drastically reduce the cutting resistance further than that.
（問題点を解決するための手段）
本発明は上記問題点を解決することを目的と
し、工具に超音波振動と低周波振動の重畳振動を
与えて工作物を加工する振動切削方法に於て、セ
ラミツクスを縦超音波振動させ、ダイヤモンド工
具を超音波振動数ｆと振巾ａ及び低周波振動数Ｆ
と振巾Ａで切削方向に振動させ乍らＶ＜2πAFの
切削速度で切削し、上記セラミツクスに断続パル
ス切削力波形を作用させて切削することを特徴と
するものである。以下図示した実施例に基づいて
具体的に説明する。(Means for Solving the Problems) The present invention aims to solve the above problems, and provides a vibration cutting method in which a workpiece is machined by applying superimposed vibrations of ultrasonic vibrations and low-frequency vibrations to a tool. , the ceramic is subjected to longitudinal ultrasonic vibration, and the diamond tool is subjected to ultrasonic frequency f, amplitude a, and low frequency frequency F.
The present invention is characterized in that cutting is performed at a cutting speed of V<2πAF while vibrating in the cutting direction with an amplitude A, and cutting is performed by applying an intermittent pulse cutting force waveform to the ceramics. A detailed explanation will be given below based on the illustrated embodiment.
縦振動子１の振幅を拡大する振幅拡大用ホーン
による取付治具２の振幅最大の先端にアルミナ平
板を真空チヤツク機構などによつて着脱できるよ
うにして取付ける。切削力が微少なためこのよう
に真空チヤツク機構の利用ができるのも本発明の
特徴の１つである。 An alumina flat plate is removably attached to the tip of a mounting jig 2 with the maximum amplitude by a vacuum chuck mechanism or the like, using an amplitude-enlarging horn for enlarging the amplitude of the vertical vibrator 1. One of the features of the present invention is that the cutting force is so small that a vacuum chuck mechanism can be used in this way.
取付治具２の振動節には固定板４を取付け、こ
れを利用して固定バイス５に振幅拡大用ホーン取
付治具を、振動数fw、振動awの矢印６が示すその
振動方向が切削速度Ｖの矢印１７が示す切削方向
に対して直角となるようにして取付ける。 A fixed plate 4 is attached to the vibration node of the mounting jig 2, and using this, the horn mounting jig for amplitude expansion is attached to the fixed vise 5 so that the frequency f w and the vibration direction indicated by the arrow 6 of the vibration a w are It is attached so as to be perpendicular to the cutting direction indicated by the arrow 17 of the cutting speed V.
一方、往復運動するテーブル７上には電気−油
圧振動駆動装置で駆動され、摺動面９で正しく切
削方向のみに案内されて振動数Ｆおよび振幅Ａで
振動する低周波駆動装置を設置する。摺動面９に
はＬ金具１０を設け、冷却筒１４を取り付ける。
この冷却筒内に縦振動子１１および先端にダイヤ
モンド砥粒群によつて構成したダイヤモンド工具
を取付けた振幅拡大用ホーン１２を挿入し、その
振動節を利用して固定する。このとき、振動数
ｆ、振幅ａの矢印が示す振動方向と矢印１５の振
動方向とが正しく一致するようにして固定する。 On the other hand, on the reciprocating table 7, there is installed a low frequency drive device which is driven by an electro-hydraulic vibration drive device and vibrates at a frequency F and an amplitude A while being guided correctly only in the cutting direction by the sliding surface 9. An L fitting 10 is provided on the sliding surface 9, and a cooling cylinder 14 is attached.
A vertical vibrator 11 and an amplitude-enlarging horn 12 having a diamond tool made of a group of diamond abrasive grains attached to its tip are inserted into this cooling cylinder and fixed using the vibration nodes. At this time, the vibration direction indicated by the arrow of frequency f and amplitude a and the vibration direction of arrow 15 are fixed so as to correctly match.
このようにした切削装置によつて、Ｖ＜2πAF
の切削速度Ｖで所定の切込みを与えて切削する設
定切込み方式、あるいは一定荷重を与えて切削す
る定荷重方式によつて振動切削することによつて
本発明が実施される。 With this cutting device, V<2πAF
The present invention is carried out by vibration cutting using a set depth of cut method in which a predetermined depth of cut is applied at a cutting speed V of , or a constant load method in which a constant load is applied for cutting.
