JP2005101438A5 - - Google Patents
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- Publication number
- JP2005101438A5 JP2005101438A5 JP2003335282A JP2003335282A JP2005101438A5 JP 2005101438 A5 JP2005101438 A5 JP 2005101438A5 JP 2003335282 A JP2003335282 A JP 2003335282A JP 2003335282 A JP2003335282 A JP 2003335282A JP 2005101438 A5 JP2005101438 A5 JP 2005101438A5
- Authority
- JP
- Japan
- Prior art keywords
- hole
- ceramic substrate
- plating film
- metallized plating
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims 9
- 238000007747 plating Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 8
- 230000005611 electricity Effects 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003335282A JP2005101438A (ja) | 2003-09-26 | 2003-09-26 | 封止パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003335282A JP2005101438A (ja) | 2003-09-26 | 2003-09-26 | 封止パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005101438A JP2005101438A (ja) | 2005-04-14 |
| JP2005101438A5 true JP2005101438A5 (enExample) | 2006-05-25 |
Family
ID=34462698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003335282A Pending JP2005101438A (ja) | 2003-09-26 | 2003-09-26 | 封止パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005101438A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109494198A (zh) * | 2018-12-05 | 2019-03-19 | 河北中瓷电子科技有限公司 | 陶瓷封装外壳制备方法及陶瓷封装外壳 |
-
2003
- 2003-09-26 JP JP2003335282A patent/JP2005101438A/ja active Pending
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