JP2003188206A5 - - Google Patents

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Publication number
JP2003188206A5
JP2003188206A5 JP2001387503A JP2001387503A JP2003188206A5 JP 2003188206 A5 JP2003188206 A5 JP 2003188206A5 JP 2001387503 A JP2001387503 A JP 2001387503A JP 2001387503 A JP2001387503 A JP 2001387503A JP 2003188206 A5 JP2003188206 A5 JP 2003188206A5
Authority
JP
Japan
Prior art keywords
package
substrate
electrode
metal frame
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001387503A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003188206A (ja
JP3638901B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001387503A priority Critical patent/JP3638901B2/ja
Priority claimed from JP2001387503A external-priority patent/JP3638901B2/ja
Publication of JP2003188206A publication Critical patent/JP2003188206A/ja
Publication of JP2003188206A5 publication Critical patent/JP2003188206A5/ja
Application granted granted Critical
Publication of JP3638901B2 publication Critical patent/JP3638901B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2001387503A 2001-12-20 2001-12-20 半導体装置用パッケージ Expired - Fee Related JP3638901B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001387503A JP3638901B2 (ja) 2001-12-20 2001-12-20 半導体装置用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001387503A JP3638901B2 (ja) 2001-12-20 2001-12-20 半導体装置用パッケージ

Publications (3)

Publication Number Publication Date
JP2003188206A JP2003188206A (ja) 2003-07-04
JP2003188206A5 true JP2003188206A5 (enExample) 2004-11-11
JP3638901B2 JP3638901B2 (ja) 2005-04-13

Family

ID=27596310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001387503A Expired - Fee Related JP3638901B2 (ja) 2001-12-20 2001-12-20 半導体装置用パッケージ

Country Status (1)

Country Link
JP (1) JP3638901B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110494963B (zh) * 2017-03-29 2023-06-13 三菱电机株式会社 中空封装器件及其制造方法

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