（効果）
本発明は縦超音波振動ホーン取付治具に取付け
て超音波振動するセラミツクス素材表面をダイヤ
モンド砥粒群によつて構成したダイヤモンド工具
を切削方向に超音波域の高い振動数ｆと振幅ａで
振動させ、さらに低い振動数Ｆと振幅Ａで振動さ
せ、Ｖ＜２πAFの切削速度Ｖによつて切削し、
該セラミツクスに断続パルス切削力波形を作用さ
せて切削するようになつているので切れ味が従来
の方法に比べて画期的に向上することを説明す
る。５mm角のジルコニアの表面を本発明で切削し
たときの切削量を慣用切削と比較して示す。一定
荷重でダイヤンドやすり面に押しつけて切削する
定荷量方式における比較であるから、切削量の大
小で切削力の大小、すなわち切れ味の比較ができ
る。切削条件は、振動数Ｆ：50Hz、振幅Ａ：
0.165mm、振動数ｆ：19.6KHz、振幅ａ：16μｍ、
振動数fw：29.5KHz、振幅aw：8μｍ、荷重：
1.96N、切削速度Ｖ：200mm／min、ダイヤモンド
工具：＃600電着ダイヤモンドやすり、切削時間
６秒である。(Effects) The present invention uses a diamond tool, which is attached to a vertical ultrasonic vibration horn mounting jig and whose surface is made up of diamond abrasive grains on the surface of a ceramic material that vibrates ultrasonically, at a high frequency f and amplitude in the ultrasonic range in the cutting direction. a, vibrate at a lower frequency F and amplitude A, and cut at a cutting speed V of V<2πAF,
It will be explained that since the ceramic is cut by applying an intermittent pulse cutting force waveform, the sharpness is dramatically improved compared to the conventional method. The amount of cutting when cutting a 5 mm square zirconia surface using the present invention is shown in comparison with conventional cutting. Since this is a comparison using a constant load method in which the diamond file is pressed against the surface of a diamond file for cutting with a constant load, it is possible to compare the magnitude of the cutting force, that is, the sharpness, depending on the magnitude of the cutting amount. Cutting conditions are frequency F: 50Hz, amplitude A:
0.165mm, frequency f: 19.6KHz, amplitude a: 16μm,
Frequency fw : 29.5KHz, amplitude aw : 8μm, load:
1.96N, cutting speed V: 200mm/min, diamond tool: #600 electroplated diamond file, cutting time 6 seconds.
荷重のみを与えて６秒間、切削速度200mm／
minで送つただけの慣用切削では切りくずは全然
生成できずに、ダイヤモンドやすりはセラミツク
ス表面を摩擦するのみで切削量はゼロである。こ
れに対して本発明では、白い切りくずを生成して
６秒間の切削時間で５mm角の表面を18μｍ切削す
ることができるという効果を発揮する。慣用切削
と比較して極言すれば無限大という画期的切削効
果が得られる。これは従来のいかなる切削方法に
よつてもなしえなかつた切削効果である。そして
表面全面を一様に端面に欠けや割れを発生させる
ことなく表面粗さ6μｍRmaxをもつて精密切削す
る。 Apply only load for 6 seconds, cutting speed 200mm/
Conventional cutting with only a feed speed of 50 min produces no chips at all, and the diamond file only rubs the ceramic surface, resulting in zero cutting amount. In contrast, the present invention exhibits the effect of producing white chips and being able to cut a 5 mm square surface by 18 μm in a cutting time of 6 seconds. Compared to conventional cutting, the cutting effect can be infinitely improved. This is a cutting effect that could not be achieved by any conventional cutting method. Then, the entire surface is precisely cut uniformly to a surface roughness of 6 μm Rmax without causing any chips or cracks on the end face.
設定切込みの場合、40mm角、厚さ１mmのアルミ
ナ平板表面を0.005〜0.01mmの切込みを与えてワ
ンストロークで全面を一様に切削でき、6μｍＲ
ｍaxの表面粗さとし、その平面度を2μｍ以内と
する量産加工にも成功した。又、特開昭60−
44258号公報に示された超音波振動と低周波振動
の重畳振動加工と比較した場合、切削抵抗をその
１／５に激減することができた。 In the case of the set depth of cut, the surface of a 40mm square, 1mm thick alumina flat plate can be uniformly cut with a single stroke of 0.005 to 0.01mm, and the entire surface can be cut uniformly with a radius of 6μm.
We have succeeded in mass production processing with maximum surface roughness and flatness within 2μm. Also, JP-A-60-
When compared with the superimposed vibration machining of ultrasonic vibration and low frequency vibration shown in Publication No. 44258, the cutting resistance could be drastically reduced to 1/5 of that.
図は本発明の一実施例正面図である。
３……セラミツクス、１５……低周波振動、１
６……超音波振動、１……振動子、１３……ダイ
ヤモンド工具、８……電気−油圧振動駆動装置。
The figure is a front view of one embodiment of the present invention. 3...Ceramics, 15...Low frequency vibration, 1
6... Ultrasonic vibration, 1... Vibrator, 13... Diamond tool, 8... Electric-hydraulic vibration drive device.
Claims (1)
与えて工作物を加工する振動切削方法に於て、セ
ラミツクスを縦超音波振動させ、ダイヤモンド工
具を超音波振動数ｆと振巾ａ及び低周波振動数Ｆ
と振巾Ａで切削方向に振動させ乍らＶ＜2πAFの
切削速度で切削し、上記セラミツクスに断続パル
ス切削力波形を作用させて切削するセラミツクス
の精密振動平面切削方法。1 In a vibration cutting method in which a workpiece is machined by applying superimposed vibrations of ultrasonic vibration and low-frequency vibration to a tool, ceramics are subjected to longitudinal ultrasonic vibration, and a diamond tool is subjected to ultrasonic frequency f, amplitude a, and low frequency vibration. Frequency frequency F
A method for precision vibratory plane cutting of ceramics, in which the ceramics are vibrated in the cutting direction with an amplitude of A and cutting is performed at a cutting speed of V<2πAF, and the ceramics are cut by applying an intermittent pulse cutting force waveform to the ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5466085A JPS61214963A (en) | 1985-03-20 | 1985-03-20 | Method for precise cutting of vibrating plane of ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5466085A JPS61214963A (en) | 1985-03-20 | 1985-03-20 | Method for precise cutting of vibrating plane of ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61214963A JPS61214963A (en) | 1986-09-24 |
| JPH0120035B2 true JPH0120035B2 (en) | 1989-04-13 |
Family
ID=12976942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5466085A Granted JPS61214963A (en) | 1985-03-20 | 1985-03-20 | Method for precise cutting of vibrating plane of ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61214963A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005044509A1 (en) * | 2003-11-06 | 2005-05-19 | Kazumasa Ohnishi | Vibration table |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63278751A (en) * | 1987-05-11 | 1988-11-16 | Brother Ind Ltd | Oscillated machining method and device therefor |
| JPS6427851A (en) * | 1987-07-24 | 1989-01-30 | Toyota Motor Corp | Oscillation finish processing method for high hardness material |
| JP5352892B2 (en) * | 2008-02-22 | 2013-11-27 | 独立行政法人国立高等専門学校機構 | Grinding method and grinding apparatus |
| CN107363715A (en) * | 2017-08-29 | 2017-11-21 | 无为县鑫品石业有限公司 | A kind of lapping device for marble ceramic tile surface |
| CN109388103B (en) * | 2018-09-26 | 2020-06-19 | 汇专科技集团股份有限公司 | Ultrasonic generator control method, system, computer device and storage medium |
| CN111659959A (en) * | 2020-06-23 | 2020-09-15 | 中国工程物理研究院激光聚变研究中心 | High-low frequency composite vibration processing device and method for hard and brittle materials |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6044258A (en) * | 1983-08-17 | 1985-03-09 | Pilot Pen Co Ltd:The | Vibrative tool machining device |
-
1985
- 1985-03-20 JP JP5466085A patent/JPS61214963A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6044258A (en) * | 1983-08-17 | 1985-03-09 | Pilot Pen Co Ltd:The | Vibrative tool machining device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005044509A1 (en) * | 2003-11-06 | 2005-05-19 | Kazumasa Ohnishi | Vibration table |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61214963A (en) | 1986-09-24 |
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